公开(公告)号：US09359517B2

公开(公告)日：2016-06-07

申请号：US14514463

申请日：2014-10-15

Applicant: Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

Inventor： Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09D11/38 ,  C09D179/08 ,  C09D179/02 ,  C09D179/04 ,  C09D133/14

CPC classification number: C09D11/38 ,  C08K9/02 ,  C09D4/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/101 ,  C09D11/52 ,  C09D133/14 ,  C09D179/02 ,  C09D179/04 ,  C09D179/08 ,  H05K1/095 ,  H05K3/185 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2203/0709 ,  C08F222/10

Abstract: A non-aqueous composition contains dispersed carbon-coated metal particles in an organic diluent in an amount of at least 10 weight %. The dispersed carbon-coated metal particles have a median diameter equal to or less than 0.6 μm, and are dispersed using a particle dispersing agent that has a weight average molecular weight (Mw) of at least 2,000 and up to and including 100,000 and comprises nitrogen-containing units. The median diameter of the dispersed particles is determined using a dynamic light scattering method. Moreover, when the non-aqueous composition contains up to and including 25 weight % of the dispersed carbon-coated metal particles, it exhibits no visual settling when subjected to a settling test of at least 24 hours at 20° C. Such non-aqueous compositions can include photocurable components and are useful to prepare photocurable and photocured electrically-conductive patterns and layers in various articles, including touch screen devices having touch screen displays.

Abstract translation: 非水性组合物在有机稀释剂中含有至少10重量％的分散的碳涂覆的金属颗粒。 分散的碳涂覆的金属颗粒的中值直径等于或小于0.6μm，并且使用重均分子量（Mw）至少为2,000且至多并包括100,000的颗粒分散剂分散，并且包含氮 包含单位。 使用动态光散射法测定分散颗粒的中值粒径。 此外，当非水性组合物含有至多且包含25重量％的分散的碳涂覆的金属颗粒时，当在20℃进行至少24小时的沉降试验时，其表现出没有视觉沉降。这种非水性 组合物可以包括光固化组分，并且可用于制备各种制品中的光固化和光固化导电图案和层，包括具有触摸屏显示器的触摸屏装置。

公开(公告)号：US09320145B2

公开(公告)日：2016-04-19

申请号：US13822754

申请日：2011-09-13

Applicant: David Thomas Britton ,  Margit Harting

Inventor： David Thomas Britton ,  Margit Harting

IPC: H05K7/00 ,  H05K1/16 ,  H01G11/48 ,  H01G11/28

CPC classification number: H05K1/16 ,  H01C1/02 ,  H01C7/008 ,  H01G2/10 ,  H01G11/28 ,  H01G11/48 ,  H01G11/82 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/162 ,  H05K1/167 ,  H05K3/12 ,  H05K3/281 ,  H05K3/4015 ,  H05K2201/0323 ,  H05K2201/10287 ,  H05K2203/0278 ,  Y02E60/13

Abstract: An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.

Abstract translation: 电子部件组件包括印刷部件结构，其包括沉积到基板上的半导体油墨，绝缘油墨和导电油墨中的至少一种。 所述部件结构限定至少一个接触区域，其中连接引线设置成抵靠或邻近所述接触区域。 至少一层电绝缘材料包围组件结构。 衬底和电绝缘材料层中的至少一个包括包装材料。 组件结构可以印刷在诸如纸或其他软材料的基板上，该材料固定到诸如聚乙烯的绝缘包装材料层上。 相反，衬底可以是绝缘包装材料本身。 使用硬质和软性衬底的变型是可能的，并且公开了电子部件组装的各种示例。

公开(公告)号：US20160095201A1

公开(公告)日：2016-03-31

申请号：US14849880

申请日：2015-09-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hong MIN ,  Myung Sam KANG ,  Jin Hyuk JANG ,  Young Gwan KO

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01L21/4882 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/0323

Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.

Abstract translation: 电路板包括包括石墨或石墨烯的第一传热结构，其中第一传热结构的至少一部分设置在绝缘构件的内部，底漆层设置在第一传热结构的表面上。 第一传热结构可以包括多个单体，所述单体包括设置在至少一层石墨或石墨烯的至少一个表面上的底漆层。

公开(公告)号：US09295152B2

公开(公告)日：2016-03-22

申请号：US14686548

申请日：2015-04-14

Applicant: Bradford B. Pate ,  Matthew P. Ray ,  Jeffrey W. Baldwin

Inventor： Bradford B. Pate ,  Matthew P. Ray ,  Jeffrey W. Baldwin

IPC: H01L29/15 ,  H05K1/09 ,  H05K3/46 ,  H01L29/16 ,  B23K26/00 ,  B23K26/06 ,  B23K26/36 ,  B23K26/40 ,  C30B29/04 ,  C30B33/02 ,  H01L23/373 ,  H05K3/00

CPC classification number: H05K1/09 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/38 ,  B23K2101/40 ,  B23K2103/50 ,  C30B29/04 ,  C30B33/02 ,  H01L23/3732 ,  H01L29/1602 ,  H01L29/1608 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K3/0029 ,  H05K3/4602 ,  H05K2201/0323 ,  Y10S438/931 ,  Y10T428/265 ,  Y10T428/30

Abstract: A device comprising a single crystal diamond substrate with a buried electrically conducting layer with μm square openings spaced apart milled into the diamond by ablating the carbon above wherein the step of ablating uses a diode pumped tripled Nd:YAG laser at 355 nm and wherein the square openings have electrical contacts and wherein the resistance measured between the square openings is dominated by the buried electrically conducting layer and on the order of about 1 kΩ.

Abstract translation: 一种包括具有埋入导电层的单晶金刚石衬底的器件，其具有通过烧蚀上述碳而间隔开成菱形的埋入导电层，其中烧蚀步骤使用二极管泵浦三倍的Nd：YAG激光器在355nm处，并且其中正方形 开口具有电接触，并且其中在正方形开口之间测量的电阻由埋入的导电层和大约1kΩ的量级组成。

公开(公告)号：US20160057854A1

公开(公告)日：2016-02-25

申请号：US14464656

申请日：2014-08-20

Applicant: Stablcor Technology, Inc.

Inventor： Douglas Schneider ,  William E. Davis

IPC: H05K1/02 ,  H05K1/03 ,  F28F21/08 ,  B32B5/16 ,  F28F21/02 ,  H05K1/11 ,  B32B9/00

CPC classification number: B32B5/16 ,  B32B3/08 ,  B32B5/024 ,  B32B5/30 ,  B32B9/007 ,  B32B9/045 ,  B32B15/20 ,  B32B27/08 ,  B32B27/14 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/412 ,  B32B2457/08 ,  H01L2224/16225 ,  H05K1/0207 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0245 ,  H05K2201/0323

Abstract: Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer.

Abstract translation: 根据本发明的实施例的系统和方法实现了基于石墨烯的热管理核心和包含基于石墨烯的热管理核心的印刷线路板。 在一个实施例中，基于石墨烯的热管理核心包括：包括至少一片石墨烯的层; 第一加强层; 和第二加强层; 其中包括至少一片石墨烯的层设置在第一加强层和第二加强层之间。

公开(公告)号：US20160050757A1

公开(公告)日：2016-02-18

申请号：US13865841

申请日：2013-04-18

Applicant: Brewer Science Inc.

Inventor： Liyong Diao ,  Wu-Sheng Shih ,  James E. Lamb III ,  Christopher Landorf

IPC: H05K1/16 ,  H01F27/28 ,  H05K1/03 ,  H01G4/008 ,  H01G4/14

CPC classification number: H05K1/162 ,  H01F5/003 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/14 ,  H01G4/40 ,  H05K1/0313 ,  H05K1/097 ,  H05K1/165 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.

Abstract translation: 本发明提供了完全无源的新颖的电路，它们由基片上的导电级碳纳米管（CNT）制成，最好是柔性基片。 这些组分和结构不包含传统的电子材料如硅，金属氧化物或陶瓷，它们是完全有机的。 它们可用于传感器的谐振频率和振幅可以通过热，机械或化学信号（如温度，应变，压力，振动或湿度）进行调制的应用场合。 全有机的，因此可燃的无源射频传感器具有独特的防御和消费行业应用。

公开(公告)号：US09253878B2

公开(公告)日：2016-02-02

申请号：US14226130

申请日：2014-03-26

Applicant: TOKAI RUBBER INDUSTRIES, LTD.

Inventor： Jun Kobayashi ,  Hitoshi Yoshikawa

IPC: H05K1/00 ,  H05K1/02 ,  C09D11/02 ,  C08K3/04 ,  C08K7/06 ,  C08L21/00 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K9/00

CPC classification number: H05K1/028 ,  C08K3/04 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/001 ,  C08L21/00 ,  C09D5/24 ,  C09D7/70 ,  C09D11/02 ,  C09D11/52 ,  H01B1/24 ,  H05K1/0283 ,  H05K1/095 ,  H05K1/11 ,  H05K9/0083 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323 ,  Y10T428/31663 ,  Y10T428/31935

Abstract: Provided is a conductive composition that has a high conductivity and from which a coating can be formed easily. Also provided is a conductive film that has a high conductivity and in which electric resistance is less likely to increase even during expansion. A conductive composition is prepared by including an elastomer component, a fibrous carbon material having a graphite structure and a fiber diameter of not less than 30 nm, and a conductive carbon black having a structure. A conductive film formed from the conductive composition. The viscosity of the conductive composition formed into a coating with a solid content concentration of not less than 20% by mass, which is measured with a B-type viscometer with an H7 rotor under the conditions of a temperature of 25° C. and a rotation speed of 20 rpm, is not more than 200 Pa·s.

Abstract translation: 提供一种导电组合物，其具有高导电性，并且可以容易地形成涂层。 还提供了导电膜，其具有高导电性，并且即使在膨胀期间电阻也不太可能增加。 通过包括弹性体组分，具有石墨结构的纤维状碳材料和不小于30nm的纤维直径的导电组合物和具有结构的导电炭黑制备导电组合物。 由导电组合物形成的导电膜。 形成为固体成分浓度为20质量％以上的涂料的导电性组合物的粘度，其用温度为25℃的条件下的H7转子的B型粘度计和 转速为20rpm，为200Pa·s以下。

公开(公告)号：US20150357078A1

公开(公告)日：2015-12-10

申请号：US14732302

申请日：2015-06-05

Applicant: President and Fellows of Harvard College

Inventor： Joshua Aaron LESSING ,  Stephen A. MORIN ,  George M. WHITESIDES

IPC: H01B1/24 ,  H01F7/02 ,  H01H36/00 ,  B29C39/18 ,  H05K1/02 ,  G01L1/22 ,  H01B1/22 ,  H01H1/021 ,  H01R13/52

CPC classification number: H01B1/24 ,  B29C39/18 ,  B29K2305/00 ,  B29K2305/12 ,  B29K2307/04 ,  G01L1/20 ,  G01L1/2287 ,  H01B1/22 ,  H01F7/02 ,  H01H1/021 ,  H01H36/00 ,  H01R13/52 ,  H01R43/007 ,  H05K1/0283 ,  H05K1/0287 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323

Abstract: An elastically-deformable, conductive composite using elastomers and conductive fibers and simple fabrication procedures is provided. Conductive elastomeric composites offer low resistance to electrical current and are elastic over large (>25%) extensional strains. They can be easily interfaced/built into structures fabricated from elastomeric polymers.

Abstract translation: 提供了使用弹性体和导电纤维的可弹性变形的导电复合材料和简单的制造程序。 导电弹性体复合材料具有低电阻率，并且在大（> 25％）拉伸应变下具有弹性。 它们可以容易地与弹性体聚合物制成的结构相互连接或内置。

公开(公告)号：US09210806B2

公开(公告)日：2015-12-08

申请号：US13356976

申请日：2012-01-24

Applicant: Joel S. Douglas

Inventor： Joel S. Douglas

IPC: H01B1/04 ,  H01B1/06 ,  H05K1/09 ,  H01B1/24 ,  B82Y10/00 ,  B82Y30/00 ,  H05K3/36 ,  H05K3/24 ,  H05K3/32

CPC classification number: H05K1/095 ,  B82Y10/00 ,  B82Y30/00 ,  H01B1/24 ,  H05K3/245 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0285

Abstract: A bondable conductive ink comprising carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, a polymer, and a solvent, and a method of producing this bondable conductive ink. The ink is highly suitable for producing circuit assemblies having non-conductive substrates upon which printed conductors, formed from the bondable conductive ink, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Abstract translation: 包含碳纳米管的可粘合导电油墨，具有至少一个尺寸至少为100纳米的不是碳纳米管的尺寸较大直径的导电颗粒，聚合物和溶剂，以及制造该可结合导电油墨的方法。 油墨非常适合于制造具有非导电基底的电路组件，由导电基底形成的印刷导体可以容易且选择性地互连到另一个电路组件装置和/或设备。

公开(公告)号：US20150342043A1

公开(公告)日：2015-11-26

申请号：US14410283

申请日：2013-06-21

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： Christopher Dennis Simone ,  Sidney G. Cox ,  Carl Robert Haeger ,  Richard A. Wessel

IPC: H05K1/05 ,  C08G73/10 ,  H01B3/30

CPC classification number: H05K1/056 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/4026 ,  B32B2457/00 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  H01B3/306 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2201/0323 ,  Y10T428/24851 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/31681

Abstract: The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay comprising a polyimide derived from 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine. An adhesive layer is not present between the first imaged metal layer and the first polyimide coverlay.

Abstract translation: 本公开涉及具有第一电绝缘层，第一成像金属层和第一聚酰亚胺覆盖层的电路板，所述第一聚酰亚胺覆盖层包含衍生自80至90摩尔％3,3'，4,4'-联苯四羧酸二酐的聚酰亚胺， 10〜20摩尔％4,4'-氧联二邻苯二甲酸酐和100摩尔％2,2'-双（三氟甲基）联苯胺。 在第一成像金属层和第一聚酰亚胺覆盖层之间不存在粘合剂层。