公开(公告)号：US11929207B2

公开(公告)日：2024-03-12

申请号：US17567655

申请日：2022-01-03

Applicant: SK hynix Inc.

Inventor： Seung-Muk Kim

IPC: H01G4/10 ,  H01G4/008 ,  H01G4/14

CPC classification number: H01G4/10 ,  H01G4/008 ,  H01G4/14

Abstract: A capacitor includes: a plurality of bottom electrodes; a dielectric layer formed over the bottom electrodes; and a top electrode formed over the dielectric layer, wherein the top electrode includes a carbon-containing material and a germanium-containing material that fill a gap between the bottom electrodes.

公开(公告)号：US11926730B2

公开(公告)日：2024-03-12

申请号：US18301895

申请日：2023-04-17

Applicant: Oji Holdings Corporation

Inventor： Tatsuji Ishida ,  Yoshimune Okuyama ,  Masahiro Nakata ,  Tadakazu Ishiwata

IPC: C08L23/12 ,  C08J5/18 ,  H01G4/14 ,  H01G4/32 ,  C23C14/20

CPC classification number: C08L23/12 ,  C08J5/18 ,  H01G4/14 ,  H01G4/32 ,  C08J2323/12 ,  C08J2423/12 ,  C23C14/20

Abstract: A polypropylene film which is capable of suppressing blocking in a rolled polypropylene film. The polypropylene film has a first surface and a second surface, contains a polypropylene resin as a main component, and is configured such that: the Svk value (SvkA) of the first surface is 0.005 μm or more and 0.030 μm or less; the Spk value (SpkA) of the first surface is more than 0.035 μm and 0.080 μm or less; the Svk value (SvkB) of the second surface is 0.005 μm or more and 0.030 μm or less; and the Spk value (SpkB) of the second surface is 0.015 μm or more and 0.035 μm or less.

公开(公告)号：US20230238181A1

公开(公告)日：2023-07-27

申请号：US18130630

申请日：2023-04-04

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Ryuji ISHIZUKA ,  Yoshihiro YONEDA ,  Toshihiro HOSOI ,  Yuji KAGEYAMA

IPC: H01G4/14 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  H01G4/008

CPC classification number: H01G4/14 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  H01G4/008 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/204 ,  B32B2307/732 ,  B32B2457/16 ,  H01G4/35

Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

公开(公告)号：US10037850B2

公开(公告)日：2018-07-31

申请号：US14574780

申请日：2014-12-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Timothy J. Nevitt ,  Onur S. Yordem ,  David T. Yust ,  Charles D. Hoyle

IPC: H01G4/30 ,  B29C37/00 ,  B29C47/06 ,  H01G4/005 ,  H01G4/14 ,  H01G4/228 ,  H01G4/33 ,  H01L21/8234 ,  B29C47/56 ,  B32B27/00 ,  B32B7/02 ,  B32B27/08 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B3/08 ,  B29K23/00 ,  B29K105/16 ,  B29K507/04 ,  B29L9/00 ,  B29L31/34

CPC classification number: H01G4/30 ,  B29C37/0025 ,  B29C48/21 ,  B29C48/49 ,  B29K2023/12 ,  B29K2105/16 ,  B29K2507/04 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2009/003 ,  B29L2009/005 ,  B29L2031/34 ,  B32B3/08 ,  B32B7/02 ,  B32B27/00 ,  B32B27/08 ,  B32B27/28 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2262/106 ,  B32B2264/105 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/518 ,  B32B2307/732 ,  B32B2457/16 ,  H01G4/005 ,  H01G4/14 ,  H01G4/20 ,  H01G4/206 ,  H01G4/228 ,  H01G4/33 ,  H01L21/823412 ,  H01L21/823431 ,  H01L21/823475 ,  H01L21/823493

Abstract: A multilayer film capacitor having a composite stack disposed between two electrodes where the composite stack includes at least one thermoplastic conductive layer and at least one thermoplastic insulating layer. The total thickness of the conductive layers is at least 3 times the total thickness of the insulating layers. The conductive layers may include a thermoplastic polymer blended with conductive particles at a concentration higher than a percolation threshold.

公开(公告)号：US20180204679A1

公开(公告)日：2018-07-19

申请号：US15875386

申请日：2018-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan KWAK ,  Hyun Sik KIM ,  Jong Wook ROH ,  Kyoung-Seok MOON ,  Hyeon Cheol PARK ,  Yoon Chul SON ,  Daejin YANG ,  Doh Won JUNG ,  Youngjin CHO

IPC: H01G4/30 ,  H01G4/14

CPC classification number: H01G4/30 ,  C04B35/47 ,  C04B35/62805 ,  C04B35/62815 ,  C04B2235/3201 ,  C04B2235/3208 ,  C04B2235/3251 ,  C04B2235/3255 ,  C04B2235/6582 ,  C04B2235/6588 ,  C04B2235/781 ,  C04B2235/79 ,  C04B2235/85 ,  C04B2237/346 ,  C04B2237/68 ,  H01C7/008 ,  H01C7/1006 ,  H01C7/18 ,  H01C17/06533 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/1245 ,  H01G4/14 ,  H01G4/232 ,  H01G4/248

Abstract: A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic device including the same.

公开(公告)号：US20180190433A1

公开(公告)日：2018-07-05

申请号：US15696959

申请日：2017-09-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hyun CHO ,  Byeong Chan KWON ,  Yong Jin YUN ,  Ki Pyo HONG ,  Jae Yeol CHOI

IPC: H01G4/248 ,  H01G4/30

CPC classification number: H01G4/232 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/14 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G13/006

Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.

公开(公告)号：US10008328B2

公开(公告)日：2018-06-26

申请号：US14688402

申请日：2015-04-16

Applicant: DuPont Teijin Films U.S. Limited Partnership

Inventor： Alexis Grosrenaud ,  Lucien Schosseler

IPC: H01G4/14 ,  C08J5/18 ,  C08L67/02 ,  C08L69/00 ,  H01G4/18 ,  H01B3/42

CPC classification number: H01G4/14 ,  C08J5/18 ,  C08J2367/02 ,  C08J2367/03 ,  C08J2369/00 ,  C08L67/02 ,  C08L69/00 ,  H01B3/423 ,  H01B3/426 ,  H01G4/18 ,  Y02T10/7022 ,  Y10T29/435 ,  C08L2666/18

Abstract: A stretched film includes a dispersion of at least one polyester and/or polycarbonate in a matrix of at least one polyester and/or polycarbonate different from the first polyester and/or polycarbonate, the percentage by weight of the dispersed polyester and/or polycarbonate in the dispersion being less than 50% and the dispersed polyester and/or polycarbonate being in the form of platelets. The stretched film can be used as a dielectric in a capacitor.

公开(公告)号：US20180148574A1

公开(公告)日：2018-05-31

申请号：US15580211

申请日：2016-06-10

Applicant: KYOCERA Corporation

Inventor： Kouki OKAMURA ,  Kazuki IMAGAWA

IPC: C08L71/12 ,  C08L67/02 ,  C08J5/18 ,  H02P27/06 ,  H02M7/5387 ,  H01G4/33 ,  H01G4/228 ,  H01G4/38 ,  H01G4/40 ,  H01G4/14 ,  B60L11/18

CPC classification number: C08L71/123 ,  B60L50/51 ,  B60L2210/40 ,  C08G65/002 ,  C08J5/18 ,  C08J2367/02 ,  C08J2371/12 ,  C08J2467/02 ,  C08J2471/12 ,  C08L67/02 ,  C08L71/12 ,  C08L2203/20 ,  H01G4/14 ,  H01G4/18 ,  H01G4/228 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H02M7/48 ,  H02M7/5387 ,  H02P27/06

Abstract: A composite resin material including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase, the other one thereof being present within the continuous phase, as organic resin particles having an average particle diameter of 1 μm or less.

公开(公告)号：US20180114641A1

公开(公告)日：2018-04-26

申请号：US15782752

申请日：2017-10-12

Applicant: Capacitor Sciences Incorporated

Inventor： Pavel Ivan Lazarev

IPC: H01G4/14 ,  H01G4/08 ,  H01G4/228

CPC classification number: H01G4/14 ,  H01G4/08 ,  H01G4/18 ,  H01G4/228 ,  H01G4/30 ,  H01G4/32

Abstract: The present disclosure provides solid multilayer structure having m polarization layers, and m+1 insulating layers disposed in a repeating sequence with the polarization layers, At least one polarization layer is comprised of materials selected from non-linear polarizable composite compounds and side chain polymers with non-linear polarizable pendants, and m is a number greater than or equal to 1. The insulating layer has a breakdown voltage greater than or equal to 0.01 volts (V) per nanometer (nm), and the polarization layer has a dielectric permittivity greater than or equal to 100. The solid multilayer structure may be used as a dielectric layer between two electrodes in capacitor.

公开(公告)号：US09932420B2

公开(公告)日：2018-04-03

申请号：US15013004

申请日：2016-02-02

Applicant: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY—U.S. ARMY RESEARCH LABORATORY

Inventor： Janet Sau-Han Ho

IPC: C08F2/46 ,  C08G61/04 ,  C08F14/22 ,  C08J7/12 ,  H01B3/44 ,  H01G4/14

CPC classification number: C08F14/22 ,  C08J7/12 ,  C08J7/123 ,  C08J2327/16 ,  H01B3/445 ,  H01G4/14 ,  H01G4/186 ,  H01G4/32

Abstract: Modified fluoropolymers, and methods for manufacturing modified fluoropolymers are provided. According to at least one embodiment, chemically modified fluoropolymers, via radical generation and subsequent reaction, produce fluoropolymers having fluorinated moieties and/or non-fluorinated moieties, disrupting highly coherent polar domains, wherein the non-fluorinated moieties include, for example, at least one of carbonyl, hydroxyl, alkoxy, alkyl, and/or aromatic chemical groups.