DOUBLE-SIDED COPPER-CLAD LAMINATE

    公开(公告)号:US20220351906A1

    公开(公告)日:2022-11-03

    申请号:US17770411

    申请日:2021-06-04

    Abstract: There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

    MULTILAYER LAMINATE AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD USING SAME

    公开(公告)号:US20190110364A1

    公开(公告)日:2019-04-11

    申请号:US16082393

    申请日:2017-02-03

    Inventor: Yoshihiro YONEDA

    Abstract: A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

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