公开(公告)号：US20200008298A1

公开(公告)日：2020-01-02

申请号：US16493531

申请日：2018-03-09

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Yoshihiro YONEDA ,  Toshifumi MATSUSHIMA ,  Toshihiro HOSOI ,  Kenshiro FUKUDA

IPC: H05K1/03 ,  C08L63/04 ,  C08L77/00 ,  H05K1/09 ,  H05K1/16 ,  H01G4/12 ,  H01G4/14 ,  B32B15/04 ,  B32B15/20

Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

公开(公告)号：US20170071059A1

公开(公告)日：2017-03-09

申请号：US15122515

申请日：2015-05-27

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Toshifumi MATSUSHIMA ,  Ayumu TATEOKA ,  Fujio KUWAKO ,  Shigeru ITABASHI

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/46 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K1/09 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C09D123/0853 ,  H05K1/0298 ,  H05K3/46 ,  H05K3/4682

Abstract: There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.

Abstract translation: 在金属箔的至少一个表面上设置有包含金属箔和可剥离树脂层的金属箔可剥离树脂层复合物，其中可剥离树脂层总共包含（A）50 至95质量份的非极性树脂，（B）4〜40质量份的热固性树脂，（C）1〜25质量份的脱模剂，其中，所述脱模剂的质量比（A / B） 非极性树脂（A）与热固性树脂（B）的比例为55/45至96/4。 金属箔可剥离树脂层复合物可以在金属箔和可剥离树脂层之间具有显着低的剥离强度的释放，而不会损坏可剥离的树脂层并且可以承受热压。

公开(公告)号：US20160330839A1

公开(公告)日：2016-11-10

申请号：US15111305

申请日：2015-02-20

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Fujio KUWAKO ,  Toshifumi MATSUSHIMA ,  Toshihiro HOSOI

IPC: H05K1/16 ,  H05K3/42 ,  H05K1/09 ,  B32B15/20 ,  H05K3/00 ,  H05K3/02 ,  H05K1/11 ,  B32B15/04 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/162 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/51 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/16 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09763

Abstract: Object is to provide a material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. To achieve the object, copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the Young's modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract translation: 目的是提供一种用于形成电容器层的材料，其在嵌入电容器电路的高度多层印刷线路板的制造中在电容器的电介质层上不产生裂纹。 为了实现该目的，为了形成具有在内层中具有电容器/铜层的铜层/电介质层的层结构的嵌入式电容电路的多层印刷布线板的嵌入式电容器层的覆铜层压板，其特征在于， 构成电容器的厚度方向的电介质层的树脂膜的杨氏模量Er小于6.1GPa。

公开(公告)号：US20210029823A1

公开(公告)日：2021-01-28

申请号：US17042484

申请日：2019-03-07

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Toshihiro HOSOI ,  Toshifumi MATSUSHIMA

IPC: H05K1/03 ,  H05K3/02 ,  H05K1/09 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20

Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 μm or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, δa, is equal to or less than that of the resin layer, δr.

公开(公告)号：US20180332721A1

公开(公告)日：2018-11-15

申请号：US15773373

申请日：2016-11-18

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： Toshiyuki SHIMIZU ,  Toshifumi MATSUSHIMA ,  Yoshihiro YONEDA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4652 ,  B32B15/08 ,  B32B37/26 ,  B32B2037/268 ,  B32B2307/204 ,  B32B2457/08 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/4623 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/0156

Abstract: A production method includes: preparing a metal clad laminate including a dielectric layer ≤30 μm thick, a first metal foil on a first surface of the dielectric layer, a second metal foil on a second surface of the dielectric layer, first and second carriers on the metal foil via a releasable layer; arranging the pair of metal clad laminates on a resin substrate so the first carrier of each metal clad laminate faces the resin substrate on each surface of the resin substrate; releasing the second carrier from a laminated member to expose the second metal foil; forming a pattern on the second metal foil; arranging an insulating layer on the pattern and arranging a metal layer on the insulating layer; and separating the first carrier and the first metal foil from each other. The dielectric layer has a strain energy at break of 1.8 MJ or less.

公开(公告)号：US20180206345A1

公开(公告)日：2018-07-19

申请号：US15743466

申请日：2016-07-08

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Yoshihiro YONEDA ,  Toshifumi MATSUSHIMA ,  Toshihiro HOSOI ,  Fujio KUWAKO

IPC: H05K3/38 ,  H05K1/03 ,  H05K3/02 ,  H05K3/06

CPC classification number: H05K3/386 ,  B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/06 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/0278

Abstract: There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.

公开(公告)号：US20180160536A1

公开(公告)日：2018-06-07

申请号：US15891903

申请日：2018-02-08

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Fujio KUWAKO ,  Toshifumi MATSUSHIMA ,  Toshihiro HOSOI

IPC: H05K1/16 ,  H05K3/46 ,  B32B15/04 ,  B32B15/20 ,  H05K1/02 ,  H05K1/09 ,  B32B15/00 ,  H05K3/42 ,  H05K3/02 ,  H05K3/00 ,  H05K1/11

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

公开(公告)号：US20160360624A1

公开(公告)日：2016-12-08

申请号：US15111315

申请日：2015-02-19

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Fujio KUWAKO ,  Toshifumi MATSUSHIMA ,  Toshihiro HOSOI ,  Ayumu TATEOKA

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/42 ,  H05K3/02 ,  H05K1/09

CPC classification number: H05K3/4626 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/022 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09645

Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.

Abstract translation: 本发明的目的是提供一种多层印刷电路板，其设置有通孔形成性优良的共通孔和用于提供导电隔离部分的通孔周围的内层布线的共通孔。 为了实现该目的，“覆铜层压板设置有用于制造具有电隔离通孔的导电隔离部分的印刷线路板的保护层的铜包覆层压板，其特征在于，覆铜层压板设置有保护层 在形成用于提供导电隔离部分的通孔和填充用于通过电镀抗蚀剂提供导电隔离部分的通孔之后可以释放的表面上的层。