公开(公告)号：US20230238181A1

公开(公告)日：2023-07-27

申请号：US18130630

申请日：2023-04-04

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Ryuji ISHIZUKA ,  Yoshihiro YONEDA ,  Toshihiro HOSOI ,  Yuji KAGEYAMA

IPC: H01G4/14 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  H01G4/008

CPC classification number: H01G4/14 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  H01G4/008 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/204 ,  B32B2307/732 ,  B32B2457/16 ,  H01G4/35

Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

公开(公告)号：US20250046520A1

公开(公告)日：2025-02-06

申请号：US18704680

申请日：2022-10-12

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Ryuji ISHIZUKA ,  Yoshihiro YONEDA ,  Toshihiro HOSOI ,  Yuji KAGEYAMA

IPC: H01G4/14 ,  H01G4/008 ,  H01G4/35 ,  H05K1/16

Abstract: Provided is a double-sided copper clad laminate that can realize not only good capacitor characteristics but also excellent handleability. This double-sided copper clad laminate is a double-sided copper clad laminate having copper foil adhered onto both surfaces of a dielectric layer, wherein the dielectric layer has a thickness of 0.1 μm or more and 2.0 μm or less, and the double-sided copper clad laminate further includes a pair of resin layers arranged in contact with the copper foil between the dielectric layer and the copper foil.

公开(公告)号：US20220351906A1

公开(公告)日：2022-11-03

申请号：US17770411

申请日：2021-06-04

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Ryuji ISHIZUKA ,  Yoshihiro YONEDA ,  Toshihiro HOSOI ,  Yuji KAGEYAMA

IPC: H01G4/14 ,  B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  H01G4/008

Abstract: There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.