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    Sensor module and method of manufacturing the same
    33.
    发明授权
    Sensor module and method of manufacturing the same 有权
    传感器模块及其制造方法

    公开(公告)号：US09559224B2

    公开(公告)日：2017-01-31

    申请号：US14413890

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: H01J3/14 ,  H01L31/0232 ,  G01S17/88 ,  G01S7/481 ,  H01L31/0203 ,  H01L27/146 ,  G01L9/00 ,  H01L27/144

    CPC classification number: G01D5/30 ,  G01L9/0077 ,  G01S7/4813 ,  G01S17/88 ,  H01L27/144 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/1876 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The opto-electronic module (1) comprises —a first substrate member (P); —a third substrate member (B); —a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); —a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); —a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); —a light detecting element (D) arranged on and electrically connected to said first substrate member (P); —a light emission element (E) arranged on and electrically connected to said first substrate member (P); —and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

    Abstract translation: 光电模块（1）包括：第一衬底构件（P）; - 第三衬底构件（B）; - 第二衬底构件（O），布置在所述第一和第三衬底构件之间并且包括光可以通过的一个或多个透明部分（ta，tb），所述至少一个透明部分至少包括第一光学结构（5a; 5a'; 5b; 5b'）; - 包括在所述第一衬底构件（P）中或包含在所述第二衬底构件（O）中的第一间隔构件（S1）或与所述第一衬底构件（P）中的至少一个开口（4a; 4b）不同并位于所述第一衬底构件 - 包括在所述第二衬底构件（O）中或包括在所述第三衬底构件（B）中的第二间隔构件（S2）或者不同于所述第二衬底构件（B）中的第二衬垫构件（S2），其包括至少一个开口（3）; - 设置在所述第一基板部件（P）上并与其电连接的光检测元件（D）。 - 发光元件（E），布置在所述第一基板部件（P）上并与所述第一基板部件（P）电连接。 以及包含在所述第三衬底构件（B）中或布置在所述第三衬底构件（B）上的感测元件（8）。 这样的模块（1）特别适用于用于感测诸如压力的量值的传感器模块。

    OPTOELECTRONIC MODULES WITH OPTICS INTEGRATED INTO A CAP
    34.
    发明申请
    OPTOELECTRONIC MODULES WITH OPTICS INTEGRATED INTO A CAP 有权
    光学模块与光学集成到一个CAP

    公开(公告)号：US20160254397A1

    公开(公告)日：2016-09-01

    申请号：US15041216

    申请日：2016-02-11

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Tobias Senn ,  Hartmut Rudmann

    IPC: H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  G02B7/00 ,  H01L33/58

    CPC classification number: H01L31/02325 ,  G02B7/003 ,  H01L31/18 ,  H01L33/005 ,  H01L33/58 ,  H02S40/44 ,  Y02P70/521

    Abstract: Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

    Abstract translation: 用于发光和/或光感测的光电模块包括光学组件和有源光电子元件。 可以对准光学组件和对应的光电子部件。 光电子模块可以包括多个光学组件和有源光电子部件。 在包括对准特征和光学组装筒的光电模块的各种实施方式中，多个光学组件和相应的有源光电子部件可以彼此独立地对准。

    Micro-optical system and method of manufacture thereof
    35.
    发明授权
    Micro-optical system and method of manufacture thereof 有权
    微光学系统及其制造方法

    公开(公告)号：US09164358B2

    公开(公告)日：2015-10-20

    申请号：US13644682

    申请日：2012-10-04

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Michel Barge

    IPC: G03B15/02 ,  F21V8/00 ,  B29D11/00 ,  G02B13/00 ,  G02B19/00

    CPC classification number: G03B15/02 ,  B29D11/00307 ,  B29D11/00365 ,  B29D11/00663 ,  B29D11/00692 ,  G02B6/0011 ,  G02B13/0085 ,  G02B19/0061

    Abstract: The optical system comprises a base plate having a first plate side and a second plate side, a light guide element located substantially on said first plate side and a lens element located on said second plate side. The base plate and the light guide element are integrally formed or are distinct parts, and the base plate is at least partially transparent The optical system forms a light path for light passing through said lens element, across said base plate and through said light guide element, and wherein said base plate comprises at least one mechanical guiding element. The method for manufacturing such an optical system comprises providing a wafer comprising a multitude of said base plates.

    Abstract translation: 光学系统包括具有第一板侧和第二板侧的基板，基本上位于所述第一板侧的导光元件和位于所述第二板侧的透镜元件。 基板和导光元件整体形成或不同的部分，并且基板至少部分透明。光学系统形成光通过所述透镜元件的光，穿过所述基板并通过所述导光元件 ，并且其中所述基板包括至少一个机械引导元件。 制造这种光学系统的方法包括提供包括多个所述基板的晶片。

    Opto-Electronic Module
    37.
    发明申请
    Opto-Electronic Module 有权
    光电模块

    公开(公告)号：US20140291703A1

    公开(公告)日：2014-10-02

    申请号：US14303968

    申请日：2014-06-13

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

    IPC: H01L31/167 ,  H01L31/0232

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT
    38.
    发明申请
    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT 审中-公开
    间隔元件和制造间隔元件的方法

    公开(公告)号：US20130280492A1

    公开(公告)日：2013-10-24

    申请号：US13923861

    申请日：2013-06-21

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Nicola Spring ,  Alexander Bietsch

    IPC: B32B41/00 ,  B32B37/02

    CPC classification number: B32B41/00 ,  B32B37/02 ,  G02B2006/12166 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T156/10 ,  Y10T428/15 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2457 ,  H01L2924/00

    Abstract: A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges.

    Abstract translation: 用于晶片堆叠的间隔晶片包括具有第一表面和第二表面的间隔体，并且旨在夹在第一晶片和第二晶片之间。 也就是说，间隔件是保持第一晶片放置在第一表面上，并且第二晶片以彼此保持恒定的距离放置在第二表面上。 间隔件提供开口布置成使得第一晶片和第二晶片的功能元件可与开口对准。 间隔件通过形状复制工艺由成形工具形成，并且优选由通过固化硬化的材料制成。 第一和第二表面中的至少一个包括将表面与开口分开的边缘，并且边缘处的间隔晶片的厚度在边缘周围的表面位置超过间隔晶片的厚度。

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