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    Micro-Optical System and Method of Manufacture Thereof
    2.
    发明申请
    Micro-Optical System and Method of Manufacture Thereof 有权
    微光学系统及其制造方法

    公开(公告)号：US20130088845A1

    公开(公告)日：2013-04-11

    申请号：US13644682

    申请日：2012-10-04

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Hartmut Rudmann ,  Michel Barge

    IPC: G03B15/02 ,  F21V8/00

    CPC classification number: G03B15/02 ,  B29D11/00307 ,  B29D11/00365 ,  B29D11/00663 ,  B29D11/00692 ,  G02B6/0011 ,  G02B13/0085 ,  G02B19/0061

    Abstract: The optical system comprises a base plate having a first plate side and a second plate side, a light guide element located substantially on said first plate side and a lens element located on said second plate side. The base plate and the light guide element are integrally formed or are distinct parts, and the base plate is at least partially transparent The optical system forms a light path for light passing through said lens element, across said base plate and through said light guide element, and wherein said base plate comprises at least one mechanical guiding element. The method for manufacturing such an optical system comprises providing a wafer comprising a multitude of said base plates.

    Abstract translation: 光学系统包括具有第一板侧和第二板侧的基板，基本上位于所述第一板侧的导光元件和位于所述第二板侧的透镜元件。 基板和导光元件整体形成或不同的部分，并且基板至少部分透明。光学系统形成光通过所述透镜元件的光，穿过所述基板并通过所述导光元件 ，并且其中所述基板包括至少一个机械引导元件。 制造这种光学系统的方法包括提供包括多个所述基板的晶片。

    MANUFACTURE OF OPTICAL ELEMENTS BY REPLICATION AND CORRESPONDING REPLICATION TOOLS AND OPTICAL DEVICES
    3.
    发明申请
    MANUFACTURE OF OPTICAL ELEMENTS BY REPLICATION AND CORRESPONDING REPLICATION TOOLS AND OPTICAL DEVICES 审中-公开

    公开(公告)号：US20170090074A1

    公开(公告)日：2017-03-30

    申请号：US15310842

    申请日：2015-05-14

    Applicant: HEPTAGON MICRO OPTICS PTE LTD.

    Inventor： Alexander Bietsch ,  Michel Barge

    IPC: G02B3/00 ,  B29D11/00

    CPC classification number: G02B3/0031 ,  B29D11/00

    Abstract: A replication tool for producing an optical structure comprising an optical element includes a central section having the shape defining a negative of a portion of the optical structure and a vertically aligned central axis; a surrounding section laterally surrounding the central section; and one or more contact standoffs defining a plane referred to as contact plane. In a first azimuthal range, the surrounding portion provides a first compensation surface facing away from the central axis, and in a second azimuthal range, the surrounding portion provides a second compensation surface facing away from the central axis. In any cross-section containing the central axis in the second azimuthal range, a steepness of the second compensation surface is higher than a steepness of the first compensation surface in any cross-section containing the central axis in the first azimuthal range.

    OPTO-ELECTRONIC MODULE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    OPTO-ELECTRONIC MODULE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20160072023A1

    公开(公告)日：2016-03-10

    申请号：US14945505

    申请日：2015-11-19

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Michel Barge

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/58

    CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for manufacturing a device (1) is suggested. The device comprises at least one opto-electronic modul (1), and the method comprises creating a wafer stack (2) comprising a substrate wafer (PW), and an optics wafer (OW); wherein a multitude of active optical components (E) is mounted on the substrate wafer (PW), and the optics wafer (OW) comprises a multitude of passive optical components (L). Each of the opto-electronic modules (1) comprises at least one of the active optical components (E) and at least one of the passive optical components (L). The optics wafer (OW) can comprise at least one portion, referred to as blocking portion, which is at least substantially non-transparent for at least a specific wavelength range, and at least one other portion, referred to as transparent portion, which is at least substantially non-transparent for at least said specific wavelength range. 11. The opto-electronic module comprises a substrate member; an optics member; at least one active optical component mounted on said subtrate member; and at least one passive optical component comprised in said optics member. The optics member (OW) is directly or indirectly fixed to said substrate member (PW). The opto-electronic modules (1) can have an excellent manufacturability while being small in dimension and having a high alignment accuracy.

    Abstract translation: 提出了一种制造装置（1）的方法。 该装置包括至少一个光电子模块（1），并且该方法包括产生包括衬底晶片（PW）和光学晶片（OW）的晶片堆叠（2）。 其中多个有源光学部件（E）安装在所述基板晶片（PW）上，并且所述光学晶片（OW）包括多个无源光学部件（L）。 每个光电子模块（1）包括有源光学部件（E）和至少一个无源光学部件（L）中的至少一个。 光学晶片（OW）可以包括称为阻挡部分的至少一个部分，其至少在特定波长范围内至少基本上不透明，并且至少一个称为透明部分的其它部分 至少基本上不透明至少所述特定波长范围。 光电模块包括衬底构件; 光学元件; 至少一个有源光学部件安装在所述减速部件上; 以及包括在所述光学元件中的至少一个无源光学元件。 光学构件（OW）直接或间接地固定到所述衬底构件（PW）上。 光电模块（1）可以具有优异的可制造性，同时尺寸小并且具有高对准精度。

    WAFER-LEVEL MANUFACTURE OF DEVICES, IN PARTICULAR OF OPTICAL DEVICES
    5.
    发明申请
    WAFER-LEVEL MANUFACTURE OF DEVICES, IN PARTICULAR OF OPTICAL DEVICES 审中-公开

    公开(公告)号：US20170087784A1

    公开(公告)日：2017-03-30

    申请号：US15310838

    申请日：2015-05-14

    Applicant: HEPTAGON MICRO OPTICS PTE LTD.

    Inventor： Alexander Bietsch ,  Michel Barge

    IPC: B29D11/00 ,  B29C59/16 ,  G02B13/00 ,  B29C65/48 ,  G03F7/20 ,  B29C59/02 ,  B05D3/12

    Abstract: The wafer-level method for applying N≧2 first elements to a first side of a substrate, wherein the substrate has at the first side a first surface including the steps of providing the substrate, wherein at least N barrier members are present at the first side, and wherein each barrier member is associated with one of the first elements. For each of the first elements, the method includes bringing a first amount of a hardenable material in a flowable state in contact with the first surface, the first amount of hardenable material being associated with the first element; controlling a flow of the first amount of hardenable material on the first surface with the associated barrier member; and hardening the first amount of hardenable material to interconnect the first surface and the respective element.

    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES
    6.
    发明申请
    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES 审中-公开
    具有屏蔽功能的移动电话和其他设备的闪光模组

    公开(公告)号：US20160091777A1

    公开(公告)日：2016-03-31

    申请号：US14891589

    申请日：2014-05-15

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Kam Pui Kuan ,  Hakan Karpuz ,  Michel Barge ,  Nicola Spring ,  Robert Lenart

    IPC: G03B15/05

    CPC classification number: G03B15/05 ,  G03B15/03 ,  G03B2215/0592 ,  G03B2215/0596

    Abstract: A flash module comprises an optics portion that includes a base plate, a light guide on a first side of the base plate, and a lens element on a second side of the base plate. A casing is attached to the optics portion and defines an interior region in which the lens element is located. An active light emitting component is mounted within the casing. Sidewalls of the light guide are coated with first and second layers of different materials. The second layer is a coating over the first layer and is substantially non-transparent to light emitted by the active light emitting component. The first layer can provide a predetermined aesthetic appearance and can be selected, for example, to match the color of the exterior surface of a device in which the flash module is to be integrated.

    Abstract translation: 闪光模块包括光学部分，其包括基板，在基板的第一侧上的导光体和在基板的第二侧上的透镜元件。 壳体附接到光学部件并且限定透镜元件所在的内部区域。 主动发光部件安装在壳体内。 导光板的侧壁涂有第一层和第二层不同的材料。 第二层是在第一层上的涂层，并且对于由有源发光部件发射的光基本上不透明。 第一层可以提供预定的美学外观，并且可以选择，例如，以匹配闪光模块将被集成在其中的装置的外表面的颜色。

    Micro-optical system and method of manufacture thereof
    7.
    发明授权
    Micro-optical system and method of manufacture thereof 有权
    微光学系统及其制造方法

    公开(公告)号：US09164358B2

    公开(公告)日：2015-10-20

    申请号：US13644682

    申请日：2012-10-04

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Michel Barge

    IPC: G03B15/02 ,  F21V8/00 ,  B29D11/00 ,  G02B13/00 ,  G02B19/00

    CPC classification number: G03B15/02 ,  B29D11/00307 ,  B29D11/00365 ,  B29D11/00663 ,  B29D11/00692 ,  G02B6/0011 ,  G02B13/0085 ,  G02B19/0061

    Abstract: The optical system comprises a base plate having a first plate side and a second plate side, a light guide element located substantially on said first plate side and a lens element located on said second plate side. The base plate and the light guide element are integrally formed or are distinct parts, and the base plate is at least partially transparent The optical system forms a light path for light passing through said lens element, across said base plate and through said light guide element, and wherein said base plate comprises at least one mechanical guiding element. The method for manufacturing such an optical system comprises providing a wafer comprising a multitude of said base plates.

    Abstract translation: 光学系统包括具有第一板侧和第二板侧的基板，基本上位于所述第一板侧的导光元件和位于所述第二板侧的透镜元件。 基板和导光元件整体形成或不同的部分，并且基板至少部分透明。光学系统形成光通过所述透镜元件的光，穿过所述基板并通过所述导光元件 ，并且其中所述基板包括至少一个机械引导元件。 制造这种光学系统的方法包括提供包括多个所述基板的晶片。

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