公开(公告)号：US09859339B2

公开(公告)日：2018-01-02

申请号：US15307090

申请日：2016-03-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hongda Sun ,  Xuyuan Li ,  Meili Wang

IPC: H01L27/32 ,  H01L21/77 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L27/32 ,  H01L21/77 ,  H01L27/3246 ,  H01L27/3274 ,  H01L51/52 ,  H01L51/5296 ,  H01L51/56

Abstract: A display substrate, a manufacturing method and a driving method thereof, and a display device are provided. The display substrate includes a substrate, a gate layer disposed on the substrate, a gate insulating layer disposed on the gate layer, a pixel defining layer disposed on the gate insulating layer, the pixel defining layer includes a plurality of defining regions, a light emitting layer in the defining regions of the pixel defining layer disposed on the gate insulating layer, wherein the light emitting layer includes an electron excitation layer, a light excitation layer and a hole excitation layer, and a source/drain layer disposed on the light emitting layer. According to an embodiment of the present disclosure, light emission and control of light emission can be realized merely by a three-layer structure of a gate layer, a light emitting layer and a source/drain layer, and compared with the OLED light emitting structure of the prior art, the layer structure is simpler, the light emitted is less blocked, and luminous efficiency is higher.

公开(公告)号：US09793413B2

公开(公告)日：2017-10-17

申请号：US14771526

申请日：2014-10-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Li Zhang ,  Meili Wang ,  Fengjuan Liu

IPC: H01L29/786 ,  H01L27/12 ,  H01L29/66 ,  H01L27/32

CPC classification number: H01L29/7869 ,  H01L27/1225 ,  H01L27/3262 ,  H01L29/66969 ,  H01L29/786

Abstract: The present disclosure provides a method for producing a thin film transistor. The method includes the steps of: forming a protective layer on an active layer of the thin film transistor and patterning the protective layer along with the active layer when the active layer is deposited; depositing a source and drain electrode layer and patterning it by a dry etching to form a source electrode and a drain electrode; and etching or passivating the protective layer located in a back channel region of the source electrode and the drain electrode. In addition, the present disclosure also discloses a thin film transistor produced by the above method, and an array substrate.

公开(公告)号：US20170236940A1

公开(公告)日：2017-08-17

申请号：US15501854

申请日：2016-06-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Meili Wang ,  Liangchen Yan

IPC: H01L29/786 ,  H01L29/66 ,  H01L27/12 ,  H01L29/45 ,  H01L29/423

CPC classification number: H01L29/7869 ,  H01L27/1225 ,  H01L27/1288 ,  H01L29/41733 ,  H01L29/42356 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/78618

Abstract: The present application discloses a thin film transistor including an active layer, and a source electrode and a drain electrode on the active layer; each of the source electrode and the drain electrode includes a metal electrode sub-layer, and a diffusion barrier sub-layer made of a material comprising M1OaNb, wherein M1 is a single metal or a combination of metals, a≧0, and b>0, between the metal electrode sub-layer and the active layer for preventing diffusion of metal electrode material into the active layer.

公开(公告)号：US20170139081A1

公开(公告)日：2017-05-18

申请号：US15325863

申请日：2016-02-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dongfang Wang ,  Meili Wang ,  Li Zhang

IPC: G02B1/113 ,  G02F1/1335 ,  H01L51/52 ,  G02B1/12

CPC classification number: G02B1/113 ,  G02B1/118 ,  G02B1/12 ,  G02F1/133502 ,  G02F1/133526 ,  G02F2201/38 ,  H01L31/0543 ,  H01L51/5275 ,  H01L51/5281

Abstract: The present application discloses a method of fabricating an anti-reflective film, comprising forming a zinc oxynitride layer on a substrate; annealing the zinc oxynitride layer; and etching the surface of the zinc oxynitride layer with an etching solution to form a micro lenses layer comprising a plurality of micro lenses on surface.

公开(公告)号：US12207526B2

公开(公告)日：2025-01-21

申请号：US17608985

申请日：2021-01-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Kang Guo ,  Feng Zhang ,  Meili Wang ,  Haitao Huang ,  Qi Yao ,  Xin Gu ,  Hua Huang ,  Guangcai Yuan ,  Xue Dong ,  Libo Wang ,  Detian Meng

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/122 ,  H04N13/376 ,  H04N13/398

Abstract: Provided are a display substrate, a method for manufacturing a display substrate and a display apparatus. The display substrate includes a base, a drive structure layer disposed on the base, a light emitting element disposed on the drive structure layer, an encapsulation layer disposed on the light emitting element, a circular polarizer layer disposed on the encapsulation layer, and a lens definition layer and a lens structure layer disposed on the circular polarizer layer. The light emitting element includes a pixel definition layer provided with a plurality of sub-pixel openings; the lens structure layer includes a plurality of lenses disposed at intervals, the lens definition layer is disposed in a gap region between adjacent lenses, and an orthographic projection of each lens on the base contains an orthographic projection of a sub-pixel opening on the base.

公开(公告)号：US12034088B2

公开(公告)日：2024-07-09

申请号：US17635794

申请日：2021-04-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Duohui Li ,  Kang Guo ,  Mengya Song ,  Haitao Huang ,  Renquan Gu ,  Feng Zhang ,  Meili Wang

IPC: H01L31/0216 ,  G02F1/1335 ,  H01L31/0232

CPC classification number: H01L31/02164 ,  G02F1/133509 ,  G02F1/133512 ,  G02F1/133526 ,  H01L31/02327

Abstract: The present disclosure belongs to the field of display technology, and provides an optical module, a manufacturing method thereof, and a display device. The optical module includes: a substrate; a barrier structure arranged on the substrate; a black matrix arranged within the barrier structure, an orthogonal projection of the black matrix onto the substrate not going beyond a region surrounded by the barrier structure; and optical lenses arranged on a side of the black matrix away from the substrate. An orthogonal projection of a gap between adjacent optical lenses onto the substrate falls into the black matrix.

公开(公告)号：US20220320056A1

公开(公告)日：2022-10-06

申请号：US17434835

申请日：2021-04-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xuan Liang ,  Meili Wang ,  Fei Wang ,  Xue Dong ,  Qi Qi

IPC: H01L25/16 ,  H01L23/00

Abstract: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

公开(公告)号：US20220293576A1

公开(公告)日：2022-09-15

申请号：US17536268

申请日：2021-11-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Meili Wang ,  Xuan Liang ,  Fei Wang ,  Lei Wang ,  Yafeng Yang ,  Xue Dong ,  Zhanfeng Cao ,  Mingxing Wang ,  Fuqiang Li ,  Chenyang Zhang ,  Xinxin Zhao ,  Yanling Han ,  Lei Wang ,  Xuan Feng ,  Yapeng Li

IPC: H01L25/16 ,  H01L33/62 ,  H01L27/146 ,  H01L21/66

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.

公开(公告)号：US11237310B2

公开(公告)日：2022-02-01

申请号：US16087138

申请日：2018-03-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

Inventor： Meili Wang ,  Xue Dong ,  Ming Zhu

IPC: G02B5/28 ,  G02B5/20 ,  H04N9/12 ,  B82Y20/00

Abstract: A display component includes a transflective layer, a reflective layer, and at least one sidewall. The reflective layer is arranged opposing to the transflective layer, and the at least one sidewall is arranged between the reflective layer and the transflective layer. The transflective layer, the reflective layer, and the at least one sidewall are together configured, upon an input of an incident light through the transflective layer, to output a light of a target color out through the transflective layer. One or more of the at least one sidewall comprise at least one light-conversion layer configured to emit a light of the target color upon excitement by a light of a different color shedding thereupon. The display component can be configured to output a red light, a green light, or a blue light.

公开(公告)号：US10989842B2

公开(公告)日：2021-04-27

申请号：US15961100

申请日：2018-04-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dongfang Wang ,  Meili Wang ,  Li Zhang

IPC: G02B1/113 ,  G02B1/118 ,  H01L31/054 ,  G02B1/12 ,  G02F1/1335 ,  H01L51/52

Abstract: The present application discloses a method of fabricating an anti-reflective film, comprising forming a zinc oxynitride layer on a substrate; annealing the zinc oxynitride layer; and etching the surface of the zinc oxynitride layer with an etching solution to form a micro lenses layer comprising a plurality of micro lenses on surface.