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公开(公告)号：US12074258B2
公开(公告)日：2024-08-27
申请号：US17332852
申请日：2021-05-27
发明人： Lizhen Zhang , Guangcai Yuan , Qi Yao , Mingxing Wang
CPC分类号： H01L33/382 , H01L27/156 , H01L33/005 , H01L33/12 , H01L33/62 , H01L2933/0016
摘要： An embodiment of the present disclosure provides a light emitting diode chip, including: a light emitting functional layer including a first semiconductor layer, a light emitting layer and a second semiconductor layer which are sequentially stacked, and a second semiconductor layer including a plurality of second semiconductor patterns which are arranged at intervals; a first electrode layer including a first electrode pattern electrically coupled to the first semiconductor layer; a second electrode layer disposed on a side, away from the light emitting layer, of the second semiconductor layer and including a plurality of second electrode patterns in one-to-one correspondence with the second semiconductor patterns, and the second electrode patterns are electrically coupled to the second semiconductor patterns correspondingly. Embodiments of the present disclosure further provide a method for manufacturing a light emitting diode chip and a display device.
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公开(公告)号：US11828959B2
公开(公告)日：2023-11-28
申请号：US16660386
申请日：2019-10-22
发明人： Wusheng Li , Qi Yao
CPC分类号： G02B5/1857 , G02B30/27 , G03F7/0005 , G03F7/2051 , G03F7/40 , G03F7/70291
摘要： A grating structure, a manufacturing method thereof and a display device are provided. The method of manufacturing the grating structure includes: forming a photosensitive material layer on a substrate; patterning the photosensitive material layer to form a grating transition pattern, where the grating transition pattern includes multiple grating units, the multiple grating units each include a first portion and a second portion which are symmetric, and at least one of the first portion and the second portion includes multiple subunits to have a stepped structure; and curing the grating transition pattern to form the grating structure.
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3.发明公开公开(公告)号：US20230260982A1
公开(公告)日：2023-08-17
申请号：US18137857
申请日：2023-04-21
发明人： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC分类号： H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
摘要： Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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公开(公告)号：US11424232B2
公开(公告)日：2022-08-23
申请号：US16920771
申请日：2020-07-06
发明人： Yingwei Liu , Ke Wang , Zhiwei Liang , Muxin Di , Zhanfeng Cao , Shuang Liang , Guangcai Yuan , Qi Yao , Dongni Liu
IPC分类号： H01L23/538 , H01L25/18 , H01L23/00 , H01L25/00 , H01L25/16
摘要： Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.
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公开(公告)号：US11378839B2
公开(公告)日：2022-07-05
申请号：US17213824
申请日：2021-03-26
发明人： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao
IPC分类号： G02F1/1335 , F21V8/00 , G02F1/1368 , G02F1/1343
摘要： The present disclosure can provide a transparent display panel, a preparation method thereof and a display device. The transparent display panel includes a bearing layer disposed between a base substrate and a liquid crystal layer and including a plurality of concave structures, and a plurality of reflecting structures located between the bearing layer and the liquid crystal layer, where an orthographic projection of the concave structure on the base substrate covers an orthographic projection of one or more reflecting structures on the base substrate.
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公开(公告)号：US11373585B2
公开(公告)日：2022-06-28
申请号：US17070338
申请日：2020-10-14
发明人： Wenqu Liu , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Zhao Cui , Xiaoxin Song , Detian Meng , Libo Wang
摘要： A driving backplane includes a base, and a pixel driving circuit, a first electrode and a first piezoelectric block that are disposed in the sub-pixel region. The pixel driving circuit is disposed on the base. The first electrode is disposed at a side of the pixel driving circuit away from the base. The first electrode includes a first sub-electrode pattern and a second sub-electrode pattern that are in a same layer and are spaced apart to be insulated from each other, and the first sub-electrode pattern is electrically connected to the pixel driving circuit. The first piezoelectric block is disposed between the pixel driving circuit and the first electrode, and the first sub-electrode pattern and the second sub-electrode pattern are in contact with the first piezoelectric block.
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公开(公告)号：US11367740B2
公开(公告)日：2022-06-21
申请号：US16084452
申请日：2018-01-08
发明人： Qi Yao , Yingwei Liu
IPC分类号： H01L27/12 , H01L29/786 , H01L29/66 , H01L27/32 , H01L51/00
摘要： The present disclosure provides an array substrate, a manufacturing method thereof, a flexible display panel, and a display device, all for achieving a frame-free full-screen flexible display product. The array substrate provided in the present disclosure comprises a flexible base substrate, a thin film transistor on a first surface of the flexible base substrate, and a wiring terminal for transmitting a signal to an electrode of the thin film transistor on a second surface of the flexible base substrate opposite to the first surface. The electrode of the thin film transistor is electrically connected to the wiring terminal through a via hole penetrating the flexible base substrate.
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公开(公告)号：US11320691B2
公开(公告)日：2022-05-03
申请号：US16508833
申请日：2019-07-11
发明人： Jiangnan Lu , Shi Shu , Kang Guo , Qi Yao
IPC分类号： G02F1/1335 , G02B5/30 , G02F1/1333 , G02F1/1368 , G02F1/1334
摘要： Provided are a manufacturing method of a display substrate, a display substrate and a display device, which belongs to the field of display technologies. The manufacturing method of the display substrate includes: forming a first planarization layer on a base substrate on which a patterned film layer is formed; forming a first buffer layer on the side, away from the base substrate, of the first planarization layer; forming a second buffer layer on the side, away from the base substrate, of the first buffer layer; and forming a Wire Grid Polarizer (WGP) on the side, away from the base substrate, of the second buffer layer.
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公开(公告)号：US11302722B2
公开(公告)日：2022-04-12
申请号：US16314298
申请日：2018-03-27
发明人： Haixu Li , Zhanfeng Cao , Qi Yao , Dapeng Xue , Shuilang Dong
摘要： An array substrate, manufacturing method thereof, and a display device according to some arrangements of the present disclosure include: a first transistor and a second transistor; an active layer of the second transistor is disposed on a side of the interlayer dielectric layer of the first transistor away from the substrate; an insulating layer is disposed between the interlayer dielectric layer of the first transistor and the active layer of the second transistor, and the insulating layer has an ability to block hydrogen.
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公开(公告)号：US20220068899A1
公开(公告)日：2022-03-03
申请号：US17204562
申请日：2021-03-17
发明人： Zhijun LV , Feng Zhang , Liwen Dong , Wenqu Liu , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao
摘要： The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.
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