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公开(公告)号：US20240258279A1
公开(公告)日：2024-08-01
申请号：US18016589
申请日：2022-02-28
发明人： Xue Dong , Guangcai Yuan , Xin Gu , Junwei Yan , Fei Wang , Xiao Zhang , Haixu Li , Xuan Liang , Chengfei Wang , Mingxing Wang , Shulei Li , Xiaolei Zhang , Xinxin Zhao
IPC分类号： H01L25/075 , H01L21/68 , H01L33/00
CPC分类号： H01L25/0753 , H01L21/681 , H01L33/0093
摘要： An optical path structure, an optical path system, and a transfer method. The optical path structure includes a beam adjustment module configured to adjust a diameter of a laser beam and output a first beam; a beam shaping module configured to perform energy homogenization on the first beam to obtain a second beam; and a beam focusing module configured to focus the second beam and output a target light spot; the target light spot is used for irradiating a device substrate, so that a bonding material in the device substrate changes after being irradiated by the target light spot, and a target device is separated from a carrier substrate; where the bonding material is disposed between the target device and the carrier substrate.
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公开(公告)号：US20240264344A1
公开(公告)日：2024-08-08
申请号：US18021688
申请日：2022-03-01
发明人： Xiang Li , Shi Shu , Yong Yu , Chuanxiang Xu , Yang Yue , Xiao Zhang , Mingxing Wang , Wei Li , Wei He , Haowei Zou , Qi Yao
IPC分类号： G02B5/20
CPC分类号： G02B5/201
摘要： A color film substrate and a method of manufacturing the same, a display substrate and a method of manufacturing the same and a display device are provided. The color film substrate includes: a base substrate; a plurality of pixel units arranged on the base substrate, each unit includes a plurality of sub-pixels; the pixel unit includes: a barrier including a first barrier arranged around a peripheral side of the pixel unit and a second barrier arranged between adjacent sub-pixels, and the plurality of sub-pixels include a first sub-pixel for color conversion and a second sub-pixel for scattering; a color conversion material layer arranged in the first sub-pixel; a scattering material layer arranged in the second sub-pixel; at least one of the first barrier and the second barrier is in a same layer as the scattering material layer (50), and has the same material as that of the scattering material layer.
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公开(公告)号：US11742377B2
公开(公告)日：2023-08-29
申请号：US17488243
申请日：2021-09-28
发明人： Xue Dong , Guangcai Yuan , Qi Yao , Zhanfeng Cao , Shi Shu , Mingxing Wang , Xiang Li
IPC分类号： H01L25/00 , H01L27/15 , H01L25/065
CPC分类号： H01L27/156 , H01L25/0655 , H01L25/50
摘要： A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.
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公开(公告)号：US20220293576A1
公开(公告)日：2022-09-15
申请号：US17536268
申请日：2021-11-29
发明人： Meili Wang , Xuan Liang , Fei Wang , Lei Wang , Yafeng Yang , Xue Dong , Zhanfeng Cao , Mingxing Wang , Fuqiang Li , Chenyang Zhang , Xinxin Zhao , Yanling Han , Lei Wang , Xuan Feng , Yapeng Li
IPC分类号： H01L25/16 , H01L33/62 , H01L27/146 , H01L21/66
摘要： A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.
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公开(公告)号：US12074258B2
公开(公告)日：2024-08-27
申请号：US17332852
申请日：2021-05-27
发明人： Lizhen Zhang , Guangcai Yuan , Qi Yao , Mingxing Wang
CPC分类号： H01L33/382 , H01L27/156 , H01L33/005 , H01L33/12 , H01L33/62 , H01L2933/0016
摘要： An embodiment of the present disclosure provides a light emitting diode chip, including: a light emitting functional layer including a first semiconductor layer, a light emitting layer and a second semiconductor layer which are sequentially stacked, and a second semiconductor layer including a plurality of second semiconductor patterns which are arranged at intervals; a first electrode layer including a first electrode pattern electrically coupled to the first semiconductor layer; a second electrode layer disposed on a side, away from the light emitting layer, of the second semiconductor layer and including a plurality of second electrode patterns in one-to-one correspondence with the second semiconductor patterns, and the second electrode patterns are electrically coupled to the second semiconductor patterns correspondingly. Embodiments of the present disclosure further provide a method for manufacturing a light emitting diode chip and a display device.
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公开(公告)号：US12021173B2
公开(公告)日：2024-06-25
申请号：US17435016
申请日：2020-11-06
发明人： Mingxing Wang , Binbin Tong , Lizhen Zhang , Chenyang Zhang , Zhen Zhang , Xiawei Yun , Guangcai Yuan , Xue Dong , Muxin Di , Zhiwei Liang , Ke Wang , Zhanfeng Cao
IPC分类号： H01L33/38 , H01L25/075 , H01L33/00 , H01L33/46 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/46 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.
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公开(公告)号：US20220293635A1
公开(公告)日：2022-09-15
申请号：US17529969
申请日：2021-11-18
发明人： Chenyang Zhang , Fuqiang Li , Xue Dong , Meili Wang , Xuan Liang , Fei Wang , Mingxing Wang , Zhanfeng Cao , Yanling Han , Xinxin Zhao
IPC分类号： H01L27/12
摘要： A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.
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