公开(公告)号：US12183748B2

公开(公告)日：2024-12-31

申请号：US18518526

申请日：2023-11-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11637166B2

公开(公告)日：2023-04-25

申请号：US16651551

申请日：2019-11-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Qi Yao ,  Ke Wang ,  Zhanfeng Cao ,  Zhiwei Liang ,  Muxin Di ,  Guangcai Yuan ,  Xue Jiang ,  Dongni Liu

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/00

Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.

公开(公告)号：US20230049038A1

公开(公告)日：2023-02-16

申请号：US17975894

申请日：2022-10-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.

公开(公告)号：US11380719B2

公开(公告)日：2022-07-05

申请号：US16667382

申请日：2019-10-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hua Huang ,  Changhan Hsieh ,  Muxin Di ,  Xiaoyan Zhu

IPC: H01L23/13 ,  H01L23/498 ,  H01L27/12 ,  H01L25/16 ,  H01L33/62

Abstract: Embodiments of the present disclosure provide a display substrate, a method for manufacturing a display substrate, and a display device. The method for manufacturing the display substrate includes: providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer; forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer; removing the first carrier substrate to expose the seed layer; and forming a second connection terminal electrically connecting to the seed layer.

公开(公告)号：US11502153B2

公开(公告)日：2022-11-15

申请号：US16761823

申请日：2019-03-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

公开(公告)号：US11335712B2

公开(公告)日：2022-05-17

申请号：US16755652

申请日：2019-05-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Muxin Di ,  Ke Wang ,  Yingwei Liu ,  Xiaoyan Zhu ,  Zhanfeng Cao ,  Guangcai Yuan

IPC: H01L27/12 ,  H01L33/62

Abstract: An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.

公开(公告)号：US11239298B2

公开(公告)日：2022-02-01

申请号：US16641560

申请日：2019-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Yingwei Liu ,  Zhiwei Liang ,  Haixu Li ,  Zhanfeng Cao

IPC: G09G3/3225 ,  H01L27/32 ,  H01L51/56

Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.

公开(公告)号：US11239257B2

公开(公告)日：2022-02-01

申请号：US16468240

申请日：2019-01-09

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Haixu Li ,  Muxin Di ,  Qingzhao Liu

IPC: H01L27/12 ,  H01L29/786

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.

公开(公告)号：US20200273786A1

公开(公告)日：2020-08-27

申请号：US16530605

申请日：2019-08-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin Di ,  Zhiwei Liang ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Renquan Gu ,  Qi Yao ,  Jaiil Ryu

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

公开(公告)号：US12132160B2

公开(公告)日：2024-10-29

申请号：US17615075

申请日：2020-11-04

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Ke Wang ,  Muxin Di ,  Shuang Liang ,  Yankai Gao

IPC: H01L33/62 ,  G09F9/302 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  G09F9/3026 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.