公开(公告)号：US11488987B2

公开(公告)日：2022-11-01

申请号：US16650690

申请日：2019-10-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Shuang Liang ,  Zhiwei Liang ,  Muxin Di ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L27/12 ,  H01L25/065 ,  H01L25/16 ,  H01L27/15 ,  H01L25/075

Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

公开(公告)号：US12057520B2

公开(公告)日：2024-08-06

申请号：US16918753

申请日：2020-07-01

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao ,  Shuang Liang

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/0093 ,  H01L27/156 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/005

Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.

公开(公告)号：US12132160B2

公开(公告)日：2024-10-29

申请号：US17615075

申请日：2020-11-04

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Ke Wang ,  Muxin Di ,  Shuang Liang ,  Yankai Gao

IPC: H01L33/62 ,  G09F9/302 ,  H01L25/075 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  G09F9/3026 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

公开(公告)号：US11424232B2

公开(公告)日：2022-08-23

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Ke Wang ,  Zhiwei Liang ,  Muxin Di ,  Zhanfeng Cao ,  Shuang Liang ,  Guangcai Yuan ,  Qi Yao ,  Dongni Liu

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

公开(公告)号：US11387291B2

公开(公告)日：2022-07-12

申请号：US16605493

申请日：2019-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang Liang ,  Yingwei Liu ,  Zhanfeng Cao ,  Zhiwei Liang ,  Muxin Di

IPC: H01L27/32 ,  H01L41/113

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.