公开(公告)号：US20240258475A1

公开(公告)日：2024-08-01

申请号：US18018723

申请日：2022-01-26

Applicant: BOE MLED Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Heling Zhu ,  Chenchang Chen ,  Xiawei Yun ,  Yuanhao Sun

IPC: H01L33/60 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753

Abstract: A display panel relates to the display technical field, including a substrate; at least one light-emitting unit, located on the substrate; first reflective walls, arranged surrounding the light-emitting unit, wherein a height of the first reflective walls along a direction perpendicular to the substrate is greater than a height of the light-emitting unit along the direction perpendicular to the substrate; and a first microstructure layer, located on a side of the first reflective wall away from the substrate, wherein orthographic projections of the first microstructure layer on the substrate at least overlap orthographic projections of the first reflective walls on the substrate, and a distance between the first microstructure layer and the substrate along the direction perpendicular to the substrate is greater than or equal to a distance between a surface of the first reflective walls away from the substrate and the substrate along the direction perpendicular to the substrate.

公开(公告)号：US12278213B2

公开(公告)日：2025-04-15

申请号：US17422220

申请日：2020-10-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing Wang ,  Meng Yan ,  Qingxun Zhang ,  Qian Wu ,  Xuan Feng ,  Xiawei Yun ,  Guangcai Yuan ,  Xue Dong ,  Muxin Di ,  Zhiwei Liang ,  Ke Wang

IPC: H01L27/15 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H10K59/35

Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.

公开(公告)号：US12021173B2

公开(公告)日：2024-06-25

申请号：US17435016

申请日：2020-11-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing Wang ,  Binbin Tong ,  Lizhen Zhang ,  Chenyang Zhang ,  Zhen Zhang ,  Xiawei Yun ,  Guangcai Yuan ,  Xue Dong ,  Muxin Di ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/46 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.