Display module
    6.
    发明授权
    Display module 有权
    显示模块

    公开(公告)号:US09383599B2

    公开(公告)日:2016-07-05

    申请号:US14494841

    申请日:2014-09-24

    IPC分类号: G02F1/1333 G02F1/1335

    摘要: The present disclosure provides a display module, comprising a light guide plate; a display panel arranged on one side of the light guide plate; a fixing element capable of being fixed on a peripheral edge of the display panel; a backboard arranged on one side of the light guide plate far away from the display panel; and a rubber frame arranged on the periphery of the light guide plate, wherein the rubber frame is connected and fixed to the backboard, and further engageably connected to the fixing element so as to fix the display panel.

    摘要翻译: 本公开提供了一种显示模块,包括导光板; 布置在所述导光板的一侧的显示面板; 能够固定在显示面板的周缘上的固定元件; 布置在所述导光板的远离所述显示面板的一侧的背板; 以及布置在所述导光板的周边上的橡胶框架,其中所述橡胶框架连接并固定到所述背板,并且进一步可接合地连接到所述固定元件以固定所述显示面板。

    Backlight and liquid crystal module
    7.
    发明授权
    Backlight and liquid crystal module 有权
    背光和液晶模块

    公开(公告)号:US09291761B2

    公开(公告)日:2016-03-22

    申请号:US14017748

    申请日:2013-09-04

    IPC分类号: G02F1/13357 F21V8/00

    摘要: A backlight and a liquid crystal module having the same are provided. The backlight comprises: a light guide plate, a light-guide-plate fixing element for fixing the light guide plate, and at least one light source disposed adjacent to the light guide plate, wherein the light-guide-plate fixing element is made of thermal-contractive material. As the light-guide-plate fixing element is made of thermal-contractive material, in a test environment of high temperature and high humidity, it is possible to ensure that the light guide plate can expand and contract freely without resistance; meanwhile; while at normal temperatures, as the tight-guide-plate fixing element is in contact with the light guide plate without gap therebetween.

    摘要翻译: 提供背光源和具有该背光源的液晶模块。 背光源包括:导光板,用于固定导光板的导光板固定元件和邻近导光板设置的至少一个光源,其中导光板固定元件由 热收缩材料。 由于导光板固定元件由热收缩材料制成,在高温高湿的测试环境中,可以确保导光板能够自由地展开和收缩而不受阻; 与此同时; 而在正常温度下,由于紧固导向板固定元件与导光板接触而没有间隙。

    LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE

    公开(公告)号:US20220320056A1

    公开(公告)日:2022-10-06

    申请号:US17434835

    申请日:2021-04-08

    IPC分类号: H01L25/16 H01L23/00

    摘要: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

    LED backlight structure and manufacturing method thereof

    公开(公告)号:US11262618B1

    公开(公告)日:2022-03-01

    申请号:US17212832

    申请日:2021-03-25

    摘要: The present disclosure relates to an LED backlight structure having a backlight side and a light outgoing side opposite to each other, including: an LED array on a transparent substrate; a transparent encapsulation layer on a side of the transparent substrate with the LED array, and configured to encapsulate the LED array; wherein the LED array is configured to emit light, the LED backlight structure further includes: a reflection layer on a backlight side of the transparent substrate and configured to reflect light to the light outgoing side; and a first microstructure layer on the light outgoing side of the transparent substrate and the LED array, wherein the first microstructure layer is configured to scatter light incident on a surface of the first microstructure layer, so that a part of light passes through the first microstructure layer, and the rest of light is reflected by the first microstructure layer.