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公开(公告)号：US20220293635A1
公开(公告)日：2022-09-15
申请号：US17529969
申请日：2021-11-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chenyang Zhang , Fuqiang Li , Xue Dong , Meili Wang , Xuan Liang , Fei Wang , Mingxing Wang , Zhanfeng Cao , Yanling Han , Xinxin Zhao
IPC: H01L27/12
Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.
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公开(公告)号：US12211859B2
公开(公告)日：2025-01-28
申请号：US17641557
申请日：2021-03-19
Inventor： Chunping Long , Qi Qi , Wanzhi Chen , Xinxin Zhao
Abstract: A light-emitting substrate and a display device. The light-emitting substrate includes a base substrate, an electrode layer and a definition pattern layer; the electrode layer is at a side of the base substrate, and the definition pattern layer is at a side of the electrode layer away from the base substrate; the electrode layer includes a first electrode, and the definition pattern layer covers at least a part of the first electrode; the definition pattern layer includes a plurality of first openings, the plurality of first openings expose a same first electrode. Therefore, the light-emitting substrate can ensure the bonding success rate of the light-emitting substrate, and thus can further improve the product yield of the light-emitting substrate.
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公开(公告)号：US20240297176A1
公开(公告)日：2024-09-05
申请号：US18026465
申请日：2022-06-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can Zhang , Xinxin Zhao , Ning Cong , Minghua Xuan , Xiaochuan Chen
IPC: H01L27/12 , H01L25/075 , H01L25/16 , H01L33/38 , H01L33/62
CPC classification number: H01L27/124 , H01L25/0753 , H01L25/167 , H01L33/382 , H01L33/62 , H01L2933/0066
Abstract: An array baseplate and a preparation method thereof, and a display device. The array baseplate includes: a substrate; a drive unit disposed on one side of the substrate; and a light-emitting unit including at least one light-emitting subunit and disposed on a side of the substrate away from the drive unit, wherein the light-emitting unit is electrically connected to the drive unit through a wiring penetrating the substrate, and at least part area of each light-emitting subunit is in direct contact with the substrate. The light-emitting unit and the drive unit in the array baseplate are located on two sides of the substrate, and at least part area of the light-emitting subunit is in direct contact with the substrate.
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公开(公告)号：US20220293576A1
公开(公告)日：2022-09-15
申请号：US17536268
申请日：2021-11-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Meili Wang , Xuan Liang , Fei Wang , Lei Wang , Yafeng Yang , Xue Dong , Zhanfeng Cao , Mingxing Wang , Fuqiang Li , Chenyang Zhang , Xinxin Zhao , Yanling Han , Lei Wang , Xuan Feng , Yapeng Li
IPC: H01L25/16 , H01L33/62 , H01L27/146 , H01L21/66
Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.
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Patent Agency Ranking
5.发明授权公开(公告)号：US12191421B2
公开(公告)日：2025-01-07
申请号：US17761253
申请日：2021-03-19
Inventor： Chunping Long , Qi Qi , Xinxin Zhao , Wanzhi Chen
IPC: H01L33/38 , H01L25/075 , H01L25/16 , H01L33/62
Abstract: A light emitting substrate and a display device are provided, the light emitting substrate includes: a base substrate: an electrode planarization layer, on the base substrate: an electrode layer, at a side of the electrode planarization layer away from the base substrate, the electrode layer includes a first electrode and a second electrode, the first electrode includes at least one first electrode strip, the second electrode includes at least one second electrode strip, the first electrode strip and the second electrode strip are spaced and alternately arranged in a first direction, each of the at least one first electrode strip and each of the at least one second electrode strip extend along a second direction, the electrode planarization layer includes a first groove between a first electrode strip and a second electrode strip which are adjacent to each other, the first groove is configured to accommodate a light emitting diode.
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公开(公告)号：US20240413288A1
公开(公告)日：2024-12-12
申请号：US18696006
申请日：2023-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Can Zhang , Xinxin Zhao , Ning Cong , Minghua Xuan , Xiaochuan Chen
Abstract: Provided are a display base plate and a preparation method thereof and a display apparatus, belonging to the technical field of display devices. The display base plate comprises a substrate, and a light-emitting diode and a driving circuit which are patterned and arranged on one side of the substrate, and the light-emitting diode comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are stacked; and the driving circuit is respectively connected with the first semiconductor layer and the second semiconductor layer, and is used for driving the light-emitting diode to emit light. By the display base plate and the preparation method thereof and the display apparatus provided by the embodiment of the application, the difficulty of integrating the driving circuit and the light-emitting diode in the display base plate can be reduced, so that a preparation process of the display base plate is simpler.
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公开(公告)号：US12210246B2
公开(公告)日：2025-01-28
申请号：US17770820
申请日：2021-05-21
Inventor： Xiaojuan Wu , Jiaxing Wang , Xuan Zhong , Hongliang Yuan , Yao Bi , Jinshuai Duan , Feng Qu , Xinxin Zhao , Jian Wang
IPC: G02F1/1339 , G02F1/1335 , G02F1/1337 , G02F1/1368
Abstract: An array substrate, an opposite substrate and a display panel are provided. The array substrate comprises: a display region and a periphery region surrounding the display region, wherein the display region comprises a plurality of pixel regions, and each of the pixel regions comprises a reflective region and a transmissive region; the reflective region comprises a driving signal outputting layer, a segment gap layer, a passivation layer and a reflective layer, the reflective layer is coupled to the driving signal outputting layer to enable both the reflective layer and the driving signal outputting layer to function as a reflective region driving electrode; the transmissive region comprises a first electrode layer, the first electrode layer is coupled to the driving signal outputting layer, the passivation layer extends to the transmissive region, and the passivation layer is arranged between the first electrode layer and a first base of the display substrate.
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公开(公告)号：US20240429357A1
公开(公告)日：2024-12-26
申请号：US18274486
申请日：2022-08-31
Applicant: BOE Technology Group Co., Ltd.
Inventor： Can Zhang , Ning Cong , Xinxin Zhao , Minghua Xuan
Abstract: The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus. The light emitting panel includes: a driving baseboard, including first conductive portions and driving units arranged in an array, and the first conductive portions are insulated from the driving units; light emitting devices arranged on the driving baseboard in an array, each of the light emitting devices includes a first electrode and a second electrode, the second electrode being electrically connected to one of the driving units, and the first electrode being electrically connected to the first conductive portion; a junction where at least one first electrode is electrically connected to the first conductive portion is different from junctions where first electrodes other than said first electrode are electrically connected to first conductive portions other than said first conductive portion.
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公开(公告)号：US20240258279A1
公开(公告)日：2024-08-01
申请号：US18016589
申请日：2022-02-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue Dong , Guangcai Yuan , Xin Gu , Junwei Yan , Fei Wang , Xiao Zhang , Haixu Li , Xuan Liang , Chengfei Wang , Mingxing Wang , Shulei Li , Xiaolei Zhang , Xinxin Zhao
IPC: H01L25/075 , H01L21/68 , H01L33/00
CPC classification number: H01L25/0753 , H01L21/681 , H01L33/0093
Abstract: An optical path structure, an optical path system, and a transfer method. The optical path structure includes a beam adjustment module configured to adjust a diameter of a laser beam and output a first beam; a beam shaping module configured to perform energy homogenization on the first beam to obtain a second beam; and a beam focusing module configured to focus the second beam and output a target light spot; the target light spot is used for irradiating a device substrate, so that a bonding material in the device substrate changes after being irradiated by the target light spot, and a target device is separated from a carrier substrate; where the bonding material is disposed between the target device and the carrier substrate.
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