Power distribution network using buried power rail

    公开(公告)号:US10886224B2

    公开(公告)日:2021-01-05

    申请号:US16561340

    申请日:2019-09-05

    Abstract: A tap cell configured to enable electrical connection from a buried power rail of an integrated circuit to a power distribution network includes. The tap cell includes a buried power rail layer including VDD and VSS power supply lines, insulating layers and metal layers alternately arranged on the buried power rail layer, a first power supply interconnect in metal layer M1 or higher electrically coupled to the VDD power supply line, and a second power supply interconnect in metal layer M1 or higher electrically connected to the VSS power supply line. The first power supply interconnect and the second power supply interconnect are configured to be electrically connected to the power distribution network, and the VDD and VSS power supply lines are configured to supply power from the power distribution network to the buried power rail of the integrated circuit. The tap cell is free of any active semiconductor devices.

    SEMICONDUCTOR DEVICES INCLUDING FINFETS AND LOCAL INTERCONNECT LAYERS AND METHODS OF FABRICATING THE SAME
    30.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING FINFETS AND LOCAL INTERCONNECT LAYERS AND METHODS OF FABRICATING THE SAME 有权
    包括FinFET和局部互连层的半导体器件及其制造方法

    公开(公告)号:US20150194427A1

    公开(公告)日:2015-07-09

    申请号:US14534536

    申请日:2014-11-06

    Abstract: Semiconductor devices and methods of forming the same are provided. The semiconductor devices may include a finFET, a metal routing layer, a first local interconnect layer, and a second local interconnect layer. The finFET may include a channel, a first source/drain region, a second source/drain region, and a gate stack. The metal routing layer may be separated from the finFET in a vertical direction. The first local interconnect layer may include a first local interconnect that contacts a first metal route in the metal routing layer and that electrically connects to the first source/drain region. The second local interconnect layer may include a second local interconnect that contacts a second metal route in the metal routing layer and that electrically connects to the gate stack.

    Abstract translation: 提供了半导体器件及其形成方法。 半导体器件可以包括finFET,金属布线层,第一局部互连层和第二局部互连层。 finFET可以包括沟道,第一源极/漏极区域,第二源极/漏极区域和栅极堆叠。 金属布线层可以在垂直方向上与finFET分离。 第一局部互连层可以包括接触金属布线层中的第一金属路径并且电连接到第一源极/漏极区的第一局部互连。 第二局部互连层可以包括接触金属布线层中的第二金属路径并且电连接到栅极堆叠的第二局部互连。

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