公开(公告)号：US11802078B2

公开(公告)日：2023-10-31

申请号：US17529736

申请日：2021-11-18

Applicant: Samsung Display Co., Ltd.

Inventor： Alexander Voronov ,  Hyungsik Kim ,  Sunggyu Park ,  Junghwa You ,  Joongsung Lee ,  Woohyun Jung ,  Gyoowan Han

IPC: C03C15/00 ,  C03C17/00 ,  C03C23/00

CPC classification number: C03C15/00 ,  C03C17/002 ,  C03C23/0025 ,  C03C2218/328 ,  C03C2218/355

Abstract: A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.

公开(公告)号：US20190172713A1

公开(公告)日：2019-06-06

申请号：US16204850

申请日：2018-11-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： AKIFUMI SANGU ,  Gyoowan Han ,  Jekil Ryu ,  Kyungjae Lee

IPC: H01L21/02 ,  G02B27/28 ,  G01J1/42 ,  G02B27/10 ,  H01L21/67 ,  H01L27/12 ,  B23K26/067 ,  B23K26/064

Abstract: A laser crystallizing apparatus includes a first light source unit configured to emit a first input light having a linearly polarized laser beam shape. A second light source unit is configured to emit a second input light having a linearly polarized laser beam shape. A polarization optical system is configured to rotate the first input light and/or the second input light at a predetermined rotation angle. An optical system is configured to convert the first input light and the second input light, which pass through the polarization optical system, into an output light. A target substrate is seated on a stage and output light is directed onto the target substrate. A monitoring unit is configured to receive the first input light or the second input light from the polarization optical system and measure a laser beam quality thereof.

公开(公告)号：US20180175323A1

公开(公告)日：2018-06-21

申请号：US15815098

申请日：2017-11-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： JOOSEOB AHN ,  Seongchae Jeong ,  Inae Han ,  Hyojin Kim ,  Jekil Ryu ,  Jaeseok Park ,  Gyoowan Han

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0097 ,  H01L51/5246 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5338 ,  Y02E10/549

Abstract: A method of manufacturing a display apparatus includes forming a plurality of display units including bending areas on a mother substrate. Each of the plurality of display units include a bending area configured to be bent about a bending axis. A protection film is attached to a lower surface of the mother substrate. The protection film includes a protection film base and an adhesive layer. An opening or a groove is formed corresponding to the bending area of each of the plurality of display units by removing at least a portion of the protection film. The mother substrate and the protection film are cut to separate the plurality of display units from each other. The mother substrate is bent about the bending axis. The removing of the at least a portion of the protection film is performed by a laser beam.

公开(公告)号：US20180174836A1

公开(公告)日：2018-06-21

申请号：US15848086

申请日：2017-12-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Emil Aslanov ,  Jekil Ryu ,  Haesook Lee ,  Gyoowan Han

IPC: H01L21/02 ,  H01L29/786 ,  H01L21/268 ,  H01L29/66 ,  H01L27/12 ,  B23K26/06

CPC classification number: H01L21/02675 ,  B23K26/0608 ,  B23K26/0648 ,  B23K26/0676 ,  B23K2103/56 ,  H01J9/241 ,  H01J29/467 ,  H01L21/02532 ,  H01L21/02595 ,  H01L21/02678 ,  H01L21/268 ,  H01L27/1277 ,  H01L27/1285 ,  H01L29/6675 ,  H01L29/78672 ,  H01S5/005 ,  H01S5/4012

Abstract: A laser polycrystallization apparatus including: a light source for emitting a laser beam; a diffraction grating for receiving the laser beam from the light source, changing a path and a magnitude of the received laser beam, and outputting the changed laser beam; a light split portion for splitting the laser beam received from the diffraction grating; and a light superposition portion for superposing the split laser beams received from the light split portion and irradiating the superposed split laser beams to a substrate. An angle between the laser beam irradiated to an incidence surface of the diffraction grating from the light source and a line substantially perpendicular to an emission surface of the diffraction grating is an acute angle.

公开(公告)号：US20180133842A1

公开(公告)日：2018-05-17

申请号：US15814231

申请日：2017-11-15

Applicant: Samsung Display Co., Ltd.

Inventor： Ilyoung Jeong ,  Gyoowan Han ,  Jaeil Kim ,  Kuhyun Kang ,  Soobum Park

IPC: B23K26/38 ,  B23K26/04 ,  B23K26/0622

CPC classification number: B23K26/38 ,  B23K26/03 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/402 ,  B23K2103/54 ,  C03B33/04 ,  C03B33/091

Abstract: A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.

公开(公告)号：US09755192B2

公开(公告)日：2017-09-05

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L21/00 ,  H01L51/56 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/06 ,  B23K26/40 ,  B23K26/402 ,  H01L51/52 ,  B23K103/00

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

公开(公告)号：US20160315293A1

公开(公告)日：2016-10-27

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L51/56 ,  B23K26/18 ,  B23K26/0622 ,  H01L51/52 ,  B23K26/38

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

Abstract translation: 切割基板的方法包括：在所述基板的第一表面上形成第一保护层; 通过用第一激光束照射所述第一保护层的所述第一保护层，形成除去所述第一保护层的一部分的去除区域; 以及在用所述第一激光束照射所述第一保护层之后，通过在所述去除区域处用第二激光束照射所述基板来去除所述基板的一部分而形成切割区域。

公开(公告)号：US11358240B2

公开(公告)日：2022-06-14

申请号：US15973462

申请日：2018-05-07

Applicant: Samsung Display Co., Ltd.

Inventor： Taekil Oh ,  Gyoowan Han ,  Wonyong Kim ,  Seungho Myoung ,  Jaeseok Park ,  Alexander Voronov ,  Jinhong Jeun

IPC: B23K26/362 ,  C22C38/08 ,  B23K26/067 ,  B23K26/082 ,  B23K26/06 ,  B23K26/382 ,  B23K103/02

Abstract: A method of manufacturing a deposition mask includes: a splitting process in which a laser beam irradiated from a light source is split into a plurality of laser beams; a scanning process in which the plurality of laser beams are simultaneously scanned onto the mask substrate; and a tuning process in which irradiation states of the plurality of laser beams are finely changed to correspond to shapes of the plurality of pattern holes while the plurality of laser beams are scanned.

公开(公告)号：US11351632B2

公开(公告)日：2022-06-07

申请号：US16191575

申请日：2018-11-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jaebum Pahk ,  Jeongho Yi ,  Dokyun Kwon ,  Kyongho Hong ,  Jihun Kang ,  Cheollae Roh ,  Gyoowan Han

IPC: B23K26/142 ,  B23K26/14 ,  B23K26/16 ,  B23K26/38 ,  B23K26/402 ,  B23K37/04 ,  B23K101/36

Abstract: A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

公开(公告)号：US11273523B2

公开(公告)日：2022-03-15

申请号：US15708927

申请日：2017-09-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungyong Lee ,  Jaeha Lim ,  Gyoowan Han

IPC: B23K26/38 ,  B08B5/04 ,  B25B11/00 ,  B23K26/70 ,  B08B15/00 ,  B23K26/16 ,  B23K37/04

Abstract: A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.