公开(公告)号：US12162793B2

公开(公告)日：2024-12-10

申请号：US17577846

申请日：2022-01-18

Applicant: Samsung Display Co., Ltd.

Inventor： Cheollae Roh ,  Voronov Alexander ,  Hyungsik Kim ,  Emil Aslanov ,  Sunggyu Park ,  Joongsung Lee ,  Woohyun Jung

IPC: C03B33/02 ,  C03C15/00

Abstract: A window manufacturing method includes providing a mother substrate on a moving stage, the mother substrate including a cutting line; irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate and to form a target substrate; separating the target substrate from the mother substrate; and providing an etchant to the target substrate to chamfer the target substrate. The first beam is irradiated to the cutting line of the mother substrate, the second beam is irradiated to a point spaced apart from the cutting line of the mother substrate by a distance, and a pulse energy of the first beam is different from a pulse energy of the second beam.

公开(公告)号：US11802078B2

公开(公告)日：2023-10-31

申请号：US17529736

申请日：2021-11-18

Applicant: Samsung Display Co., Ltd.

Inventor： Alexander Voronov ,  Hyungsik Kim ,  Sunggyu Park ,  Junghwa You ,  Joongsung Lee ,  Woohyun Jung ,  Gyoowan Han

IPC: C03C15/00 ,  C03C17/00 ,  C03C23/00

CPC classification number: C03C15/00 ,  C03C17/002 ,  C03C23/0025 ,  C03C2218/328 ,  C03C2218/355

Abstract: A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.