Device and method of cutting polarizing plate

    公开(公告)号:US11084129B2

    公开(公告)日:2021-08-10

    申请号:US15828241

    申请日:2017-11-30

    Abstract: A polarizing plate-cutting device including a laser beam generator configured to emit a laser beam, a scanner including a rotating mirror configured to reflect the laser beam emitted from the laser beam generator, and a housing accommodating the rotating mirror, a condenser lens configured to condense the laser beam reflected from the rotating mirror, and a mounting block onto which the laser beam condensed by the condenser lens is irradiated and to which a polarizing plate is mounted, wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and wherein the polarizing plate includes a stacking of a base substrate and a polarizing layer, the base substrate being closer to the condenser lens than the polarizing layer, and a heat resistance of the polarizing layer being lower than that of the base substrate.

    Device and method of cutting polarizing plate

    公开(公告)号:US12151313B2

    公开(公告)日:2024-11-26

    申请号:US17387950

    申请日:2021-07-28

    Abstract: A polarizing plate-cutting device including a laser beam generator configured to emit a laser beam, a scanner including a rotating mirror configured to reflect the laser beam emitted from the laser beam generator, and a housing accommodating the rotating mirror, a condenser lens configured to condense the laser beam reflected from the rotating mirror, and a mounting block onto which the laser beam condensed by the condenser lens is irradiated and to which a polarizing plate is mounted, wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and wherein the polarizing plate includes a stacking of a base substrate and a polarizing layer, the base substrate being closer to the condenser lens than the polarizing layer, and a heat resistance of the polarizing layer being lower than that of the base substrate.

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