公开(公告)号：US20200205735A1

公开(公告)日：2020-07-02

申请号：US16238143

申请日：2019-01-02

申请人： International Business Machines Corporation

发明人： Rajeev Narayanan ,  Katsuyuki Sakuma ,  John Knickerbocker ,  Bucknell C. Webb

IPC分类号： A61B5/00 ,  H02S40/30 ,  G06F3/01

摘要： Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.

公开(公告)号：US20180348259A1

公开(公告)日：2018-12-06

申请号：US16040621

申请日：2018-07-20

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC分类号： G01R1/073 ,  H01L23/00 ,  B81C1/00 ,  G01R31/26 ,  B81B3/00 ,  B23K35/00

CPC分类号： G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

摘要： A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

公开(公告)号：US09893047B2

公开(公告)日：2018-02-13

申请号：US15490377

申请日：2017-04-18

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Bing Dang ,  John Knickerbocker

IPC分类号： H01L21/66 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/683 ,  H01L25/16 ,  H01L25/18 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L25/07

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

摘要： Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US20170221872A1

公开(公告)日：2017-08-03

申请号：US15490377

申请日：2017-04-18

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Bing Dang ,  John Knickerbocker

IPC分类号： H01L25/00 ,  H01L21/66 ,  H01L21/78 ,  H01L25/18 ,  H01L25/16 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

摘要： Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US09568960B2

公开(公告)日：2017-02-14

申请号：US14627657

申请日：2015-02-20

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Evan G. Colgan ,  Monty M. Denneau ,  John Knickerbocker

IPC分类号： H01L23/473 ,  G06F1/18 ,  G06F1/20 ,  H01L23/367 ,  H01L23/498

CPC分类号： G06F1/185 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/367 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2224/92242 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2224/81

摘要： A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

摘要翻译： 半导体结构包括具有冷却层的衬底，冷却通道，与冷却通道流体连通的冷却剂入口和出口，以及具有一个或多个连接点和器件层区域的冷却层上的器件层。 器件层的热膨胀系数基本上等于冷却层的热膨胀系数。 多个层叠基板设置在器件层上并电连接到器件层。 叠层基板的热膨胀系数与装置层的热膨胀系数不同，每个层压基板的尺寸小于与其相连的装置层部分，并且各层叠基板在相邻层叠基板的侧面之间具有间隙。 层压基板在它们之间的间隙彼此不电或机械连接，并且层叠基板足够小以防止由于热膨胀而引起的装置，互连和冷却层翘曲。

公开(公告)号：US20160084882A1

公开(公告)日：2016-03-24

申请号：US14962331

申请日：2015-12-08

申请人： International Business Machines Corporation

发明人： Bing Dang ,  Yu Luo ,  John Knickerbocker ,  Yang Liu ,  Steven L. Wright

IPC分类号： G01R1/073 ,  G01R31/28

CPC分类号： G01R1/07314 ,  B23K35/00 ,  B81C1/00111 ,  G01R31/2886 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/92 ,  H01L2224/92222 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/01104 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/563

摘要： A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.

摘要翻译： 用于在单次探测中测试晶片上的多个芯片的测试探头。 探头头基板包括在一个表面上的探针尖端附接垫的阵列。 该阵列包括每个探针头芯片测试点的子阵列。 探针尖端附着在每个探头尖端附着垫上，头尖高度变化小于1微米（1微米）。 子阵列探针尖端可以在等于或小于50微米（50μm）的间距上。 测试探头可以在单次探测中测试探测单个晶圆上的所有芯片，甚至可以探测单个晶片上的所有芯片。

公开(公告)号：US20150241476A1

公开(公告)日：2015-08-27

申请号：US14708198

申请日：2015-05-09

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC分类号： G01R1/073 ,  B81B3/00 ,  G01R31/26

CPC分类号： G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

摘要： A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

摘要翻译： 在物品上形成表面突起的方法，以及附着有突起物的物品。 该物品可以是集成电路（IC）芯片，用于IC芯片的测试探针或任何合适的衬底或纳米结构。 表面突起电镀到模板或模具晶片上，转移到制品上，并容易地与模板晶片分离。 因此，附着的突起可以是例如IC芯片或衬底上的微凸起或微柱，探针头上的测试探针或微机或微传感器中的一个或多个悬臂膜或其它微电子 机械系统（MEMS）形成，而不会削弱MEMS结构。

公开(公告)号：US20240332121A1

公开(公告)日：2024-10-03

申请号：US18128745

申请日：2023-03-30

申请人： International Business Machines Corporation

发明人： Mukta Ghate Farooq ,  John Knickerbocker ,  Keiji Matsumoto

IPC分类号： H01L23/373

CPC分类号： H01L23/3735 ,  H01L23/3731 ,  H05K1/0204

摘要： An electronic device in which an electrically-insulating and highly thermal conductive sheet is located at the interconnect level is provided. The presence of the electrically-insulating and highly thermal conductive sheet at the interconnect level provides a significant reduction in the temperature of the electronic device, without causing excess stress in the electronic device. This results in electronic devices that have improved performance and reliability.

公开(公告)号：US20240170288A1

公开(公告)日：2024-05-23

申请号：US18056393

申请日：2022-11-17

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Mukta Ghate Farooq ,  Qianwen Chen ,  Shahid Butt ,  Eric Perfecto ,  Michael P. Belyansky ,  Katsuyuki Sakuma ,  John Knickerbocker

IPC分类号： H01L21/027 ,  H01L23/528 ,  H01L23/535

CPC分类号： H01L21/0275 ,  H01L23/5286 ,  H01L23/535

摘要： A stack structure that includes: a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and the handler wafer, wherein one or both of the device wafer and the handler wafer have a release layer that is configured to be substantially or completely vaporized by infrared ablation when exposed to an infrared laser energy. The device wafer includes at least two consecutive layers adjacent the bonding structure that together include a plurality of fill portions that substantially or completely disable entry of the infrared laser energy into a plurality of layers of the device wafer below the two consecutive layers adjacent the bonding structure.

公开(公告)号：US20240153894A1

公开(公告)日：2024-05-09

申请号：US18053774

申请日：2022-11-09

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： John Knickerbocker ,  Mukta Ghate Farooq ,  Keiji Matsumoto

IPC分类号： H01L23/00 ,  H01L25/065

CPC分类号： H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L2224/0231 ,  H01L2224/02372 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05576 ,  H01L2224/05647 ,  H01L2224/05687 ,  H01L2224/08055 ,  H01L2224/08056 ,  H01L2224/08145 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/351

摘要： Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a first semiconductor wafer and a second semiconductor wafer; and a bonding structure between the first semiconductor wafer and the second semiconductor wafer, where the bonding structure includes a first coaxial pad embedded in a first dielectric layer and a second coaxial pad embedded in a second dielectric layer, and the first coaxial pad is substantially aligned with the second coaxial pad. In one embodiment, the first coaxial pad includes an inner pad of substantially rectangular shape and an outer pad of substantially rectangular ring shape surrounding the inner pad.