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公开(公告)号：US20240248025A1
公开(公告)日：2024-07-25
申请号：US18156692
申请日：2023-01-19
发明人： Vince Siu , Bing Dang , Bo Wen , Kuan Yu Hsieh
CPC分类号： G01N21/11 , G01N1/38 , G01N21/03 , G01N21/251 , G01N2021/0325
摘要： A liquid metering and mixing system for preparing a plurality of samples for analysis. The system includes: a liquid metering apparatus disposed in fluid communication with a sample holder and a plurality of reaction chambers and configured to meter a volume of a liquid into each of the plurality of reaction chambers, wherein each of the plurality of reaction chambers includes a reagent; and a mixing apparatus comprising a plurality of mixing elements, wherein each of the plurality of mixing elements is disposed in a corresponding reaction chamber of the plurality of reaction chambers and is adapted to mix the volume of the liquid with the reagent in preparation for analysis
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公开(公告)号：US12014816B2
公开(公告)日：2024-06-18
申请号：US17130534
申请日：2020-12-22
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Leanna Pancoast
IPC分类号： G16H40/20 , A61B5/00 , G06N20/00 , G06Q10/1093 , G06Q50/06 , G06Q50/26 , G16H10/60 , G16H40/40 , G16H40/67 , G16H50/20 , G16H50/70 , H04L9/32
CPC分类号： G16H40/20 , A61B5/7264 , A61B5/7275 , A61B5/747 , G06N20/00 , G06Q10/1095 , G06Q50/06 , G06Q50/26 , G16H10/60 , G16H40/40 , G16H40/67 , G16H50/20 , G16H50/70 , H04L9/32 , A61B2560/0214
摘要： A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.
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公开(公告)号：US20240050039A1
公开(公告)日：2024-02-15
申请号：US18496010
申请日：2023-10-27
发明人： RAJEEV NARAYANAN , Bing Dang , Katsuyuki Sakuma
IPC分类号： A61B5/00
CPC分类号： A61B5/6826 , A61B5/0017 , A61B5/0002 , H01B9/003
摘要： A method, a computer program product, and a computer system for a modular sensing unit is provided. The method includes mounting a sensor module of the modular sensing unit to a surface. Data of the surface is measured via a sensor component. The data is transmitted from the sensor module to a component module of the modular sensing unit via a power cable ribbon, and a metric is determined by the component module based on the data.
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公开(公告)号：US11587860B2
公开(公告)日：2023-02-21
申请号：US16812356
申请日：2020-03-08
发明人： John Knickerbocker , Bing Dang , Raymond Horton , Joana Maria
IPC分类号： H01L23/498 , H01L23/48 , H01L21/683 , H01L21/48 , H01L21/20 , H01L21/768
摘要： Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.
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公开(公告)号：US20220248958A1
公开(公告)日：2022-08-11
申请号：US17173181
申请日：2021-02-10
发明人： Bo Wen , Bing Dang , Jeffrey L. Rogers , Duixian Liu
IPC分类号： A61B5/00
摘要： A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor. The server processor implements a software controller; and a skin-mountable WON tethered satellite that includes a wired satellite-server interface, coupled to the wearable WON server, and a tethered satellite near-field communications (NFC) wireless interface, configured to communicate with the hub-satellite NFC wireless interface, and coupled to the wired satellite-server interface.
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公开(公告)号：US20220199235A1
公开(公告)日：2022-06-23
申请号：US17130534
申请日：2020-12-22
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Leanna Pancoast
IPC分类号： G16H40/20 , G16H40/67 , G16H50/20 , G16H50/70 , G16H10/60 , G16H40/40 , G06Q50/06 , G06Q50/26 , G06Q10/10 , G06N20/00 , H04L9/32 , A61B5/00
摘要： A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.
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公开(公告)号：US11362382B2
公开(公告)日：2022-06-14
申请号：US15416564
申请日：2017-01-26
发明人： Paul S. Andry , Bing Dang , John U. Knickerbocker , Yang Liu , Jae-Woong Nah , Adinath Narasgond , Bucknell C. Webb
IPC分类号： H01M50/10 , H01M50/209 , H01M6/40 , H01M10/04
摘要： A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.
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公开(公告)号：US20220142571A1
公开(公告)日：2022-05-12
申请号：US17095101
申请日：2020-11-11
发明人： Bing Dang , RAJEEV NARAYANAN , JEFFREY L. ROGERS
摘要： Embodiments of the present invention provide an oral device. According to one embodiment of the present invention, a mouthpiece suitable to detachably engage teeth of an upper jaw is provided. The mouthpiece comprises an adhesive layer configured to attach a hermetically sealed chamber to the mouthpiece. The hermitically sealed chamber fits within a concave space created by the mouthpiece. The hermitically sealed chamber comprises two layers and embedded between those two layers are a pressure sensor, a microphone, an optical sensor, a temperature sensor, a communications module, a storage enclosure, and a biosensor. Each of the pressure sensor, the microphone, the optical sensor, the temperature sensor, the communications module, the storage enclosure, and the biosensor are operably connected within the hermetically sealed chamber.
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公开(公告)号：US11222862B2
公开(公告)日：2022-01-11
申请号：US16658675
申请日：2019-10-21
发明人： Qianwen Chen , Bing Dang , Russell Budd , Bo Wen , Li-Wen Hung , Jae-Woong Nah , John Knickerbocker
IPC分类号： H01L23/00 , H01L21/683 , H01L25/00
摘要： Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 μm to about 100 μm, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
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公开(公告)号：US20210366789A1
公开(公告)日：2021-11-25
申请号：US16882624
申请日：2020-05-25
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Joshua M. Rubin , Arvind Kumar
IPC分类号： H01L21/66 , H01L25/00 , H01L25/065 , H01L25/18
摘要： One or more die stacks are disposed on a redistribution layer (RDL) to make an electronic package. The die stacks include a die and one or more Through Silicon Via (TSV) dies. Other components and/or layers, e.g. interposes layers, can be included in the structure. An epoxy layer disposed on the RDL top surface and surrounds and attached to all the TSV die sides and all the die sides. Testing circuitry is located in various locations in some embodiments. Locations including in the handler, die, TSV dies, interposes, etc. Testing methods are disclosed, Methods of making including “die first” and “die last” methods are also disclosed. Methods of making heterogenous integrated structure and the resulting structures are also disclosed, particularly for large scale, e.g. wafer and panel size, applications.
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