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公开(公告)号：US20240264392A1
公开(公告)日：2024-08-08
申请号：US18107299
申请日：2023-02-08
发明人： John Knickerbocker , Qianwen Chen
IPC分类号： G02B6/122
CPC分类号： G02B6/4277
摘要： Co-package optics structures are provided in which an electromagnetic radiation absorption material layer is used to attach an optical link and/or waveguide structure to a coupling area that is located on a photonic integrated chip. The electromagnetic radiation absorption material layer can provide permanent or a non-permanent attachment between the optical link and/or waveguide structure and the coupling area of the photonic integrated chip. In the non-permanent embodiment, testing can be performed to determine whether the optical link and/or waveguide structure is defective, and if determined to be defective, the defective optical link and/or waveguide structure can be replaced by a replacement optical link and/or waveguide structure by removing the electromagnetic radiation absorption material layer that attaches the defective structure.
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2.发明授权公开(公告)号：US12015003B2
公开(公告)日：2024-06-18
申请号：US17488968
申请日：2021-09-29
IPC分类号： H01L21/48 , H01L21/683 , H01L23/00 , H01L23/367 , H01L23/538 , H01L23/66 , H01P3/00 , H01P11/00
CPC分类号： H01L24/20 , H01L21/4857 , H01L21/4871 , H01L21/6835 , H01L23/3675 , H01L23/5383 , H01L23/5386 , H01L23/66 , H01L24/19 , H01P3/003 , H01P11/003 , H01L2221/68368 , H01L2223/6616 , H01L2223/6627 , H01L2224/2105 , H01L2924/17151 , H01L2924/19033
摘要： An interconnect for a semiconductor device includes a laminate substrate; a first plurality of electrical devices in or on a surface of the laminate substrate; a redistribution layer having a surface disposed on the surface of the laminate substrate; a second plurality of electrical devices in or on the surface of the redistribution layer; and a plurality of transmission lines between the first plurality of electrical devices and the second plurality of electrical devices. The surface of the laminate substrate and the surface of the redistribution layer are parallel to each other to form a dielectric structure and a conductor structure.
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公开(公告)号：US12014816B2
公开(公告)日：2024-06-18
申请号：US17130534
申请日：2020-12-22
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Leanna Pancoast
IPC分类号： G16H40/20 , A61B5/00 , G06N20/00 , G06Q10/1093 , G06Q50/06 , G06Q50/26 , G16H10/60 , G16H40/40 , G16H40/67 , G16H50/20 , G16H50/70 , H04L9/32
CPC分类号： G16H40/20 , A61B5/7264 , A61B5/7275 , A61B5/747 , G06N20/00 , G06Q10/1095 , G06Q50/06 , G06Q50/26 , G16H10/60 , G16H40/40 , G16H40/67 , G16H50/20 , G16H50/70 , H04L9/32 , A61B2560/0214
摘要： A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.
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公开(公告)号：US11973058B2
公开(公告)日：2024-04-30
申请号：US17535664
申请日：2021-11-25
IPC分类号： H01L25/065 , H01L21/56 , H01L23/00 , H01L23/053 , H01L23/36 , H01L23/538 , H01L25/00
CPC分类号： H01L25/0655 , H01L21/561 , H01L21/568 , H01L23/053 , H01L23/36 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/562 , H01L24/08 , H01L25/50 , H01L2224/08225
摘要： A semiconductor die package that has a substrate with one or more substrate layers with one or more substrate connections. A substrate layer can include one or more redistribution layers (RDLs). One or more dies (e.g., multiple dies) are disposed on a top substrate layer. The dies have one or more die external connections. Some of the die external connections are electrically connected to one or more substrate connections. One or more metallic dam stiffeners form into a dam enclosure that is disposed on and physically connected to the top substrate layer. The dam enclosure encloses one or more of the dies. The metallic dam enclosure has one or more electrically connected regions where the metallic dam enclosure is electrically connected to one or more of the substrate horizontal connections and one or more electrically insulated regions where the metallic dam enclosure is electrically insulated from one or more of the substrate horizontal connections and the substrate via connections. In different embodiments, the dam enclosure stiffens the substrates/package during manufacture, assembly, and operation; provides confinement for underfill application; and provides a heat conduction path for heat removal. Methods of manufacturing and assembling the die package are disclosed.
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公开(公告)号：US20230087366A1
公开(公告)日：2023-03-23
申请号：US17447948
申请日：2021-09-17
摘要： A carrier wafer, a structure, and a method are disclosed. The carrier wafer includes a wafer layer having a first surface and a second surface opposite the first surface, a first antireflective coating (ARC) layer positioned on the first surface of the wafer layer, a second ARC layer positioned on a surface of the first ARC layer opposite the wafer layer, and a thin release layer positioned on a surface of the second ARC layer opposite the first ARC layer. The structure includes the carrier wafer and a semiconductor device substrate positioned over the thin release layer of the carrier wafer. The method includes obtaining a wafer layer, forming an ARC layer on a surface of the wafer layer, forming a second ARC layer on a surface of the first ARC layer opposite the wafer layer, and forming a thin release layer on the second ARC layer.
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公开(公告)号：US11587860B2
公开(公告)日：2023-02-21
申请号：US16812356
申请日：2020-03-08
发明人： John Knickerbocker , Bing Dang , Raymond Horton , Joana Maria
IPC分类号： H01L23/498 , H01L23/48 , H01L21/683 , H01L21/48 , H01L21/20 , H01L21/768
摘要： Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.
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公开(公告)号：US20220199235A1
公开(公告)日：2022-06-23
申请号：US17130534
申请日：2020-12-22
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Leanna Pancoast
IPC分类号： G16H40/20 , G16H40/67 , G16H50/20 , G16H50/70 , G16H10/60 , G16H40/40 , G06Q50/06 , G06Q50/26 , G06Q10/10 , G06N20/00 , H04L9/32 , A61B5/00
摘要： A mechanism is provided in a data processing system to implement a multi-sensor health monitoring platform. The mechanism applies a machine learning model to predict patient needs and patient activity trends based on physiological features and activity features of the patient. The mechanism applies the machine learning model to predict energy requirements for a plurality of medical sensors based on the predicted patient needs and patient activity trends. The mechanism schedules recharging of the plurality of medical sensors based on the predicted energy requirements and identifying one or more sensors to set to an activate state based on the predicted patient needs and patient activity trends. The mechanism collecting sensor data from the one or more sensors and applies the machine learning model to generate a point-of-care recommendation based on the collected sensor data.
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公开(公告)号：US11222862B2
公开(公告)日：2022-01-11
申请号：US16658675
申请日：2019-10-21
发明人： Qianwen Chen , Bing Dang , Russell Budd , Bo Wen , Li-Wen Hung , Jae-Woong Nah , John Knickerbocker
IPC分类号： H01L23/00 , H01L21/683 , H01L25/00
摘要： Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 μm to about 100 μm, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
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公开(公告)号：US20210366789A1
公开(公告)日：2021-11-25
申请号：US16882624
申请日：2020-05-25
发明人： John Knickerbocker , Bing Dang , Qianwen Chen , Joshua M. Rubin , Arvind Kumar
IPC分类号： H01L21/66 , H01L25/00 , H01L25/065 , H01L25/18
摘要： One or more die stacks are disposed on a redistribution layer (RDL) to make an electronic package. The die stacks include a die and one or more Through Silicon Via (TSV) dies. Other components and/or layers, e.g. interposes layers, can be included in the structure. An epoxy layer disposed on the RDL top surface and surrounds and attached to all the TSV die sides and all the die sides. Testing circuitry is located in various locations in some embodiments. Locations including in the handler, die, TSV dies, interposes, etc. Testing methods are disclosed, Methods of making including “die first” and “die last” methods are also disclosed. Methods of making heterogenous integrated structure and the resulting structures are also disclosed, particularly for large scale, e.g. wafer and panel size, applications.
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公开(公告)号：US10892643B2
公开(公告)日：2021-01-12
申请号：US15920803
申请日：2018-03-14
IPC分类号： H02J50/00 , H04B1/3827 , H02J50/10 , H02J50/80 , H02J50/90 , H02J50/40 , A61L2/26 , A61L2/10 , A61L2/04 , A61L2/16
摘要： Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.
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