Co-package optics structures are provided in which an electromagnetic radiation absorption material layer is used to attach an optical link and/or waveguide structure to a coupling area that is located on a photonic integrated chip. The electromagnetic radiation absorption material layer can provide permanent or a non-permanent attachment between the optical link and/or waveguide structure and the coupling area of the photonic integrated chip. In the non-permanent embodiment, testing can be performed to determine whether the optical link and/or waveguide structure is defective, and if determined to be defective, the defective optical link and/or waveguide structure can be replaced by a replacement optical link and/or waveguide structure by removing the electromagnetic radiation absorption material layer that attaches the defective structure.