公开(公告)号：US07875983B2

公开(公告)日：2011-01-25

申请号：US12591792

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package which includes a first substrate having a pre-designed pattern formed thereon; a first chip mounted by a flip chip method on one side of the first substrate; a support formed to a predetermined thickness on an edge of the first substrate; an interposer having an edge thereof placed on the support, such that the interposer covers the first substrate and forms a cavity between the interposer and the first substrate, and having a pre-designed pattern formed respectively on both sides thereof; a via penetrating the support and the interposer; a second chip mounted on one side of the interposer facing the first substrate; a second substrate placed on the other side of the interposer with at least one conductive ball positioned in-between; and a third chip mounted on the second substrate.

摘要翻译： 一种半导体封装，其包括在其上形成有预先设计的图案的第一基板; 通过倒装芯片方法在所述第一基板的一侧上安装的第一芯片; 在所述第一基板的边缘上形成为预定厚度的支撑件; 插入器，其具有放置在支撑体上的边缘，使得所述插入件覆盖所述第一基板并在所述插入件与所述第一基板之间形成空腔，并且具有分别形成在其两侧的预先设计的图案; 穿过支撑件和插入件的通孔; 第二芯片，安装在所述插入器的面向所述第一基板的一侧上; 放置在所述插入件的另一侧上的第二衬底，其中至少一个导电球定位在其间; 以及安装在所述第二基板上的第三芯片。

公开(公告)号：US20100087034A1

公开(公告)日：2010-04-08

申请号：US12591793

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming a cavity by etching a center portion of a metal oxide layer; mounting a second chip inside the cavity; forming at least one via such that the via penetrates an edge of the metal oxide layer; placing the metal oxide layer on the first substrate such that the second chip and the first chip face each other; and placing a second substrate on the metal oxide layer, the second substrate having a third chip mounted thereon.

摘要翻译： 一种制造半导体封装的方法，包括通过倒装芯片方法将第一芯片安装在第一衬底上，所述第一衬底在其上形成预先设计的图案; 通过蚀刻金属氧化物层的中心部分形成空腔; 在腔内安装第二芯片; 形成至少一个通孔，使得所述通孔穿过所述金属氧化物层的边缘; 将所述金属氧化物层放置在所述第一基板上，使得所述第二芯片和所述第一芯片彼此面对; 以及将第二衬底放置在所述金属氧化物层上，所述第二衬底具有安装在其上的第三芯片。

公开(公告)号：US09087837B2

公开(公告)日：2015-07-21

申请号：US13572833

申请日：2012-08-13

申请人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

发明人： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

IPC分类号： H01L23/28 ,  H01L21/52 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/538 ,  H01L21/768 ,  H01L23/544 ,  H01L21/54 ,  H01L21/78

CPC分类号： H01L21/52 ,  H01L21/54 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.

摘要翻译： 这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。

公开(公告)号：US08802999B2

公开(公告)日：2014-08-12

申请号：US13478802

申请日：2012-05-23

申请人： Jong In Ryu ,  Yul Kyo Chung ,  Tae Sung Jeong

发明人： Jong In Ryu ,  Yul Kyo Chung ,  Tae Sung Jeong

IPC分类号： H05K1/09

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K2201/10477 ,  H05K2203/1461 ,  H01L2924/00

摘要： An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.

摘要翻译： 嵌入式印刷电路板（PCB）包括：铜箔层压板; 插入铜箔层压体中的内部电子部件; 形成在所述内部电子部件的表面上的第一电路图案; 以及形成在铜箔层叠体上的第二电路图案。

公开(公告)号：US20130081863A1

公开(公告)日：2013-04-04

申请号：US13607971

申请日：2012-09-10

申请人： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

发明人： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

IPC分类号： H05K1/16 ,  H05K3/10 ,  H05K1/09

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2924/12042 ,  H05K1/188 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/308 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2924/00

摘要： Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.

摘要翻译： 提供了具有内置电子部件的基板及其制造方法。 用于制造具有内置电子部件的基板的方法包括：形成穿透并突出穿过预浸片的导电性临时凸块; 在突出的临时凸块上安装和附接电子部件; 通过将附着的电子元件层上的其它预浸渍片层叠在一起形成嵌入式基板，在层叠体的底部或层叠体的底部和顶部层压金属片，并且对预浸料片和金属片进行加压; 通过去除金属片的部分区域并且通过去除通过去除金属片区域暴露的临时凸块来形成接触槽; 并用导电金属填充接触槽并形成电路图案。

公开(公告)号：US08017437B2

公开(公告)日：2011-09-13

申请号：US12591791

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming at least one bump by performing soldering, on at least one predetermined position electrically connected with the pattern formed on the first substrate; forming a first molding by performing molding, such that the first molding covers the first substrate and the first chip; placing an interposer on the first molding; and placing a second substrate on the interposer, the second substrate having a second chip mounted thereon.

摘要翻译： 一种制造半导体封装的方法，包括通过倒装芯片方法将第一芯片安装在第一衬底上，所述第一衬底在其上形成预先设计的图案; 在与形成在第一基板上的图案电连接的至少一个预定位置上进行焊接而形成至少一个凸块; 通过进行模制来形成第一模制件，使得第一模塑件覆盖第一基板和第一芯片; 在第一次成型时放置插入件; 以及将第二衬底放置在所述插入件上，所述第二衬底具有安装在其上的第二芯片。

公开(公告)号：US20110164391A1

公开(公告)日：2011-07-07

申请号：US12775341

申请日：2010-05-06

申请人： Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

发明人： Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

IPC分类号： H05K1/18 ,  H05K3/00

CPC分类号： H05K3/445 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4641 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，包括：金属基板，包括在其整个表面上形成的阳极氧化膜; 设置在形成在金属基板中的空腔中的两个电子部件分两级; 形成在所述金属基板的两侧的绝缘层，以埋置设置在所述空腔中的电子部件; 以及电路层，包括与电子部件的连接端子连接并形成在绝缘层的暴露表面上的通孔。 电子元件嵌入式印刷电路板的优点在于，由于使用金属基板代替传统的绝缘材料，因此可以提高其辐射电子元件产生的热量的辐射性能，并且可以降低其制造成本。

公开(公告)号：US20110083892A1

公开(公告)日：2011-04-14

申请号：US12631578

申请日：2009-12-04

申请人： Hong Bok WE ,  Tae Sung Jeong ,  Dae Jun Kim

发明人： Hong Bok WE ,  Tae Sung Jeong ,  Dae Jun Kim

IPC分类号： H05K1/18 ,  C23C14/48

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/005 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0108 ,  H01L2924/00

摘要： Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板，其包括绝缘基底，形成在绝缘基底的一个表面上的绝缘层，嵌入在绝缘层中的电子部件，使得电子部件的有源表面具有连接端子 面对绝缘基底，形成在绝缘基底中以暴露连接端子的沟槽以及形成并嵌入沟槽中的连接图案，并且其中嵌入式连接图案通过压印过程精细地形成并连接到连接端子 的电子元件，从而避免需要额外的再分配层并降低制造成本。 还提供了制造这种印刷电路板的方法。

公开(公告)号：US07875497B2

公开(公告)日：2011-01-25

申请号：US12591793

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming a cavity by etching a center portion of a metal oxide layer; mounting a second chip inside the cavity; forming at least one via such that the via penetrates an edge of the metal oxide layer; placing the metal oxide layer on the first substrate such that the second chip and the first chip face each other; and placing a second substrate on the metal oxide layer, the second substrate having a third chip mounted thereon.

摘要翻译： 一种制造半导体封装的方法，包括通过倒装芯片方法将第一芯片安装在第一衬底上，所述第一衬底在其上形成预先设计的图案; 通过蚀刻金属氧化物层的中心部分形成空腔; 在腔内安装第二芯片; 形成至少一个通孔，使得所述通孔穿过所述金属氧化物层的边缘; 将所述金属氧化物层放置在所述第一基板上，使得所述第二芯片和所述第一芯片彼此面对; 以及将第二衬底放置在所述金属氧化物层上，所述第二衬底具有安装在其上的第三芯片。

公开(公告)号：US20100078204A1

公开(公告)日：2010-04-01

申请号：US12320012

申请日：2009-01-14

申请人： Hong Bok We ,  Tae Sung Jeong

发明人： Hong Bok We ,  Tae Sung Jeong

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/30

CPC分类号： H05K1/188 ,  H01L24/18 ,  H01L2224/2518 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K1/189 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1469 ,  H05K2203/1545 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board including an electronic component embedded therein and a method of manufacturing the printed circuit board. The electronic component is disposed in a cavity of a resin layer including circuit layers formed on both sides thereof. The resin layer, the electronic component and the circuit layers are attached to each other via adhesive layers disposed therebetween. The printed circuit board is manufactured by a compression process, thus shortening a production time and simplifying a manufacturing process.

摘要翻译： 这里公开了一种包括嵌入其中的电子部件的印刷电路板和制造印刷电路板的方法。 电子部件设置在包括形成在其两侧的电路层的树脂层的空腔中。 树脂层，电子部件和电路层通过设置在其间的粘合层彼此附接。 印刷电路板通过压缩工艺制造，从而缩短生产时间并简化制造过程。