Abstract:
An SO-8 type package contains a control MOSFET die mounted on one lead frame section and a synchronous MOSFET and Schottky diode die is mounted on a second lead frame pad section. The die are interconnected through the lead frame pads and wire bonds to define a buck converter circuit and the die and lead frame pads are overmolded with a common insulation housing.
Abstract:
A lateral conduction superjunction device has bidirectional conduction characteristics. In a first embodiment, spaced vertical trenches in a P substrate are lined with N diffusions. A central MOSgate structure is disposed centrally in the parallel trenches and source and drain electrodes are at the opposite respective ends of the trenches. In a second embodiment, flat layers of alternately opposite conductivity types have source and drain regions at their opposite ends. A trench MOSgate is disposed between the source region at one end of the layers to enable bidirectional currant flow through the stocked layers.
Abstract:
A driver circuit for driving a switching circuit driving a load, e.g., a gas discharge lamp, the drive circuit comprising an input trigger circuit receiving a pulsed input signal for controlling the generation of two drive signals, a first drive signal driving a high side switch of a half bridge switching circuit and a second drive signal driving a low side switch of the half bridge switching circuit, a circuit for providing a dead time between the first and second drive signals whereby both the first and second drive signals are substantially zero, the input trigger circuit generating a control signal for controlling the generation of the first and second drive signals based on a characteristic of the pulsed input signal and first and second drive circuits for providing the first and second drive signals.
Abstract:
An active filter for reducing the common mode current in a pulse width modulated drive circuit driving a load, said drive circuit comprising an a-c source, a rectifier connected to said a-c source and producing a rectified output voltage connected to a positive d-c bus and a negative d-c bus, a PWM inverter having input terminals coupled to said positive d-c bus and negative d-c bus and having a controlled a-c output, a load driven by said a-c output of said PWM inverter, a ground wire extending from said load, and a current sensor for measuring the common mode current in said drive circuit in said ground wire, said current sensor producing an output current related to said common mode current, said active filter comprising a first and second MOSFET transistor, each having first and second main electrodes and a control electrode, and an amplifier driving a respective one of the transistors; said first electrode of said first and second transistor coupled to a common node, said second electrodes of said first and second transistors being coupled to said positive d-c bus and said negative d-c respectively; each of said amplifiers having an input coupled to said output of said current sensor and each having an output connected to a respective one of said control electrodes; and a d-c isolating capacitor connecting said common node of said first electrode of said first and second transistors to said ground wire.
Abstract:
An antipinch circuit prevents the motor driven closure of an automotive window if a soft obstacle is compressed between the window and the top of the door frame, and the window is opened in response to the sensing of the obstacle. The circuit measures the motor torque (by measuring motor current) and the motor shaft speed (by measuring motor back EMF). The torque and motor speed are compared to nullsignaturesnull of these values in the case of the window closing normally against the top of the door frame, or against an obstacle, and either stopping or reversing the motor rotation accordingly.
Abstract:
A MOS-gated semiconductor device is shown and described which includes deep implanted junctions and thick oxide spacers disposed over a substantial portion of common conduction regions.
Abstract:
A fast recovery diode has a single large area P/N junction surrounded by a termination region. The anode contact in contact with the central active area extends over the inner periphery of an oxide termination ring and an EQR metal ring extends over the outer periphery of the oxide termination ring. Platinum atoms are diffused into the back surface of the device. A three mask process is described. An amorphous silicon layer is added in a four mask process, and a plurality of spaced guard rings are added in a five mask process.
Abstract:
A small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment with one another. A conductive or insulation adhesive can be used. The die can be identical MOSgated devices connected in series, or can be one power die and a second IC die for the control of the power die.
Abstract:
A MOSgated device with a minimum overlap between the gate and drain electrodes is comprised of an Nnull substrate which receives an epitaxial layer of silicon. The body of the epitaxial layer has an N- lower layer for an accumulation device or a Pnull drift lower layer. In each case the top of the epitixial layer is Nnull. Both can be operated in an a-c mode. A trench gate consists of a trench through the epitaxial layer which has a thin gate oxide layer on its walls and bottom and a conductive polysilicon gate body filling the trench. The thin oxide on the bottom of the trench may be thicker than the oxide on the walls to reduce gate capacitance. A thick isolation oxide which is about 10 times as thick as the gate oxide overlies the top of the polysilicon. A planar drain electrode overlies the Nnull top layer and the laterally spaced isolation oxide; and a planar source electrode contacts the bottom of the substrate.
Abstract:
A semiconductor device package has a lead frame with four or more die receiving pads. The first pad is large enough to receive two or more of the die, laterally spaced from one another, while the other pads receive at least one die each. The die may be arranged in a single straight path, or in spaced parallel paths. The tops of selected ones of the die are bonded to lead frame elements of adjacent pads to complete bridge type circuits within the package. The die and pads are enclosed by a molded plastic housing and short sections of the pads protrude through the housing wall.