公开(公告)号：US20010033022A1

公开(公告)日：2001-10-25

申请号：US09782245

申请日：2001-02-13

Applicant: International Rectifier Corp.

Inventor： Peter R. Ewer

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L23/4951 ,  H01L23/34 ,  H01L23/49582 ,  H01L24/34 ,  H01L24/37 ,  H01L24/45 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/3754 ,  H01L2224/45124 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/48

Abstract: A contact clip for the aluminum contact of a semiconductor device has a central nickel-iron body, preferably Nilo alloy 42, which is coated on top and bottom by a soft, but high conductivity metal such as gold, silver or copper. The nickel-iron body has a thickness of about 15 mils, and is about the thickness of the silicon die. The conductive layers have a thickness of about 5% to 20% of that of the nickel-iron core.

Abstract translation: 用于半导体器件的铝触点的接触夹具有中心镍铁体，优选Nilo合金42，其通过软的但高导电性的金属（例如金，银或铜）涂覆在顶部和底部。 镍铁体的厚度约为15密耳，约为硅模的厚度。 导电层的厚度约为镍铁芯的约5％至20％。

公开(公告)号：US20010045627A1

公开(公告)日：2001-11-29

申请号：US09815988

申请日：2001-03-22

Applicant: International Rectifier Corp.

Inventor： Glyn Connah ,  Peter R. Ewer

IPC: H01L023/495

CPC classification number: H01L24/49 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor device package has a lead frame with four or more die receiving pads. The first pad is large enough to receive two or more of the die, laterally spaced from one another, while the other pads receive at least one die each. The die may be arranged in a single straight path, or in spaced parallel paths. The tops of selected ones of the die are bonded to lead frame elements of adjacent pads to complete bridge type circuits within the package. The die and pads are enclosed by a molded plastic housing and short sections of the pads protrude through the housing wall.

Abstract translation: 半导体器件封装具有带有四个或更多个管芯接收焊盘的引线框架。 第一衬垫足够大以接收两个或更多个模具，彼此横向间隔开，而另一个垫片每个接收至少一个模具。 模具可以布置在单个直线路径中，或者以间隔开的平行路径布置。 芯片的选定顶部被粘合到相邻焊盘的​​引线框架元件，以在封装内完成桥式电路。 模具和垫片由模制的塑料壳体包围，短的垫片通过壳体壁突出。