公开(公告)号：US09391427B2

公开(公告)日：2016-07-12

申请号：US13698453

申请日：2011-11-18

申请人： Feras Eid ,  Shawna M. Liff ,  Henning Braunisch

发明人： Feras Eid ,  Shawna M. Liff ,  Henning Braunisch

IPC分类号： H01S5/024 ,  H01S5/022 ,  H01S5/183 ,  H01S5/42

CPC分类号： H01S5/02476 ,  H01S5/02236 ,  H01S5/183 ,  H01S5/423

摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.

摘要翻译： 提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。 本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架， 以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。 衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

公开(公告)号：US09260294B2

公开(公告)日：2016-02-16

申请号：US14141875

申请日：2013-12-27

申请人： Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

发明人： Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

摘要： The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.

摘要翻译： 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。

公开(公告)号：US09250261B2

公开(公告)日：2016-02-02

申请号：US13730634

申请日：2012-12-28

申请人： Kevin L. Lin ,  Feras Eid ,  Qing Ma

发明人： Kevin L. Lin ,  Feras Eid ,  Qing Ma

IPC分类号： G01P15/105 ,  G01P15/08

CPC分类号： G01P15/105 ,  G01P15/08

摘要： Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.

摘要翻译： 提供计量加速度的技术和机制。 在一个实施例中，微机电加速度计包括用于悬挂质量的磁体，质量块和第一支撑梁部分和第二支撑梁部分。 基于磁体的第一支撑梁部分和第二支撑梁部分的共振频率特性以及由第一支撑梁部分和第二支撑梁部分传导的电流表示质量的加速度。 在另一个实施例中，加速度计还包括第一线部分和第二线部分，每个第一线部分和第二线部分均耦合到质量块，并且还耦合到相应的锚，用于与第一线部分和第二线部分交换信号。 第一线部分和第二线部分提供质量的偏压。

公开(公告)号：US20150185247A1

公开(公告)日：2015-07-02

申请号：US14141759

申请日：2013-12-27

申请人： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

发明人： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

IPC分类号： G01P15/11 ,  G01P1/04

CPC分类号： G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

摘要： Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

摘要翻译： 集成电路封装描述了磁铁放置。 在一个示例中，端子被施加到磁体。 然后将磁体放置在衬底的顶层上，焊料在端子和顶层之间，并且焊料被回流以将磁体附着到衬底上。

公开(公告)号：US20140247556A1

公开(公告)日：2014-09-04

申请号：US13784463

申请日：2013-03-04

申请人： Feras Eid ,  Zhihua Li ,  Chau V. Ho

发明人： Feras Eid ,  Zhihua Li ,  Chau V. Ho

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16152 ,  H05K7/20309 ,  H05K7/20318 ,  Y10T29/49002

摘要： Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及使用跳跃式液滴蒸气室的集成电路组件的热管理的技术和配置。 在一个实施例中，一种装置包括：模具，其具有包括多个集成电路装置的第一侧，所述多个集成电路装置被配置为在操作时产生热量，以及与第一侧相对设置的第二侧，以及包括液体的蒸气室， 蒸发器，其包括与模具的第二侧热耦合的表面，蒸发器被配置为将液体蒸发成蒸汽，以及冷凝器，其包括超疏水表面并且构造成冷凝蒸气，其中从冷凝蒸气聚结释放的能量 超疏水表面使冷凝的蒸气从冷凝器的超疏水表面跳跃到蒸发器的表面。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140246770A1

公开(公告)日：2014-09-04

申请号：US13782893

申请日：2013-03-01

申请人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/373

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

摘要翻译： 描述了铜纳米棒热界面材料（TIM）。 铜纳米棒TIM包括多个铜纳米棒，其具有与第一表面热耦合的第一端和朝向第二表面延伸的第二端。 在第二端形成多个铜纳米棒分支。 铜纳米棒分支冶金结合到第二表面。 第一表面可以是模具的背面。 第二表面可以是热扩散或第二模具。 TIM可以包括围绕铜纳米棒的基质材料。 在一个实施方案中，铜纳米棒以簇形成。

公开(公告)号：US20140169800A1

公开(公告)日：2014-06-19

申请号：US13717185

申请日：2012-12-17

申请人： Feras Eid ,  Johanna Swan ,  Weng Hong Teh

发明人： Feras Eid ,  Johanna Swan ,  Weng Hong Teh

IPC分类号： H04B10/40 ,  F21V21/00 ,  H01L33/00

CPC分类号： H01S5/02272 ,  H01L21/568 ,  H01L24/18 ,  H01L24/19 ,  H01L25/167 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2924/12042 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/183 ,  H01S5/18305 ,  H01L2924/00

摘要： This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.

摘要翻译： 本公开一般涉及一种电子封装，其可以包括至少部分地包封管芯的管芯和电介质层。 电互连可以电耦合到管芯并且至少部分地通过电介质层。 光发射器可以用电互连的第一个电耦合到管芯，并且被配置为从电子封装的第一主表面发射光。 焊料凸块可以用电互连的第二个电耦合到管芯，并且位于电子封装的不同于第一主表面的第二主表面上。

公开(公告)号：US20140165723A1

公开(公告)日：2014-06-19

申请号：US13720876

申请日：2012-12-19

申请人： Qing MA ,  Feras EID ,  Kevin LIN ,  Johanna M. SWAN ,  Weng Hong TEH ,  Valluri R. RAO

发明人： Qing MA ,  Feras EID ,  Kevin LIN ,  Johanna M. SWAN ,  Weng Hong TEH ,  Valluri R. RAO

IPC分类号： G01C19/5635

CPC分类号： G01C19/56 ,  G01C19/5776

摘要： This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.

摘要翻译： 本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。 在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。 感应线圈记录在第二维度上作为角速度的函数变化的电感。 在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。 在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。 在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

公开(公告)号：US20170172421A1

公开(公告)日：2017-06-22

申请号：US14971800

申请日：2015-12-16

申请人： Nadine L. Dabby ,  Adel A. Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Feras Eid

发明人： Nadine L. Dabby ,  Adel A. Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Feras Eid

IPC分类号： A61B5/0205 ,  G06F3/01 ,  A61B5/00

CPC分类号： A61B5/0205 ,  A61B5/024 ,  A61B5/08 ,  A61B5/11 ,  A61B5/113 ,  A61B5/6804 ,  A61B2562/0219 ,  A61B2562/12 ,  G06F3/011 ,  G06F3/014 ,  G06F3/017

摘要： A sensor assembly configured to monitor one or more physiological characteristics includes a deformable substrate. The deformable substrate includes a body side interface. Substrate conductive traces are coupled with the deformable substrate. Two or more physiological sensor elements are coupled with the deformable substrate. The two or more physiological sensor elements include at least first and second sensor elements. The first sensor element includes a first piezo element in a first orientation along the deformable substrate, the first sensor element is electrically coupled with the substrate conductive traces. The second sensor element includes a second piezo element in a second orientation along the deformable substrate different than the first orientation, the second sensor element is electrically coupled with the substrate conductive traces.

公开(公告)号：US20170092412A1

公开(公告)日：2017-03-30

申请号：US14866852

申请日：2015-09-26

申请人： Mathew J. Manusharow ,  Yonggang Li ,  William J. Lambert ,  Krishna Bharath ,  Adel A. Elsherbini ,  Feras Eid ,  Aleksandar Aleksov ,  Henning Braunisch

发明人： Mathew J. Manusharow ,  Yonggang Li ,  William J. Lambert ,  Krishna Bharath ,  Adel A. Elsherbini ,  Feras Eid ,  Aleksandar Aleksov ,  Henning Braunisch

IPC分类号： H01F27/28 ,  H01F41/04 ,  H01F27/24

CPC分类号： H01F27/2804 ,  H01F17/0013 ,  H01F27/24 ,  H01F41/041 ,  H01F41/042 ,  H01F2017/0073 ,  H01F2017/0086 ,  H01F2027/2809 ,  H01L21/486 ,  H01L23/49838 ,  H01L28/10 ,  H01L2224/16227

摘要： Embodiments of the invention include inductors integrated into a package substrate that have increased thicknesses due to the use of shaped vias, and methods of forming such packages. In an embodiment of the invention an inductor may be formed in a package substrate may include a first inductor line formed on the package substrate. In some embodiments, a shaped via may be formed over the first inductor line. Additional embodiments may include a dielectric layer that is formed over the package substrate, the first inductor line and around the shaped via. In one embodiment, a second inductor line may also be formed over the shaped via. Some embodiments of the invention may include an inductor that is a spiral inductor.