公开(公告)号：US20190003882A1

公开(公告)日：2019-01-03

申请号：US15635881

申请日：2017-06-28

申请人： Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

发明人： Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

IPC分类号： G01J1/44 ,  G02B6/42 ,  G01J1/42 ,  G01J1/08 ,  G01J1/04

CPC分类号： G02B6/1221 ,  G02B6/4253 ,  H04B10/801 ,  H04B10/807 ,  H05K1/0274

摘要： Various embodiments disclosed relate to a stretchable packaging system. The system includes a first electronic component. The first electronic component includes a first optical emitter. The system further includes a second electronic component. The second electronic component includes a first receiver. An optical interconnect including a first elastomer having a first refractive index connects the first optical emitter to the first receiver. An encapsulate layer including a second elastomer having a second refractive index at least partially encapsulates the first electronic component, the second electronic component, and the optical interconnect.

公开(公告)号：US20180090803A1

公开(公告)日：2018-03-29

申请号：US15280823

申请日：2016-09-29

申请人： ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

发明人： ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

IPC分类号： H01P5/08 ,  H01P11/00

CPC分类号： H01P5/1007 ,  H01P5/10 ,  H01P5/107 ,  H01Q13/02

摘要： The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

公开(公告)号：US20180026393A1

公开(公告)日：2018-01-25

申请号：US15215531

申请日：2016-07-20

申请人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

发明人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

IPC分类号： H01R13/62 ,  H01R13/631 ,  H01R13/627

CPC分类号： H01R13/6205 ,  H01R11/30 ,  H01R13/627 ,  H01R13/631

摘要： Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.

公开(公告)号：US20150183635A1

公开(公告)日：2015-07-02

申请号：US14141875

申请日：2013-12-27

申请人： Kyu Oh Lee ,  Sasha N. OSTER ,  Feras EID ,  Sarah HANEY

发明人： Kyu Oh Lee ,  Sasha N. OSTER ,  Feras EID ,  Sarah HANEY

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

摘要： The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.

摘要翻译： 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属来形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。

公开(公告)号：US20150171065A1

公开(公告)日：2015-06-18

申请号：US14104877

申请日：2013-12-12

申请人： John S. Guzek ,  Debendra Mallik ,  Sasha N. Oster ,  Timothy E. McIntosh

发明人： John S. Guzek ,  Debendra Mallik ,  Sasha N. Oster ,  Timothy E. McIntosh

IPC分类号： H01L25/18 ,  H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L25/18 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1427 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/182

摘要： Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了允许诸如处理器和存储器的设备之间的相对短的连接的集成电路封装组件。 在一个实施例中，封装组件包括嵌入到直接耦合到附接到子封装的另一管芯的子封装中的管芯。 在一些实施例中，子包还可以包含电源管理装置。 在一些实施例中，嵌入在子封装和/或功率管理器件中的管芯可以与耦合到子封装的管芯定义的区域重叠或位于其中，使得它们位于耦合到子封装的管芯和衬底之间 子包。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20190207287A1

公开(公告)日：2019-07-04

申请号：US15859482

申请日：2017-12-30

申请人： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

发明人： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC分类号： H01P5/10 ,  H01P3/02

CPC分类号： H01P5/1007 ,  H01P3/026 ,  H01P5/1015 ,  H01P5/107

摘要： Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.

公开(公告)号：US20190204508A1

公开(公告)日：2019-07-04

申请号：US15859477

申请日：2017-12-30

申请人： Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

发明人： Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC分类号： G02B6/28 ,  G02B6/38 ,  G02B6/12

CPC分类号： H01P5/107 ,  G05D1/00 ,  H01Q1/32 ,  H04L12/40189 ,  H04L2012/40273 ,  H04W4/38 ,  H04W4/40

摘要： Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：US20190207290A1

公开(公告)日：2019-07-04

申请号：US16325351

申请日：2016-09-30

申请人： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

发明人： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

IPC分类号： H01P11/00 ,  H01P3/12 ,  H01P3/14 ,  H01P3/123

CPC分类号： H01P11/002 ,  H01P3/122 ,  H01P3/123 ,  H01P3/14

摘要： A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US09260294B2

公开(公告)日：2016-02-16

申请号：US14141875

申请日：2013-12-27

申请人： Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

发明人： Kyu Oh Lee ,  Sasha N. Oster ,  Feras Eid ,  Sarah Haney

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

摘要： The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.

摘要翻译： 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。

公开(公告)号：US20150185247A1

公开(公告)日：2015-07-02

申请号：US14141759

申请日：2013-12-27

申请人： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

发明人： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

IPC分类号： G01P15/11 ,  G01P1/04

CPC分类号： G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

摘要： Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

摘要翻译： 集成电路封装描述了磁铁放置。 在一个示例中，端子被施加到磁体。 然后将磁体放置在衬底的顶层上，焊料在端子和顶层之间，并且焊料被回流以将磁体附着到衬底上。