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公开(公告)号:US12126067B2
公开(公告)日:2024-10-22
申请号:US16911559
申请日:2020-06-25
申请人: Intel Corporation
发明人: Diego Correas-Serrano , Georgios Dogiamis , Henning Braunisch , Neelam Prabhu Gaunkar , Telesphor Kamgaing
CPC分类号: H01P3/16 , H01P1/2002 , H01P1/2088 , H01P5/087
摘要: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
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公开(公告)号:US12119532B2
公开(公告)日:2024-10-15
申请号:US17782342
申请日:2020-12-18
申请人: 2pi-Labs GmbH
发明人: Timo Jaeschke , Simon Kueppers
CPC分类号: H01P3/121 , H01P5/082 , H01P5/107 , H01P11/002 , H01Q1/2283
摘要: A waveguide arrangement for guiding electromagnetic waves in a cavity surrounded by conductive material is proposed, wherein the waveguide arrangement comprises a printed circuit board material having an electrically conductive, plate-shaped back, a substrate and a conductive layer arranged on a side of the substrate facing away from the back. According to the invention, it is provided that the back has a surface structure, preferably formed by at least one recess, by which the waveguiding cavity is at least partially directly bounded; and/or that the cavity is formed in split-block technology by joining the printed circuit board material as split-block bottom part with a corresponding cover as split-block top part.
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公开(公告)号:US20240332767A1
公开(公告)日:2024-10-03
申请号:US18612528
申请日:2024-03-21
发明人: Karim Glâtre
摘要: Provided are apparatuses and methods for a tri-frequency feedchain configured to combine at least three frequency bands on a waveguide. The feedchain includes a turnstile configured to support two orthogonal fundamental modes and combine six filtered signals and a third signal and output the combined signal via an output port. The feedchain also includes at least six filters disposed about the turnstile configured to filter a split signal into the filtered signals. The turnstile is a junction for the filters and includes a port at the interface of each filter and the turnstile for receiving the filtered signal. The turnstile includes a third signal port configured to receive the third signal. The split signals are of an intermediary frequency band comprising a first and second frequency band and the third signal is of a third frequency band. The first, second, and third frequency bands do not intersect.
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公开(公告)号:US11936090B2
公开(公告)日:2024-03-19
申请号:US17299502
申请日:2019-12-02
发明人: Simon Karau , Andre Meyer , Martin Schneider
摘要: A waveguide assembly comprising a first waveguide, and a second waveguide designed as a dielectric multimodal waveguide, and a waveguide transition for transmitting an electromagnetic wave between the first waveguide and the second waveguide, the waveguide transition having a dielectric waveguide piece which is between the first waveguide and the second waveguide. The dielectric waveguide piece is capable of guiding a smaller mode number than the second waveguide, at least in a front section, facing the first waveguide.
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公开(公告)号:US20240088537A1
公开(公告)日:2024-03-14
申请号:US17941250
申请日:2022-09-09
发明人: Manohar Deshpande , Eleanya Onuma
摘要: This application describes an apparatus and system for a Wide band end launcher to convert a signal in a coaxial line to a CPW line. The apparatus uses a transition zone which gradually tapers in two inclined planes from the coaxial line to the CPW line, connecting the central conductor of the coaxial line to the central conductor of the CPW line. In addition, the outer conductor of the coaxial line is connected to the ground plates of the CPW line. This allows for high bandwidth transfers between the two types of lines for accurate measurements and other purposes.
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公开(公告)号:US11779393B2
公开(公告)日:2023-10-10
申请号:US17349228
申请日:2021-06-16
申请人: CREO MEDICAL LIMITED
发明人: Christopher Hancock , Steven Morris , Patrick Burn , Louis Turner , George Ullrich , David Webb
CPC分类号: A61B18/1492 , A61B18/1206 , A61B18/1815 , H01P1/065 , H01P1/066 , A61B2017/0034 , A61B2018/00077 , A61B2018/00178 , A61B2018/00202 , A61B2018/00208 , A61B2018/00642 , A61B2018/00755 , A61B2018/00875 , A61B2018/00982 , A61B2018/00994 , A61B2018/1823 , A61B2018/1838 , A61B2018/1861 , A61B2090/035 , H01P5/085
摘要: Electrical instrument for applying radiofrequency and/or microwave frequency energy to tissue, comprising: a distal part comprising an instrument tip for applying radiofrequency and/or microwave frequency energy to tissue, the instrument tip comprising first and second conductive elements; a coaxial feed cable comprising an inner conductor, a tubular outer conductor coaxial with the inner conductor, and dielectric material separating the inner and outer conductors, the coaxial feed cable being for conveying radiofrequency and/or microwave frequency energy to the distal part; wherein: the inner conductor is electrically connected to the first conductive element and the outer conductor is electrically connected to the second conductive element through a rotatable connection between the distal part and the coaxial feed cable that allows rotation of the distal part relative to the coaxial feed cable; and the instrument comprises an actuator for rotating the distal part in a first rotational direction relative to the feed cable.
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公开(公告)号:US11777461B2
公开(公告)日:2023-10-03
申请号:US17690802
申请日:2022-03-09
申请人: ENGIN-IC, Inc.
发明人: Stephen R. Nelson
IPC分类号: H03F3/16 , H03F3/60 , H03F1/56 , H03F3/195 , H03F3/24 , H03F1/34 , H01P3/08 , H01P5/08 , H01L29/772 , H01P3/02
CPC分类号: H03F3/604 , H01L29/772 , H01P3/026 , H01P3/081 , H01P5/08 , H03F1/342 , H03F1/565 , H03F3/195 , H03F3/245 , H01L2924/1306
摘要: According to an embodiment of the disclosure, a series or source feedback is provided to a solid-state power amplifier to achieve improved amplifier output power, good impedance match, and low voltage standing wave ratio (VSWR). In an embodiment, an inductive element is coupled to the source of the power amplifier transistor to serve as a series or source feedback for the transistor. In an embodiment, a high-impedance microstrip is provided as an inductive element coupled to the source of the transistor. In an embodiment, a series or source feedback is provided to each amplifier in a multistage amplifier circuit. In an embodiment, a greater series or source feedback is provided at a later stage of a multistage amplifier circuit, whereas a smaller series or source feedback is provided at an earlier stage of the multistage amplifier circuit.
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公开(公告)号:US20230268298A1
公开(公告)日:2023-08-24
申请号:US18311229
申请日:2023-05-02
发明人: WEN-SHIANG LIAO , HUAN-NENG CHEN
IPC分类号: H01L23/66 , H01P5/08 , H01L21/768 , H01P11/00 , H01L23/00 , H01L21/48 , H01L23/538 , H01L21/683 , H01L21/56 , H01L23/31 , H01L25/00 , H01L25/18 , H01P3/16
CPC分类号: H01L23/66 , H01P5/087 , H01L21/76802 , H01L21/76877 , H01P11/006 , H01L24/19 , H01L24/20 , H01L21/4857 , H01L21/4853 , H01L23/5389 , H01L23/5386 , H01L23/5383 , H01L21/6835 , H01L21/568 , H01L21/565 , H01L23/3128 , H01L25/50 , H01L25/18 , H01P3/16 , H01L2224/211 , H01L2223/6633 , H01L2223/6616 , H01L2221/68359 , H01L2924/19032 , H01L2924/19039
摘要: A method of forming a semiconductor structure includes: providing a first inter-level dielectric (ILD) layer overlying a molding layer, the molding layer including a transmitter ground structure and a receiver ground structure; forming first openings through the first ILD layer to expose the transmitter and receiver ground structures; forming first lower transmitter and receiver electrodes in the first openings to be respectively coupled to the transmitter and receiver ground structures; forming a first dielectric waveguide overlying the first ILD layer, and first lower transmitter and receiver electrodes; depositing a second ILD layer overlying the first dielectric waveguide; forming second lower transmitter and receiver electrodes extending through the second ILD and respectively coupled to the transmitter and receiver ground structures; and forming a second dielectric waveguide overlying the second ILD layer and the second lower transmitter and receiver electrodes.
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公开(公告)号:US11730536B2
公开(公告)日:2023-08-22
申请号:US17349301
申请日:2021-06-16
申请人: CREO MEDICAL LIMITED
发明人: Christopher Hancock , Steven Morris , Patrick Burn , Louis Turner , George Ullrich , David Webb
CPC分类号: A61B18/1492 , A61B18/1206 , A61B18/1815 , H01P1/065 , H01P1/066 , A61B2017/0034 , A61B2018/00077 , A61B2018/00178 , A61B2018/00202 , A61B2018/00208 , A61B2018/00642 , A61B2018/00755 , A61B2018/00875 , A61B2018/00982 , A61B2018/00994 , A61B2018/1823 , A61B2018/1838 , A61B2018/1861 , A61B2090/035 , H01P5/085
摘要: Electrical instrument for applying radiofrequency and/or microwave frequency energy to tissue, comprising: a distal part comprising an instrument tip for applying radiofrequency and/or microwave frequency energy to tissue, the instrument tip comprising first and second conductive elements; a coaxial feed cable comprising an inner conductor, a tubular outer conductor coaxial with the inner conductor, and dielectric material separating the inner and outer conductors, the coaxial feed cable being for conveying radiofrequency and/or microwave frequency energy to the distal part; wherein: the inner conductor is electrically connected to the first conductive element and the outer conductor is electrically connected to the second conductive element through a rotatable connection between the distal part and the coaxial feed cable that allows rotation of the distal part relative to the coaxial feed cable; and the instrument comprises an actuator for rotating the distal part in a first rotational direction relative to the feed cable.
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公开(公告)号:US11682638B2
公开(公告)日:2023-06-20
申请号:US16998854
申请日:2020-08-20
发明人: Wen-Shiang Liao , Huan-Neng Chen
IPC分类号: H01L21/48 , H01L23/66 , H01P5/08 , H01L21/768 , H01P11/00 , H01L23/00 , H01L23/538 , H01L21/683 , H01L21/56 , H01L23/31 , H01L25/00 , H01L25/18 , H01P3/16
CPC分类号: H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/18 , H01L25/50 , H01P3/16 , H01P5/087 , H01P11/006 , H01L2221/68359 , H01L2223/6616 , H01L2223/6633 , H01L2224/211 , H01L2924/19032 , H01L2924/19039
摘要: A method of forming a semiconductor structure is provided. A first inter-level dielectric (ILD) layer is formed overlying a molding layer. The first ILD layer is patterned to form a plurality of first openings. A first lower transmitter electrode and a first lower receiver electrode are formed by depositing a first metal material within the plurality of first openings. A first dielectric waveguide is formed overlying the first ILD layer, the first lower transmitter electrode and the first lower receiver electrode. A second ILD layer is formed overlying the first dielectric waveguide and includes a plurality of second openings. A second lower transmitter electrode and a second lower receiver electrode are formed by depositing a second metal material within the plurality of second openings. A second dielectric waveguide is formed overlying the second ILD layer, the second lower transmitter electrode and the second lower receiver electrode.
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