公开(公告)号：US12040776B2

公开(公告)日：2024-07-16

申请号：US16526633

申请日：2019-07-30

申请人： Intel Corporation

发明人： Telesphor Kamgaing ,  Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Johanna M. Swan

IPC分类号： H03H9/05 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/18 ,  H03H9/58 ,  H10N30/87 ,  H10N30/88 ,  H10N39/00 ,  H01L23/498

CPC分类号： H03H9/0552 ,  H01L23/5385 ,  H01L24/16 ,  H01L25/18 ,  H01L25/50 ,  H03H9/58 ,  H10N30/875 ,  H10N30/883 ,  H10N39/00 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/19042

摘要： Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US11916604B2

公开(公告)日：2024-02-27

申请号：US16893660

申请日：2020-06-05

申请人： Intel Corporation

发明人： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing ,  Thomas W. Brown ,  Stefano Pellerano

IPC分类号： H03H7/30 ,  H04B15/00 ,  H04L25/03

CPC分类号： H04B15/00 ,  H04L25/03

摘要： Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

公开(公告)号：US11895815B2

公开(公告)日：2024-02-06

申请号：US16909269

申请日：2020-06-23

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Adel Elsherbini ,  Feras Eid

IPC分类号： H01R12/53 ,  H05K9/00 ,  H01B7/18 ,  H01B7/00

CPC分类号： H05K9/0098 ,  H01B7/0018 ,  H01B7/1805 ,  H01R12/53

摘要： Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

公开(公告)号：US20230320021A1

公开(公告)日：2023-10-05

申请号：US18331474

申请日：2023-06-08

申请人： Intel Corporation

发明人： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC分类号： H05K7/14 ,  H05K1/02 ,  H01P5/12 ,  H01P3/16

CPC分类号： H05K7/1489 ,  H05K1/0243 ,  H01P5/12 ,  H01P3/16 ,  H05K2201/10356 ,  H01L24/16

摘要： Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20230307846A1

公开(公告)日：2023-09-28

申请号：US17700819

申请日：2022-03-22

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Alon Cohen ,  Ophir Shabtay

IPC分类号： H01Q19/10 ,  H01L25/065 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q21/08

CPC分类号： H01Q19/104 ,  H01L25/0655 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/66 ,  H01Q21/08 ,  H01L2223/6616 ,  H01L2223/6677

摘要： Embodiments of a microelectronic assembly comprise a plurality of transceiver modules, each transceiver module including a first antenna; a printed circuit board (PCB); and a reflector module coupled to the PCB and separated from the plurality of transceiver modules by a space. The reflector module comprises: a substrate having a first side and an opposing second side, the first side being proximate to the plurality of transceiver modules, an antenna-array on the first side of the substrate, the antenna-array including a plurality of second antennas; a first integrated circuit (IC) die on the second side of the substrate; and a second IC die on the second side of the substrate. The first IC die comprises radio frequency (RF) switches configured to operate at electromagnetic frequencies between 20 kHz and 1 THz, and the second IC die comprises memory cell arrays and digital logic circuits.

公开(公告)号：US11728290B2

公开(公告)日：2023-08-15

申请号：US16394514

申请日：2019-04-25

申请人： Intel Corporation

发明人： Adel A. Elsherbini ,  Georgios Dogiamis ,  Johanna M. Swan ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Henning Braunisch

IPC分类号： H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L25/00

CPC分类号： H01L23/66 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2924/1423 ,  H01L2924/1903

摘要： Embodiments may relate to a microelectronic package that includes a substrate signal path and a waveguide. The package may further include dies that are communicatively coupled with one another by the substrate signal path and the waveguide. The substrate signal path may carry a signal with a frequency that is different than the frequency of a signal that is to be carried by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US11721650B2

公开(公告)日：2023-08-08

申请号：US16437930

申请日：2019-06-11

申请人： Intel Corporation

发明人： Brandon C. Marin ,  Aleksandar Aleksov ,  Georgios Dogiamis ,  Jeremy D. Ecton ,  Suddhasattwa Nad ,  Mohammad Mamunur Rahman

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01P3/08 ,  H01P11/00 ,  H01P3/06

CPC分类号： H01L23/66 ,  H01L21/481 ,  H01L21/4846 ,  H01L23/49838 ,  H01P3/06 ,  H01P3/08 ,  H01P3/088 ,  H01P11/003 ,  H01P11/005 ,  H01L2223/6627

摘要： Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures. The second angled conductive layers are positioned over the second transmission lines and first dielectric having a second pattern of second triangular structures, where the second pattern is shaped as a coaxial interconnects enclosed with second triangular structures and portions of first dielectric.

公开(公告)号：US11716826B2

公开(公告)日：2023-08-01

申请号：US16402055

申请日：2019-05-02

申请人： Intel Corporation

发明人： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Richard Dischler

IPC分类号： H05K7/14 ,  H05K1/02 ,  H01P5/12 ,  H01P3/16 ,  H01L23/00 ,  H01L25/18 ,  H01L23/66 ,  H01L23/538 ,  H05K1/18

CPC分类号： H05K7/1489 ,  H01P3/16 ,  H01P5/12 ,  H05K1/0243 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/18 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16225 ,  H05K1/181 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10734

摘要： Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20230144206A1

公开(公告)日：2023-05-11

申请号：US17523655

申请日：2021-11-10

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Adel A. Elsherbini

IPC分类号： H01L23/66 ,  H01L25/065 ,  H01L23/538 ,  H01Q1/22 ,  H01Q9/04 ,  H01L25/00

CPC分类号： H01L23/66 ,  H01L25/0652 ,  H01L23/5384 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01L25/50

摘要： A microelectronic assembly is provided comprising: a first IC die in a first layer comprising an array of radio frequency (RF) patch antennas on a side opposite to a second layer; a second IC die in the second layer between the first layer and a third layer; and a third IC die in the third layer. The first IC die comprises RF and analog circuitry, the first IC die is part of an array of IC dies having similar size and circuitry as the first IC die, the second layer and the third layer comprise a dielectric with through-dielectric vias (TDVs) therein surrounding the second IC die and the third IC die, respectively, and an interface between adjacent layers comprises interconnects having a pitch of 10 micrometers between adjacent interconnects.

公开(公告)号：US11594801B2

公开(公告)日：2023-02-28

申请号：US16613070

申请日：2017-07-01

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing ,  Erich Ewy ,  Kenneth Shoemaker ,  Adel Elsherbini ,  Johanna Swan

IPC分类号： B60R11/04 ,  H01P3/16 ,  B60R16/023 ,  B60W40/02

摘要： Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.