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公开(公告)号：US20230207404A1
公开(公告)日：2023-06-29
申请号：US17561570
申请日：2021-12-23
申请人： Telesphor KAMGAING , Georgios C. DOGIAMIS , Veronica STRONG , Aleksandar ALEKSOV , Brandon RAWLINGS , Neelam PRABHU GAUNKAR
发明人： Telesphor KAMGAING , Georgios C. DOGIAMIS , Veronica STRONG , Aleksandar ALEKSOV , Brandon RAWLINGS , Neelam PRABHU GAUNKAR
IPC分类号： H01L23/15 , H01L23/498 , H01L23/48 , H01L21/48
CPC分类号： H01L23/15 , H01L23/49827 , H01L23/481 , H01L21/486 , H05K1/0306
摘要： Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.
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公开(公告)号：US20230208009A1
公开(公告)日：2023-06-29
申请号：US17561542
申请日：2021-12-23
申请人： Neelam PRABHU GAUNKAR , Georgios C. DOGIAMIS , Telesphor KAMGAING , Aleksandar ALEKSOV , Brandon RAWLINGS , Veronica STRONG
发明人： Neelam PRABHU GAUNKAR , Georgios C. DOGIAMIS , Telesphor KAMGAING , Aleksandar ALEKSOV , Brandon RAWLINGS , Veronica STRONG
IPC分类号： H01Q1/22 , H01Q9/04 , H01L23/498
CPC分类号： H01Q1/2283 , H01Q9/0407 , H01L23/49827 , H05K1/181
摘要： Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.
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公开(公告)号：US20190207290A1
公开(公告)日：2019-07-04
申请号：US16325351
申请日：2016-09-30
申请人： Brandon M. Rawlings , Shawna M. Liff , Sasha N. Oster , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Aleksandar Aleksov, I , Johanna M. Swan , Richard J. Dischier
发明人： Brandon M. Rawlings , Shawna M. Liff , Sasha N. Oster , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Aleksandar Aleksov, I , Johanna M. Swan , Richard J. Dischier
CPC分类号： H01P11/002 , H01P3/122 , H01P3/123 , H01P3/14
摘要： A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.
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公开(公告)号：US10468737B2
公开(公告)日：2019-11-05
申请号：US15859482
申请日：2017-12-30
摘要： Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.
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公开(公告)号：US20180090803A1
公开(公告)日：2018-03-29
申请号：US15280823
申请日：2016-09-29
申请人： ADEL A. ELSHERBINI , SASHA N. OSTER , JOHANNA M. SWAN , GEORGIOS C. DOGIAMIS , SHAWNA M. LIFF , ALEKSANDAR ALEKSOV , TELESPHOR KAMGAING
发明人： ADEL A. ELSHERBINI , SASHA N. OSTER , JOHANNA M. SWAN , GEORGIOS C. DOGIAMIS , SHAWNA M. LIFF , ALEKSANDAR ALEKSOV , TELESPHOR KAMGAING
CPC分类号： H01P5/1007 , H01P5/10 , H01P5/107 , H01Q13/02
摘要： The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.
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公开(公告)号：US20230207492A1
公开(公告)日：2023-06-29
申请号：US17561559
申请日：2021-12-23
申请人： Aleksandar ALEKSOV , Georgios C. DOGIAMIS , Neelam PRABHU GAUNKAR , Telesphor KAMGAING , Veronica STRONG , Brandon RAWLINGS , Robert MONGRAIN , Beomseok CHOI
发明人： Aleksandar ALEKSOV , Georgios C. DOGIAMIS , Neelam PRABHU GAUNKAR , Telesphor KAMGAING , Veronica STRONG , Brandon RAWLINGS , Robert MONGRAIN , Beomseok CHOI
IPC分类号： H01L23/64 , H01F27/40 , H01L23/15 , H01L23/498
CPC分类号： H01L23/645 , H01F27/40 , H01L23/15 , H01L23/49827
摘要： Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.
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公开(公告)号：US20190207287A1
公开(公告)日：2019-07-04
申请号：US15859482
申请日：2017-12-30
CPC分类号： H01P5/1007 , H01P3/026 , H01P5/1015 , H01P5/107
摘要： Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.
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公开(公告)号：US20190204508A1
公开(公告)日：2019-07-04
申请号：US15859477
申请日：2017-12-30
申请人： Adel A. ELSHERBINI , Georgios C. DOGIAMIS , Sasha N. OSTER , Erich N. EWY , Telesphor KAMGAING , Johanna M. SWAN
发明人： Adel A. ELSHERBINI , Georgios C. DOGIAMIS , Sasha N. OSTER , Erich N. EWY , Telesphor KAMGAING , Johanna M. SWAN
CPC分类号： H01P5/107 , G05D1/00 , H01Q1/32 , H04L12/40189 , H04L2012/40273 , H04W4/38 , H04W4/40
摘要： Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.
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公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
IPC分类号： G01C25/00 , G01C19/5656
CPC分类号： G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
摘要： An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.
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公开(公告)号：US20180097268A1
公开(公告)日：2018-04-05
申请号：US15282050
申请日：2016-09-30
申请人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
发明人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
CPC分类号： H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
摘要： A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
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