公开(公告)号：US20150183635A1

公开(公告)日：2015-07-02

申请号：US14141875

申请日：2013-12-27

Applicant: Kyu Oh Lee ,  Sasha N. OSTER ,  Feras EID ,  Sarah HANEY

Inventor： Kyu Oh Lee ,  Sasha N. OSTER ,  Feras EID ,  Sarah HANEY

IPC: B81B7/00 ,  B81C1/00

CPC classification number: G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.

Abstract translation: 描述了将压力或惯性传感器集成到集成电路制造和封装流程中。 在一个示例中，通过在第一介电层上沉积金属来形成隔膜。 在隔膜上形成第二电介质层。 在第二电介质上形成金属网层。 第一介电层在隔膜下蚀刻形成空腔。 空腔内衬密封层。 空腔被覆盖以形成邻近隔膜的室，并且盖被密封抵靠空腔。

公开(公告)号：US20150185247A1

公开(公告)日：2015-07-02

申请号：US14141759

申请日：2013-12-27

Applicant: Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

Inventor： Feras Eid ,  Sasha N. OSTER ,  Kyu Oh LEE ,  Sarah HANEY

IPC: G01P15/11 ,  G01P1/04

CPC classification number: G01P1/04 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792 ,  G01P15/097 ,  H01L27/22 ,  Y10T29/49075

Abstract: Magnet placement is described for integrated circuit packages. In one example, a terminal is applied to a magnet. The magnet is then placed on a top layer of a substrate with solder between the terminal and the top layer, and the solder is reflowed to attach the magnet to the substrate.

Abstract translation: 集成电路封装描述了磁铁放置。 在一个示例中，端子被施加到磁体。 然后将磁体放置在衬底的顶层上，焊料在端子和顶层之间，并且焊料被回流以将磁体附着到衬底上。