Abstract:
Methods and circuits for performing a clock-stop process of a circuit are disclosed. For example, a circuit includes a clock group having a first clock domain, a first clock multiplexer, a first synchronizer and a controller. The controller is configured to initiate a clock stop process of the circuit by sending an alternative mode signal to the first synchronizer. The first synchronizer is configured to synchronize the alternative mode signal to a clock of the first clock domain and is further configured to output, to a select line of the first clock multiplexer, the alternative mode signal that is synchronized to the clock of the first clock domain. The select line of the first clock multiplexer is for selecting from between an input of the first clock multiplexer for the clock of the first clock domain and an alternative clock input of the first clock multiplexer for an alternative clock signal from the controller.
Abstract:
In an apparatus relating generally to an IC die, the IC die has a regulated power supply, a power supply grid, and a test circuit. The regulated power supply is biased between a source supply node and a source ground node, which are externally accessible nodes of the IC die. An internal supply node of the power supply grid is coupled to the regulated power supply. The test circuit is coupled to the internal supply node of the power supply grid. The test circuit is configured to test for at least one short in the power supply grid. The test circuit is configured to limit power through the power supply grid to less than that of a probe tip tolerance. The test circuit is configured to test for the at least one short in presence of background current leakage of the power supply grid.
Abstract:
An integrated circuit (IC) can include a plurality of circuit blocks, wherein each circuit block includes design for testability (DFT) circuitry. The DFT circuitry can include a scan interface, wherein each scan interface is uniform with the scan interface of each other circuit block of the plurality of circuit blocks, an embedded deterministic test circuit coupled to the scan interface, wherein the embedded deterministic test circuit couples to circuitry under test, and a scan response analyzer coupled to the scan interface. The scan response analyzer is configured to operate in a selected scan response capture mode selected from a plurality of scan response capture modes. The IC can include a global scan router connected to the scan interfaces of the plurality of circuit blocks. The global scan router is configured to activate a subset of the plurality of circuit blocks in parallel for a scan test.
Abstract:
Methods and apparatus are described for providing and operating an efficient infrastructure to implement a built-in clock stop and scan dump (CSSD) scheme for fabric blocks, such as block random access memory (BRAM), UltraRAM (URAM), digital signal processing (DSP) blocks, configurable logic elements (CLEs), and the like. This is a very useful feature for system debug and can also be applied for emulation use cases (e.g., FPGA emulation). This scheme can be applied to any tiled architecture that has highly repetitive blocks. The infrastructure may include a DFx controller shared across multiple tiled blocks with some distributed logic in each block, in an effort to minimize or at least reduce area overhead. The infrastructure may also minimize or at least reduce utilization of fabric resources in an effort to ensure the least perturbation of the original design, such that the design issues being debugged can be easily reproduced.
Abstract:
A circuit for implementing a scan chain in an integrated circuit having a clock domain crossing is described. The circuit comprises a first dual-edge storage circuit configured to receive an input signal at a scan input and to receive a first clock signal in a first clock domain at a clock input; a storage element having a data input configured to receive an output of the first dual-edge storage circuit; a second dual-edge storage circuit configured to receive an output of the storage element at a scan input and to receive a second clock signal in a second clock domain at a clock input; and a pulse generator configured to provide, to a clock input of the storage element, a pulse signal having a pulse width selected to enable the second dual-edge storage element to store the output of the first dual-edge storage element.
Abstract:
Techniques for providing a semiconductor assembly having an interconnect die for die-to-die interconnection, an IC package, a method for manufacturing, and a method for routing signals in an IC package are described. In one implementation, a semiconductor assembly is provided that includes a first interconnect die coupled to a first integrated circuit (IC) die and a second IC die by inter-die connections. The first interconnect die includes solid state circuitry that provides a signal transmission path between the IC dice.
Abstract:
An apparatus relating generally to time-to-digital conversion is disclosed. In this apparatus, a time-to-digital converter is coupled to a period sensor. The period sensor includes a pulse generator to generate a pulse. An integrator of the period sensor is coupled to receive the pulse to generate an analog voltage signal responsive to the pulse. The time-to-digital converter includes an analog-to-digital converter coupled to provide a digital signal associated with the analog voltage signal.
Abstract:
In one example, an integrated circuit (IC) is provided that includes data circuitry and a processing circuitry. The data circuitry is configured to provide data to be transferred to a different circuitry within the IC or to an external IC. The processing circuitry is configured to: read the data provided by the data circuitry before it is transferred to the different circuitry or the external IC; calculate a first signature for the data; attach the first signature to the data; calculate, after transferring the data to the different circuitry or the external IC, a second signature for the data; extract the first signature corresponding to the data; compare the first signature to the second signature; and generate a signal based on a comparison of the first signature to the second signature.
Abstract:
A semiconductor device comprises a plurality of memory elements, test control circuitry, and a testing interface. The test control circuitry is configure to determine that one or more clock signals associated with the memory elements have been stopped and generate a scan clock signal based on the determination that the one or more clock signals have been stopped. The test control circuitry is further configured to communicate the scan clock signal to the memory elements. The testing interface is configured to communicate test data from the memory elements. In one example, the test data is delimited with start and end marker elements. The semiconductor device is mounted to a circuit board and is communicatively coupled to communication pins of the circuit board.
Abstract:
Embodiments herein describe a hardware based scrubbing scheme where correction logic is integrated with memory elements such that scrubbing is performed by hardware. The correction logic reads the data words stored in the memory element during idle cycles. If a correctable error is detected, the correction logic can then use a subsequent idle cycle to perform a write to correct the error (i.e., replace the corrupted data stored in the memory element with corrected data). By using built-in or integrated correction logic, the embodiments herein do not add extra work for the processor, or can work with applications that do not include a processor. Further, because the correction logic scrubs the memory during idle cycles, correcting bit errors does not have a negative impact on the performance of the memory element. Memory scrubbing can delay the degradation of data error, extending the integrity of the data in the memory.