公开(公告)号：US09576927B2

公开(公告)日：2017-02-21

申请号：US14731431

申请日：2015-06-05

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Takatoshi Kawamura ,  Kohei Seyama ,  Akira Sato

IPC: B29C65/00 ,  B32B37/08 ,  B32B43/00 ,  F16K49/00 ,  F16L53/00 ,  H01L23/00 ,  B32B37/06 ,  B29C65/44 ,  B29C65/18 ,  B29K701/10 ,  B29L31/34 ,  B32B37/10

CPC classification number: H01L24/75 ,  B29C65/18 ,  B29C65/44 ,  B29K2701/10 ,  B29L2031/3406 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2307/202 ,  B32B2457/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/75802 ,  H01L2224/75803 ,  H01L2224/75824 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/00012

Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.

Abstract translation: 一种焊接工具冷却装置（10），设置在包括框架（12）的接合台附近; 包括接地板（14）的冷却构件（16），所述接地板（14）具有接地工具（61）的前边缘表面接地的接地表面（14a），和散热片（15） 所述接地板（14）到达所述地面（14a），其中所述冷却构件（16）通过支撑机构（200）支撑在所述框架（12）上，使得所述冷却构件（16）能够围绕两个轴线旋转， 即沿着地面（14a）延伸的X轴和沿地面（14a）延伸的Y轴。 粘合工具的冷却时间可以降低。

公开(公告)号：US11302666B2

公开(公告)日：2022-04-12

申请号：US16464276

申请日：2017-11-17

Applicant: SHINKAWA LTD.

Inventor： Manato Nishide ,  Kohei Seyama ,  Hijiri Hayashi

IPC: H01L23/00 ,  B23K1/00 ,  B23K3/08

Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.

公开(公告)号：US10340163B2

公开(公告)日：2019-07-02

申请号：US15624717

申请日：2017-06-16

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama

IPC: H01L21/67 ,  H01L23/00 ,  H02K41/02 ,  H02K41/03 ,  H05K13/04 ,  H02K11/21

Abstract: The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a Y-direction load receiver installed on the secondary pedestal in a manner movable in the X direction and immovable in the Y direction, in which an X-direction stator is attached to the secondary pedestal, and in which one end of a Y-direction stator attached to the gantry frame and the Y-direction load receiver are connected using a connection member, thereby suppressing vibration of the primary pedestal caused when the plurality of mounting heads are moved in the X and Y directions.

公开(公告)号：US09406640B2

公开(公告)日：2016-08-02

申请号：US14743050

申请日：2015-06-18

Applicant: Shinkawa Ltd.

Inventor： Kohei Seyama

IPC: B23K31/02 ,  B23K37/00 ,  H01L23/00 ,  B23K3/00 ,  B23K37/04 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/00 ,  B23K37/04 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/75701 ,  H01L2224/75703 ,  H01L2224/75744 ,  H01L2224/75801 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Provided is a flip chip bonder including: a base (12); a bonding stage (20); a plurality of vertical-position adjustment support mechanisms (30) attached to the base (12), and respectively configured to support, in a vertical direction, the bonding stage (20) at a plurality of supporting points being provided on a lower surface (22) of the bonding stage (20), and to adjust positions of the supporting points in the vertical direction; and a leaf spring mechanism (40) configured to connect the base (12) with the bonding stage (20). The leaf spring mechanism (40) restrains movement of the bonding stage (20) relative to the base (12) in an X axis along a surface (21) of the bonding stage (20) and a Y axis perpendicular to the X axis, and allows first twisting about the X axis and second twisting about the Y axis of the bonding stage (20) relative to the base (12), and movement of the bonding stage (20) relative to the base (12) in the vertical direction. This provides the flip chip bonder with improved bonding quality and increased bonding speed.

Abstract translation: 提供一种倒装芯片接合器，包括：基座（12）; 接合台（20）; 多个垂直位置调整支撑机构（30），其安装在所述基座（12）上，并且分别构造成在垂直方向上支撑在多个支撑点处的接合台（20），所述多个支撑点设置在下表面 22），并且调整支撑点在垂直方向上的位置; 以及板弹簧机构（40），其构造成将所述基座（12）与所述接合台（20）连接。 板簧机构（40）沿着接合台（20）的表面（21）和垂直于X轴的Y轴在X轴上限制接合台（20）相对于基座（12）的移动， 并且允许围绕X轴的第一扭转和关于接合台（20）的Y轴相对于基部（12）的第二扭转，以及接合台（20）相对于基座（12）在垂直方向上的移动 。 这提供了具有改进的接合质量和增加的接合速度的倒装焊接机。

公开(公告)号：US12191276B2

公开(公告)日：2025-01-07

申请号：US17642948

申请日：2020-07-16

Applicant: SHINKAWA LTD.

Inventor： Alexander Dzhangirov ,  Kohei Seyama

IPC: B32B41/00 ,  H01L23/00

Abstract: The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.

公开(公告)号：US11664344B2

公开(公告)日：2023-05-30

申请号：US16768694

申请日：2018-11-28

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama ,  Tetsuya Utano

IPC: H01L23/00 ,  B65G47/91 ,  B65H18/14 ,  B65H18/16

CPC classification number: H01L24/75 ,  B65G47/912 ,  B65H18/145 ,  B65H18/16 ,  H01L24/83 ,  H01L2224/7555 ,  H01L2224/75745 ,  H01L2224/83203 ,  H01L2224/83855

Abstract: A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.

公开(公告)号：US11569192B2

公开(公告)日：2023-01-31

申请号：US16615816

申请日：2018-05-24

Applicant: SHINKAWA LTD. ,  TOHOKU UNIVERSITY

Inventor： Yuji Eguchi ,  Kohei Seyama ,  Tomonori Nakamura ,  Hiroshi Kikuchi ,  Takehito Shimatsu ,  Miyuki Uomoto

IPC: H01L23/00

Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

公开(公告)号：US11139193B2

公开(公告)日：2021-10-05

申请号：US16632870

申请日：2018-07-12

Applicant: SHINKAWA LTD.

Inventor： Tetsuya Utano ,  Yuichiro Noguchi ,  Kohei Seyama

IPC: H01L21/68 ,  B65G47/91 ,  H01L21/67 ,  H01L21/66 ,  H01L23/00 ,  H01L21/52

Abstract: This mounting device (100) comprises: a base (10) that moves linearly in relation to a substrate (16); a bonding head (20) that is attached to the base (10); a camera (25) that is attached to the base (10) and identifies the position of the substrate (16); a linear scale (33) having a plurality of graduations along the movement direction; a bonding head-side encoder head (31); and a camera-side encoder head (32). A control unit (50) causes the base (10) to move to a position where the bonding head-side encoder head (31) detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die (15) in relation to the substrate (16) is improved.

公开(公告)号：US11062964B2

公开(公告)日：2021-07-13

申请号：US16337927

申请日：2017-09-26

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama

IPC: H01L21/66 ,  H01L21/52 ,  H01L21/67

Abstract: A method for manufacturing a semiconductor device and a mounting apparatus are provided. The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface, a temporary substrate which is transmissive with respect to an alignment mark; an image acquisition step for acquiring an image of the alignment mark and an image of a semiconductor die; a correction step for correcting, on the basis of the image of the alignment mark and the image of the semiconductor die acquired in the image acquisition step, the position in the horizontal direction of a bonding head that pressure bonds the semiconductor die to the temporary substrate; and a pressure bonding step for pressure bonding the semiconductor die to the transmissive substrate on the basis of the corrected position in the horizontal direction.

公开(公告)号：US10910248B2

公开(公告)日：2021-02-02

申请号：US16068361

申请日：2016-11-29

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H05K13/04 ,  H01L21/683

Abstract: A flip-chip bonding apparatus for mounting semiconductor chips on a circuit board is provided with: a mounting head, to which a plurality of mounting nozzles for moving, in the vertical direction, mounting tools for vacuum-sucking the semiconductor chips are attached by being aligned in the Y direction, said mounting head moving in the Y direction; and an electronic component handling unit, that moves in the X direction perpendicular to the Y direction, picks up the semiconductor chips such that the semiconductor chips are aligned in the X direction, inverts the semiconductor chips, and at the same time, changes the alignment direction of the semiconductor chips from the X direction to the Y direction. Consequently, in the electronic component mounting apparatus, installation area can be saved and bonding speed can be increased with the simple configuration.