公开(公告)号：US11569192B2

公开(公告)日：2023-01-31

申请号：US16615816

申请日：2018-05-24

Applicant: SHINKAWA LTD. ,  TOHOKU UNIVERSITY

Inventor： Yuji Eguchi ,  Kohei Seyama ,  Tomonori Nakamura ,  Hiroshi Kikuchi ,  Takehito Shimatsu ,  Miyuki Uomoto

IPC: H01L23/00

Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

公开(公告)号：US12217996B2

公开(公告)日：2025-02-04

申请号：US17603934

申请日：2020-04-13

Applicant: SHINKAWA LTD.

Inventor： Jin Li ,  Hiroshi Kikuchi ,  Satoshi Enokido

IPC: H01L21/683 ,  H01L21/677

Abstract: This conveying device 1 comprises: a chuck 2 that contactlessly holds a semiconductor chip 103 to face a holding surface 2B; and a guide 3 that has a guide probe 9 capable of abutting a chip side surface 103s of the semiconductor chip 103, and for the semiconductor chip 103 held by the chuck 2, the guide probe 9 limits the movement of the semiconductor chip 103 in the lateral direction which intersects a normal N to the holding surface 2B. The guide probe 9 is capable of reciprocating movement in which a probe tip 9a moves towards and away from the holding surface 2B.

公开(公告)号：US11562916B2

公开(公告)日：2023-01-24

申请号：US16650381

申请日：2018-08-22

Applicant: SHINKAWA LTD.

Inventor： Shoji Wada ,  Hiroshi Kikuchi

IPC: H01L21/67 ,  G01N25/18

Abstract: The present invention is provided with: a stage having a placing surface for a semiconductor chip, and a first heater heating the placing surface; a bonding head having a contact surface to be in contact with an subject, a second temperature sensor measuring the temperature of the subject via the contact surface, and a second heater heating the contact surface, said bonding head being driven in at least the orthogonal direction with respect to the placing surface; and a control unit measuring the temperature of the subject based on a temperature detection value of the second temperature sensor, said temperature detection value having being obtained by heating the placing surface and the contact surface to predetermined target temperatures, respectively, by means of the first and second heaters, then bringing the contact surface into contact with the subject in a state wherein heating by the second heater is stopped.