Semiconductor devices including a finFET

    公开(公告)号:US09608117B2

    公开(公告)日:2017-03-28

    申请号:US15049859

    申请日:2016-02-22

    Abstract: A semiconductor device includes an active fin structure extending in a first direction, the active fin structure including protruding portions divided by a recess, a plurality of gate structures extending in a second direction crossing the first direction and covering the protruding portions of the active fin structure, a first epitaxial pattern in a lower portion of the recess between the gate structures, a second epitaxial pattern on a portion of the first epitaxial pattern, the second epitaxial pattern contacting a sidewall of the recess, and a third epitaxial pattern on the first and second epitaxial patterns, the third epitaxial pattern filling the recess. The first epitaxial pattern includes a first impurity region having a first doping concentration, the second epitaxial pattern includes a second impurity region having a second doping concentration lower than the a first doping concentration, and the third epitaxial pattern includes a third impurity region having a third doping concentration higher than the second doping concentration. The semiconductor device may have good electrical characteristics.

    Semiconductor device having a stress film on a side surface of a fin
    13.
    发明授权
    Semiconductor device having a stress film on a side surface of a fin 有权
    在翅片的侧面具有应力膜的半导体装置

    公开(公告)号:US09153692B2

    公开(公告)日:2015-10-06

    申请号:US14194837

    申请日:2014-03-03

    CPC classification number: H01L29/7848 H01L29/66545 H01L29/785

    Abstract: Provided is a semiconductor device. The semiconductor device includes a fin on a substrate; a gate electrode cross the fin on the substrate; a source/drain formed on at least one of both sides of the gate electrode, and including a first film and a second film; and a stress film arranged between an isolation film on the substrate and the source/drain, and formed on a side surface of the fin.

    Abstract translation: 提供一种半导体器件。 半导体器件在衬底上包括翅片; 栅电极跨越衬底上的翅片; 源极/漏极,形成在栅电极的两侧中的至少一个上,并且包括第一膜和第二膜; 以及布置在基板上的隔离膜和源极/漏极之间并且形成在鳍的侧表面上的应力膜。

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