Semiconductor device having a stress film on a side surface of a fin
    1.
    发明授权
    Semiconductor device having a stress film on a side surface of a fin 有权
    在翅片的侧面具有应力膜的半导体装置

    公开(公告)号:US09153692B2

    公开(公告)日:2015-10-06

    申请号:US14194837

    申请日:2014-03-03

    CPC classification number: H01L29/7848 H01L29/66545 H01L29/785

    Abstract: Provided is a semiconductor device. The semiconductor device includes a fin on a substrate; a gate electrode cross the fin on the substrate; a source/drain formed on at least one of both sides of the gate electrode, and including a first film and a second film; and a stress film arranged between an isolation film on the substrate and the source/drain, and formed on a side surface of the fin.

    Abstract translation: 提供一种半导体器件。 半导体器件在衬底上包括翅片; 栅电极跨越衬底上的翅片; 源极/漏极,形成在栅电极的两侧中的至少一个上,并且包括第一膜和第二膜; 以及布置在基板上的隔离膜和源极/漏极之间并且形成在鳍的侧表面上的应力膜。

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