Method of manufacturing variable resistance memory device

    公开(公告)号:US11683940B2

    公开(公告)日:2023-06-20

    申请号:US17339297

    申请日:2021-06-04

    Inventor: Dongkyu Lee

    CPC classification number: H01L27/2454 H01L45/08 H01L45/1233 H01L45/1608

    Abstract: A variable resistance memory device and a method of manufacturing the same, the variable resistance memory device including a substrate including a first memory region and a second memory region; a plurality of first memory cells on the first memory region; and a plurality of second memory cells on the second memory region, wherein each of the first memory cells includes a first resistance element and a selection element, each of the second memory cells includes a second resistance element, and a maximum value of a variable resistance of the second resistance element is less than a maximum value of a variable resistance of the first resistance element.

    Electronic device for recognizing object and method for controlling electronic device

    公开(公告)号:US11410413B2

    公开(公告)日:2022-08-09

    申请号:US17274282

    申请日:2019-09-10

    Abstract: According to an embodiment of the disclosure, an electronic device may include a communication interface, a dynamic vision sensor (DVS) to generate bit data for each of a plurality of image frames, based on change in illuminance, a processor electrically connected with the communication interface and the DVS, and a memory electrically connected with the processor. The memory may store instructions, and the instructions may cause the processor to filter out at least a partial frame of the plurality of image frames, based on a ratio of the number of a bit value, which is included in the bit data and corresponds to each pixel, to the number of total pixels constituting each of the plurality of image frames, and recognize a shape of a surrounding object of the electronic device, based on another frame of the plurality of image frames. Moreover, various embodiment found through the disclosure are possible.

    IMAGE SENSOR INCLUDING AUTO-FOCUS PIXELS

    公开(公告)号:US20220181372A1

    公开(公告)日:2022-06-09

    申请号:US17507374

    申请日:2021-10-21

    Abstract: An image sensor includes a normal pixel, a first auto-focus (AF) pixel, and a second AF pixel, each of the normal pixel, the first AF pixel and the second AF pixel including a photodiode. The image sensor further includes a normal microlens disposed on the normal pixel, and a first AF microlens disposed on the first AF pixel and the second AF pixel. The photodiode of the normal pixel, the photodiode of the first AF pixel, and the photodiode of the second AF pixel are respectively disposed in photo-detecting areas of a semiconductor substrate. A height of the first AF microlens in a vertical direction from a top surface of the semiconductor substrate is greater than a height of the normal microlens in the vertical direction from the top surface of the semiconductor substrate.

    Electronic device with removable module

    公开(公告)号:US11116108B2

    公开(公告)日:2021-09-07

    申请号:US16650550

    申请日:2017-10-27

    Abstract: An electronic device according to various embodiments comprises: a case for accommodating at least one electronic part; an upper cover for covering at least one part of an upper end of the case; and a connector, which is arranged on the upper cover, for electrically connecting an external module and the at least one electronic part, wherein the upper cover can guide heat generated from the at least one electronic part such that the heat is discharged to the outside along a side part of the upper cover. Additional other embodiments are possible.

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