INSPECTION SYSTEM AND METHOD USING AN OFF-AXIS UNOBSCURED OBJECTIVE LENS
    11.
    发明申请
    INSPECTION SYSTEM AND METHOD USING AN OFF-AXIS UNOBSCURED OBJECTIVE LENS 审中-公开
    检查系统和方法使用离轴未知目标镜头

    公开(公告)号:US20160139032A1

    公开(公告)日:2016-05-19

    申请号:US14668879

    申请日:2015-03-25

    Abstract: An inspection system is provided that can include a reflectometer having a light source for projecting light, and a light splitter for receiving the light projected by the light source, transforming at least one aspect of the light, and projecting the light once transformed. The reflectometer further has an off-axis unobscured objective lens through which the light transformed by the light splitter passes to contact a fabricated component, and has a detector for detecting a result of the transformed light contacting the fabricated component. The inspection system can additionally, or alternatively, include an ellipsometer having a light source similar to the reflectometer, and further a polarizing element to polarize the light of the light splitter. The polarized light passes through an off-axis unobscured objective lens to contact a fabricated component, and a detector detects a result of the polarized light contacting the fabricated component.

    Abstract translation: 提供了一种检查系统,其可以包括具有用于投射光的光源的反射计,以及用于接收由光源投影的光的光分离器,转化至少一个方面的光,并且一旦转换就投射光。 反射计进一步具有离轴未遮蔽的物镜,由光分离器变换的光穿过该物镜接触制造的部件,并具有检测器,用于检测与制造的部件接触的变形光的结果。 检查系统可另外地或替代地包括具有类似于反射计的光源的椭圆计,还有一个使光分离器的光偏振的偏振元件。 偏振光通过离轴未遮蔽的物镜接触制造的部件,并且检测器检测与制造的部件接触的偏振光的结果。

    Multiple angles of incidence semiconductor metrology systems and methods
    12.
    发明授权
    Multiple angles of incidence semiconductor metrology systems and methods 有权
    多重入射角度半导体测量系统和方法

    公开(公告)号:US09116103B2

    公开(公告)日:2015-08-25

    申请号:US14043783

    申请日:2013-10-01

    Abstract: An apparatus includes (i) a bright light source for providing an illumination beam at multiple wavelengths selectable with a range from a deep ultraviolet wavelength to an infrared wavelength, (ii) illumination optics for directing the illumination beam towards a sample at selectable sets of angles of incidence (AOI's) or azimuth angles (AZ's) and polarization states to provide spectroscopic ellipsometry, wherein the illumination optics include an apodizer for controlling a spot size of the illumination beam on the sample at each of the selectable AOI/AZ sets, (iii) collection optics for directing an output beam from the sample in response to the illumination beam at each of the selectable AOI/AZ sets and polarization states towards a detector that generates an output signal or image based on the output beam, and (v) a controller for characterizing a feature of the sample based on the output signal or image.

    Abstract translation: 一种装置包括(i)用于提供在从深紫外波长到红外波长的范围内可选择的多个波长的照明光束的明亮光源,(ii)照明光学器件,用于将照明光束以可选择的角度集合 (AOI)或方位角(AZ)和极化状态以提供光谱椭偏仪,其中照明光学器件包括用于控制每个可选AOI / AZ组上样品上的照明光束的光斑尺寸的变迹器,(iii )收集光学器件,用于响应于在每个可选择的AOI / AZ集合处的照明光束和朝向基于输出光束产生输出信号或图像的检测器的偏振状态来引导来自样品的输出光束,以及(v) 控制器,用于基于输出信号或图像来表征样本的特征。

    Metrology systems and methods for high aspect ratio and large lateral dimension structures
    13.
    发明授权
    Metrology systems and methods for high aspect ratio and large lateral dimension structures 有权
    高纵横比和大横向尺寸结构的计量系统和方法

    公开(公告)号:US08860937B1

    公开(公告)日:2014-10-14

    申请号:US13743304

    申请日:2013-01-16

    Abstract: Various metrology systems and methods for high aspect ratio and large lateral dimension structures are provided. One method includes directing light to one or more structures formed on a wafer. The light includes ultraviolet light, visible light, and infrared light. The one or more structures include at least one high aspect ratio structure or at least one large lateral dimension structure. The method also includes generating output responsive to light from the one or more structures due to the light directed to the one or more structures. In addition, the method includes determining one or more characteristics of the one or more structures using the output.

    Abstract translation: 提供了用于高纵横比和大横向尺寸结构的各种计量系统和方法。 一种方法包括将光引导到在晶片上形成的一个或多个结构。 该光包括紫外光,可见光和红外光。 一个或多个结构包括至少一个高纵横比结构或至少一个大的横向尺寸结构。 该方法还包括响应于来自一个或多个结构的光而产生输出,这是由于指向一个或多个结构的光。 另外,该方法包括使用该输出确定一个或多个结构的一个或多个特性。

    Optical system polarizer calibration
    14.
    发明授权
    Optical system polarizer calibration 有权
    光学系统偏光镜校准

    公开(公告)号:US08797534B2

    公开(公告)日:2014-08-05

    申请号:US14034869

    申请日:2013-09-24

    CPC classification number: G01N21/21 G01J3/504 G01N21/274

    Abstract: An apparatus to calibrate a polarizer in a polarized optical system at any angle of incidence. The apparatus decouples the polarization effect of the system from the polarization effect of the sample. The apparatus includes a substrate with a polarizer disposed on the surface. An indicator on the substrate indicates the polarization orientation of the polarizer, which is in a predetermined orientation with respect to the substrate.

    Abstract translation: 一种在任何入射角度校准偏振光学系统中的偏振器的装置。 该装置将系统的极化效应与样品的极化效应分离。 该装置包括具有设置在表面上的偏振器的基板。 衬底上的指示器指示偏振器的偏振取向,其偏离相对于衬底的预定取向。

    Optical System Polarizer Calibration
    15.
    发明申请
    Optical System Polarizer Calibration 有权
    光学系统偏振器校准

    公开(公告)号:US20140043608A1

    公开(公告)日:2014-02-13

    申请号:US14034869

    申请日:2013-09-24

    CPC classification number: G01N21/21 G01J3/504 G01N21/274

    Abstract: An apparatus to calibrate a polarizer in a polarized optical system at any angle of incidence. The apparatus decouples the polarization effect of the system from the polarization effect of the sample. The apparatus includes a substrate with a polarizer disposed on the surface. An indicator on the substrate indicates the polarization orientation of the polarizer, which is in a predetermined orientation with respect to the substrate.

    Abstract translation: 一种在任何入射角度校准偏振光学系统中的偏振器的装置。 该装置将系统的极化效应与样品的极化效应分离。 该装置包括具有设置在表面上的偏振器的基板。 衬底上的指示器指示偏振器的偏振取向,其偏离相对于衬底的预定取向。

    Dynamically Adjustable Semiconductor Metrology System
    16.
    发明申请
    Dynamically Adjustable Semiconductor Metrology System 有权
    动态可调半导体计量系统

    公开(公告)号:US20130114085A1

    公开(公告)日:2013-05-09

    申请号:US13661752

    申请日:2012-10-26

    CPC classification number: G01N21/55 G01N21/211 G01N2021/213 G01N2021/556

    Abstract: The present invention may include an illumination source, a detector, a selectably adjustable optical system including a dynamically adjustable illumination pupil of the illumination arm, a dynamically adjustable collection pupil of the collection arm, a dynamically adjustable illumination field stop of the illumination arm, a dynamically adjustable collection field stop of the collection arm, a sensor configured to measure one or more optical characteristics of one or more components of the optical system, and a control system configured to selectably dynamically adjust at least one of the illumination pupil, the collection pupil, the illumination field stop, the collection field stop, and a spectral radiance of the illumination source.

    Abstract translation: 本发明可以包括照明源,检测器,可选择地调节的光学系统,其包括照明臂的动态可调节照明光瞳,收集臂的动态可调收集光瞳,照明臂的动态可调照明场停止, 收集臂的可动态调整的收集场停止,被配置为测量所述光学系统的一个或多个部件的一个或多个光学特性的传感器,以及被配置为可选择地动态地调整所述照明瞳孔,所述收集瞳孔 照明场停止,收集场停止以及照明源的光谱。

    Optical Measurement Of A Highly Absorbing Film Layer Over Highly Reflective Film Stacks

    公开(公告)号:US20190107384A1

    公开(公告)日:2019-04-11

    申请号:US16150268

    申请日:2018-10-02

    CPC classification number: G01B11/0625 G01B11/0641 G01B2210/56

    Abstract: Apparatus and methods for performing optically based film thickness measurements of highly absorbing films (e.g., high-K dielectric films) with improved measurement sensitivity are described herein. A highly absorbing film layer is fabricated on top of a highly reflective film stack. The highly reflective film stack includes one or more nominally identical sets of multiple layers of different, optically contrasting materials. The highly reflective film stack gives rise to optical resonance in particular wavelength ranges. The high reflectance at the interface of the highly absorbing film layer and the highly reflective film stack increases measured light intensity and measurement sensitivity. The thickness and optical dispersion of the different material layers of the highly reflective film stack are selected to induce optical resonance in a desired wavelength range. The desired wavelength range is selected to minimize absorption by the highly absorbing film under measurement.

    Infrared spectroscopic reflectometer for measurement of high aspect ratio structures

    公开(公告)号:US10215693B2

    公开(公告)日:2019-02-26

    申请号:US15382713

    申请日:2016-12-18

    Abstract: Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of backside reflections on measurement results. In another aspect, a broad range of infrared wavelengths are detected by a detector that includes multiple photosensitive areas having different sensitivity characteristics. Collected light is linearly dispersed across the surface of the detector according to wavelength. Each different photosensitive area is arranged on the detector to sense a different range of incident wavelengths. In this manner, a broad range of wavelengths are detected with high signal to noise ratio by a single detector.

    Metrology system calibration refinement

    公开(公告)号:US09857291B2

    公开(公告)日:2018-01-02

    申请号:US14277898

    申请日:2014-05-15

    Abstract: Methods and systems for matching measurement spectra across one or more optical metrology systems are presented. The values of one or more system parameters used to determine the spectral response of a specimen to a measurement performed by a target metrology system are optimized. The system parameter values are optimized such that differences between measurement spectra generated by a reference system and the target system are minimized for measurements of the same metrology targets. Methods and systems for matching spectral errors across one or more optical metrology systems are also presented. A trusted metrology system measures the value of at least one specimen parameter to minimize model errors introduced by differing measurement conditions present at the time of measurement by the reference and target metrology systems. Methods and systems for parameter optimization based on low-order response surfaces are presented to reduce the compute time required to refine system calibration parameters.

Patent Agency Ranking