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公开(公告)号：US10345095B1
公开(公告)日：2019-07-09
申请号：US14947510
申请日：2015-11-20
Applicant: KLA-Tencor Corporation
Inventor： Stilian Ivanov Pandev , Leonid Poslavsky , Dzmitry Sanko , Andrei V. Shchegrov
Abstract: Methods and systems for solving measurement models of complex device structures with reduced computational effort are presented. In some embodiments, a measurement signal transformation model is employed to compute transformed measurement signals from coarse measurement signals. The transformed measurement signals more closely approximate a set of measured signals than the coarse measurement signals. However, the coarse set of measured signals are computed with less computational effort than would be required to directly compute measurement signals that closely approximate the set of measured signals. In other embodiments, a measurement signal transformation model is employed to compute transformed measurement signals from actual measured signals. The transformed measurement signals more closely approximate the coarse measurement signals than the actual measured signals. Transformed measurement signals are subsequently used for regression, library generation, or other analyses typically employed as part of an effort to characterize structural, material, and process parameters in semiconductor manufacturing.
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公开(公告)号：US10088413B2
公开(公告)日：2018-10-02
申请号：US13680273
申请日：2012-11-19
Applicant: KLA-Tencor Corporation
Inventor： Hidong Kwak , Zhiming Jiang , Ward RDell Dixon , Kenneth Edward James, Jr. , Leonid Poslavsky , Torsten Kaack
Abstract: Methods and systems for calibrating system parameter values of a target inspection system are presented. Spectral Error Based Calibration (SEBC) increases consistency among inspection systems by minimizing differences in the spectral error among different inspection systems for a given specimen or set of specimens. The system parameter values are determined such that differences between a spectral error associated with a measurement of a specimen by the target inspection system and a spectral error associated with a measurement of the same specimen by a reference inspection system are minimized. In some examples, system parameter values are calibrated without modifying specimen parameters. Small inaccuracies in specimen parameter values have little effect on the calibration because the target system and the reference system both measure the same specimen or set of specimens. By performing SEBC over a set of specimens, the resulting calibration is robust to a wide range of specimens under test.
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公开(公告)号：US09903711B2
公开(公告)日：2018-02-27
申请号：US15090389
申请日：2016-04-04
Applicant: KLA-Tencor Corporation
Inventor： Ady Levy , Daniel Kandel , Michael E. Adel , Leonid Poslavsky , John Robinson , Tal Marciano , Barak Bringoltz , Tzahi Grunzweig , Dana Klein , Tal Itzkovich , Nadav Carmel , Nuriel Amir , Vidya Ramanathan , Janay Camp , Mark Wagner
IPC: G01B11/14 , G01B11/27 , G01N21/95 , G03F7/20 , G01N21/21 , G01N21/31 , G01N21/41 , G01N21/47 , G01N21/64
CPC classification number: G01B11/272 , G01N21/211 , G01N21/31 , G01N21/41 , G01N21/4738 , G01N21/4788 , G01N21/6489 , G01N21/9501 , G01N2021/213 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/70616
Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.
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公开(公告)号：US09347872B1
公开(公告)日：2016-05-24
申请号：US14493863
申请日：2014-09-23
Applicant: KLA-Tencor Corporation
Inventor： Leonid Poslavsky , Lie-Quan Lee
CPC classification number: G01N21/211 , G01N21/9501 , G01N2021/213
Abstract: Methods and systems for determining a meta-model to correct model based measurements are presented. Such systems are employed to measure structural and material characteristics (e.g., material composition, dimensional characteristics of structures and films, etc.) associated with different semiconductor fabrication processes. In one aspect, model-based measurement parameter values are corrected based on a meta-model that maps specimen parameter values determined based on the measurement model to reference parameter values determined based on a more accurate reference measurement. In another aspect, parameters of a meta-model are determined such that errors between reference parameter values and specimen parameter values determined based on the measurement model are minimized. In some embodiments, the accuracy of a corrected parameter value is an order of magnitude greater than the uncorrected parameter value.
Abstract translation: 提出了用于确定元模型以校正基于模型的测量的方法和系统。 这种系统用于测量与不同半导体制造工艺相关的结构和材料特性（例如，材料组成，结构和薄膜的尺寸特性等）。 在一个方面，基于模型的测量参数值是基于将基于测量模型确定的样本参数值映射到基于更准确的参考测量确定的参考参数值的元模型来校正的。 在另一方面，确定元模型的参数，使得基于测量模型确定的参考参数值和样本参数值之间的误差被最小化。 在一些实施例中，校正的参数值的精度比未校正的参数值大一个数量级。
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公开(公告)号：US09311431B2
公开(公告)日：2016-04-12
申请号：US13665436
申请日：2012-10-31
Applicant: KLA-Tencor Corporation
Inventor： Sungchul Yoo , Andrei V. Shchegrov , Thaddeus G. Dziura , InKyo Kim , SeungHwan Lee , ByeoungSu Hwang , Leonid Poslavsky
CPC classification number: G06F17/50 , G01N21/47 , G01N21/956 , G03F7/70625 , G03F7/70683 , G06F17/10 , G06F17/40 , G06F19/00
Abstract: The disclosure is directed to improving optical metrology for a sample with complex structural attributes utilizing custom designed secondary targets. At least one parameter of a secondary target may be controlled to improve sensitivity for a selected parameter of a primary target and/or to reduce correlation of the selected parameter with other parameters of the primary target. Parameters for the primary and secondary target may be collected. The parameters may be incorporated into a scatterometry model. Simulations utilizing the scatterometry model may be conducted to determine a level of sensitivity or a level of correlation for the selected parameter of the primary target. The controlled parameter of the secondary target may be modified until a selected level of sensitivity or a selected level of correlation is achieved.
Abstract translation: 本公开旨在改进具有利用定制设计的次要目标的具有复杂结构属性的样本的光学计量学。 可以控制辅助目标的至少一个参数以提高对主要目标的选定参数的灵敏度和/或减少所选参数与主要目标的其他参数的相关性。 可以收集主要和次要目标的参数。 这些参数可以并入散射测量模型中。 可以进行利用散射测量模型的模拟来确定主要目标的选定参数的灵敏度水平或相关程度。 可以修改辅助目标的受控参数，直到达到所选择的灵敏度水平或所选择的相关水平。
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Patent Agency Ranking
公开(公告)号：US20140340682A1
公开(公告)日：2014-11-20
申请号：US14277898
申请日：2014-05-15
Applicant: KLA-Tencor Corporation
Inventor： Hidong Kwak , John Lesoine , Malik Sadiq , Lanhua Wei , Shankar Krishnan , Leonid Poslavsky , Mikhail M. Sushchik
CPC classification number: G01N21/211 , G01B2210/56 , G01N21/274 , G01N21/9501 , G01N2021/213
Abstract: Methods and systems for matching measurement spectra across one or more optical metrology systems are presented. The values of one or more system parameters used to determine the spectral response of a specimen to a measurement performed by a target metrology system are optimized. The system parameter values are optimized such that differences between measurement spectra generated by a reference system and the target system are minimized for measurements of the same metrology targets. Methods and systems for matching spectral errors across one or more optical metrology systems are also presented. A trusted metrology system measures the value of at least one specimen parameter to minimize model errors introduced by differing measurement conditions present at the time of measurement by the reference and target metrology systems. Methods and systems for parameter optimization based on low-order response surfaces are presented to reduce the compute time required to refine system calibration parameters.
Abstract translation: 提出了用于匹配一个或多个光学测量系统的测量光谱的方法和系统。 用于确定样本对目标计量系统执行的测量的光谱响应的一个或多个系统参数的值被优化。 对系统参数值进行优化，使得由参考系统生成的测量光谱与目标系统之间的差异最小化，以测量相同的度量目标。 还提出了用于在一个或多个光学测量系统上匹配光谱误差的方法和系统。 可靠的计量系统测量至少一个样本参数的值，以最小化由参考和目标计量系统测量时存在的不同测量条件引入的模型误差。 提出了基于低阶响应面的参数优化方法和系统，以减少改进系统校准参数所需的计算时间。
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公开(公告)号：US10648793B2
公开(公告)日：2020-05-12
申请号：US14710462
申请日：2015-05-12
Applicant: KLA-Tencor Corporation
Inventor： Leonid Poslavsky , Liequan Lee
Abstract: A library expansion system, method, and computer program product for metrology are provided. In use, processing within a first multi-dimensional library is performed by a metrology system. During the processing within the first multi-dimensional library, a second multi-dimensional library is identified. The processing is then transitioned to the second multi-dimensional library. Further, processing within the second multi-dimensional library is performed by the metrology system.
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公开(公告)号：US10393647B1
公开(公告)日：2019-08-27
申请号：US14578245
申请日：2014-12-19
Applicant: KLA-Tencor Corporation
Inventor： Qiang Jimmy Zhao , Liequan Lee , Jonathan Ian Iloreta , Hong Qiu , Leonid Poslavsky
IPC: G01N21/25
Abstract: A system, method, and computer program product are provided for automatically determining a parameter causing an abnormal semiconductor metrology measurement. In use, an abnormal semiconductor metrology measurement measured from a fabricated semiconductor component is received. At least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement is then automatically determined by one or more hardware processors. In particular, the one or more hardware processors determine a subset of parameters of the fabricated semiconductor component as potential sources of the abnormal semiconductor metrology measurement, rank the parameters in the determined subset of parameters, select an Nth number of the parameters in the determined subset of parameters in accordance with the ranking, and then analyze each of the selected parameters to identify one or more of the selected parameters as the at least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement.
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公开(公告)号：US10079183B2
公开(公告)日：2018-09-18
申请号：US14312568
申请日：2014-06-23
Applicant: KLA-Tencor Corporation
Inventor： Xiang Gao , Philip D. Flanner, III , Leonid Poslavsky , Ming Di , Qiang Zhao , Scott Penner
CPC classification number: H01L22/12 , G01N21/211 , G01N2021/213 , H01L22/20
Abstract: Methods and systems of process control and yield management for semiconductor device manufacturing based on predictions of final device performance are presented herein. Estimated device performance metric values are calculated based on one or more device performance models that link parameter values capable of measurement during process to final device performance metrics. In some examples, an estimated value of a device performance metric is based on at least one structural characteristic and at least one band structure characteristic of an unfinished, multi-layer wafer. In some examples, a prediction of whether a device under process will fail a final device performance test is based on the difference between an estimated value of a final device performance metric and a specified value. In some examples, an adjustment in one or more subsequent process steps is determined based at least in part on the difference.
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10.发明申请LIBRARY EXPANSION SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR METROLOGY 审中-公开图书馆扩展系统，方法和计算机程序产品公开(公告)号：US20150330770A1
公开(公告)日：2015-11-19
申请号：US14710462
申请日：2015-05-12
Applicant: KLA-Tencor Corporation
Inventor： Leonid Poslavsky , Liequan Lee
CPC classification number: G01B11/02 , G01B11/00 , G01B21/04 , G01N21/211 , G01N21/9501 , G01N21/95607 , G01N2021/213 , G01N2021/95615 , G03F7/70625
Abstract: A library expansion system, method, and computer program product for metrology are provided. In use, processing within a first multi-dimensional library is performed by a metrology system. During the processing within the first multi-dimensional library, a second multi-dimensional library is identified. The processing is then transitioned to the second multi-dimensional library. Further, processing within the second multi-dimensional library is performed by the metrology system.
Abstract translation: 提供了图书馆扩展系统，方法和计算机程序产品。 在使用中，第一多维库中的处理由计量系统执行。 在第一多维库中的处理期间，识别第二个多维库。 然后处理过渡到第二个多维库。 此外，第二多维库中的处理由计量系统执行。
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