THERMAL MONITOR FOR HIGH PRESSURE PROCESSING

    公开(公告)号:US20240218560A1

    公开(公告)日:2024-07-04

    申请号:US18397635

    申请日:2023-12-27

    Abstract: A semiconductor processing system includes a precursor delivery arrangement, a chamber arrangement, and a controller. The chamber arrangement is connected to the precursor delivery arrangement. The controller is operatively connected to the precursor delivery arrangement and the chamber arrangement, includes a processor disposed in communication with a memory, and is responsive to instructions recorded on the memory to acquire a baseline substrate thickness profile for a selected process recipe, determine a first temperature profile setting for depositing a first material layer at low pressure for the selected process recipe, determine a high-pressure thermal offset for the first temperature profile setting, apply the high-pressure thermal offset to the first temperature profile setting to determine a second temperature profile setting, seat a first substrate on the first substrate support within the chamber arrangement and flow a second material layer precursor via the precursor delivery arrangement over the first substrate at high pressure according to the selected process recipe using the second temperature profile setting.

    ESTIMATION APPARATUS FOR WATER FILM THICKNESS ON ROAD SURFACE

    公开(公告)号:US20240175679A1

    公开(公告)日:2024-05-30

    申请号:US18389014

    申请日:2023-11-13

    CPC classification number: G01B21/08

    Abstract: An estimation apparatus for a water film thickness on a road surface includes a data acquisition unit and an estimation unit. The data acquisition unit sequentially acquires a data set including driving force data representing a driving force output from a driving source of a vehicle and acceleration data representing a longitudinal acceleration of the vehicle, while the vehicle is traveling. The estimation unit estimates a thickness of a water film on a road surface on which the vehicle travels, based on a relationship between a speed of the vehicle and a fluid resistance that the vehicle receives from the water film, the flow resistance being calculated based on the data set.

    Coating Film Evaluation Structure and Evaluation Method

    公开(公告)号:US20240102797A1

    公开(公告)日:2024-03-28

    申请号:US18256246

    申请日:2020-12-09

    CPC classification number: G01B21/08 G01N17/00

    Abstract: A coating film evaluation structure includes a laminate including a first sheet, a second sheet, and a third sheet which are laminated. The second sheet is disposed on the first sheet, and the third sheet is disposed on the second sheet. In the laminate, the area of each sheet gradually reduces in the lamination direction, and a stepped portion is provided at an end portion. The coating film to be evaluated and the plurality of sheets have different colors. The coating film evaluation structure includes a coating film layer formed on the sheet having the largest area among the plurality of sheets so as to cover the other sheets and having a flat surface.

    SYSTEM AND METHOD FOR MEASURING THE THICKNESS OF REFRACTORIES

    公开(公告)号:US20240085175A1

    公开(公告)日:2024-03-14

    申请号:US18272152

    申请日:2022-01-11

    CPC classification number: G01B21/085

    Abstract: The present invention relates to a system and a method for measuring the thickness of refractories comprising a heat flux measuring device (10) for measuring the flow of heat flowing from a hot face to a cold face of the refractory, a core (11) surrounded by a thermally insulating jacket (12) comprising, in which the core (11) conducts, between a first (11a) and a second (11b) face, heat from the hot face of the refractory to the cold face of the refractory; and a measuring apparatus (20) configured to: continuously measure the temperature on the first face of the core and on the second face of the core; determining the heat flux flowing through the heat flow measuring device (10) and determining the thickness of the refractory material by means of equivalent thermal conductivity of the refractory material.

    Medium thickness detection mechanism

    公开(公告)号:US11754956B2

    公开(公告)日:2023-09-12

    申请号:US17391847

    申请日:2021-08-02

    Inventor: Chih Yuan Yang

    CPC classification number: G03G15/5029 G01B7/06 G01B21/08 G03G2215/00738

    Abstract: A thickness detection mechanism arranged in a scanner or printer for measuring the thickness of mediums fed through the scanner or printer, which comprising: a conveyor section; at least a idle roller set arranged above the conveyor section, which includes at least a shaft and an idle roller pivotally arranged on the shaft; at least an elastic portion arranged above the shaft; and at least a pressure sensor secured on the elastic portion; wherein the thickness detection mechanism measures the thickness of the medium by measuring the pressure applied on the pressure sensor by the idle roller set as the idle roller set being pushed upward, and thus avoids the medium too thin or too thick to enter the scanner or the printer.

    PRODUCT REMOVAL APPARATUS, TREATMENT SYSTEM, AND PRODUCT REMOVAL METHOD

    公开(公告)号:US20230119979A1

    公开(公告)日:2023-04-20

    申请号:US17935595

    申请日:2022-09-27

    Inventor: Fumiya OKAZAKI

    Abstract: The present disclosure provides a product removal apparatus, a treatment system, and a product removal method that can sufficiently remove the products deposited inside a vacuum pump and also suppress corrosion of the base material of the vacuum pump. The product removal apparatus of the present disclosure includes: a sensor for measuring the temperature of the inside of a vacuum pump, the thickness of a film of a product in a flow path in the vacuum pump, or the vibration frequency of the vacuum pump; a gas supplier for supplying a gas containing hydrogen halide, fluorine, chlorine, chlorine trifluoride, or fluorine radicals to the vacuum pump; and a control device. The control device controls the gas supplier so that the supply of the gas to the vacuum pump is stopped depending on a rate of temperature increase calculated from the temperature measured by the sensor, the film thickness, or the vibration frequency.

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