公开(公告)号：US20240219175A1

公开(公告)日：2024-07-04

申请号：US18601648

申请日：2024-03-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yousuke IRIE ,  Hirotsugu INOUE ,  Koutaro SAKAMOTO

IPC: G01B21/08 ,  G01J5/00 ,  G01K3/04 ,  G01K3/06 ,  G01N25/72

CPC classification number: G01B21/085 ,  G01J5/0003 ,  G01N25/72 ,  G01J2005/0077 ,  G01K3/04 ,  G01K3/06

Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.

公开(公告)号：US20210364282A1

公开(公告)日：2021-11-25

申请号：US17395867

申请日：2021-08-06

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yousuke IRIE ,  Hirotsugu INOUE ,  Koutaro SAKAMOTO

IPC: G01B21/08 ,  G01J5/00 ,  G01N25/72

Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.