公开(公告)号：US08948495B2

公开(公告)日：2015-02-03

申请号：US13783291

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Gino Marcuccilli ,  Amir Widmann ,  Ellis Chang ,  John Robinson ,  Allen Park

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.

Abstract translation: 提供了检查晶片和/或预测在晶片上形成的器件的一个或多个特性的方法。 一种方法包括获取用于多个印刷在晶片上的图像，每个图像通过在晶片上执行双重图案化平版印刷工艺而被印刷，并且包括两个或更多个以双重图案化平版印刷工艺的覆盖的标称值印刷的模具，以及一个或 更多地以覆盖层的调制值打印; 将以标称值印刷的多个印模获得的图像与以调制值印刷的多个印模获得的图像进行比较; 并且基于比较步骤的结果检测以调制值印刷的多个印模中的缺陷。

公开(公告)号：US10649447B2

公开(公告)日：2020-05-12

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: H01L21/66 ,  G06F19/00 ,  G05B21/02 ,  H01L21/67 ,  G03F7/20

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

公开(公告)号：US20140037187A1

公开(公告)日：2014-02-06

申请号：US13783291

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Gino Marcuccilli ,  Amir Widmann ,  Ellis Chang ,  John Robinson ,  Allen Park

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.

Abstract translation: 提供了检查晶片和/或预测在晶片上形成的器件的一个或多个特性的方法。 一种方法包括获取用于多个印刷在晶片上的图像，每个图像通过在晶片上执行双重图案化平版印刷工艺而被印刷，并且包括两个或更多个以双重图案化平版印刷工艺的覆盖的标称值印刷的模具，以及一个或 更多地以覆盖层的调制值打印; 将以标称值印刷的多个印模获得的图像与以调制值印刷的多个印模获得的图像进行比较; 并且基于比较步骤的结果检测以调制值印刷的多个印模中的缺陷。

公开(公告)号：US20160290796A1

公开(公告)日：2016-10-06

申请号：US15090389

申请日：2016-04-04

Applicant: KLA-Tencor Corporation

Inventor： Ady Levy ,  Daniel Kandel ,  Michael E. Adel ,  Leonid Poslavsky ,  John Robinson ,  Tal Marciano ,  Barak Bringoltz ,  Tzahi Grunzweig ,  Dana Klein ,  Tal Itzkovich ,  Nadav Carmel ,  Nuriel Amir ,  Vidya Ramanathan ,  Janay Camp ,  Mark Wagner

IPC: G01B11/27 ,  G01N21/21

CPC classification number: G01B11/272 ,  G01N21/211 ,  G01N21/31 ,  G01N21/41 ,  G01N21/4738 ,  G01N21/4788 ,  G01N21/6489 ,  G01N21/9501 ,  G01N2021/213 ,  G03F7/705 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70616

Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.

Abstract translation: 计量性能分析系统包括包括一个或多个检测器的计量工具和通信地耦合到所述一个或多个检测器的控制器。 所述控制器被配置为从所述计量工具接收与度量目标相关联的一个或多个度量数据集，其中所述一个或多个测量数据集包括一个或多个测量的度量度量，并且所述一个或多个测量的度量度量指示与标称值的偏差 。 控制器还被配置为确定与标称值和一个或多个所选择的半导体工艺变化的偏差之间的关系，并且基于一个或多个测量值的值之间的关系确定偏离标称值的一个或多个根本原因 度量和一个或多个所选择的半导体工艺变化。

公开(公告)号：US09903711B2

公开(公告)日：2018-02-27

申请号：US15090389

申请日：2016-04-04

Applicant: KLA-Tencor Corporation

Inventor： Ady Levy ,  Daniel Kandel ,  Michael E. Adel ,  Leonid Poslavsky ,  John Robinson ,  Tal Marciano ,  Barak Bringoltz ,  Tzahi Grunzweig ,  Dana Klein ,  Tal Itzkovich ,  Nadav Carmel ,  Nuriel Amir ,  Vidya Ramanathan ,  Janay Camp ,  Mark Wagner

IPC: G01B11/14 ,  G01B11/27 ,  G01N21/95 ,  G03F7/20 ,  G01N21/21 ,  G01N21/31 ,  G01N21/41 ,  G01N21/47 ,  G01N21/64

CPC classification number: G01B11/272 ,  G01N21/211 ,  G01N21/31 ,  G01N21/41 ,  G01N21/4738 ,  G01N21/4788 ,  G01N21/6489 ,  G01N21/9501 ,  G01N2021/213 ,  G03F7/705 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70616

Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.

公开(公告)号：US20170255188A1

公开(公告)日：2017-09-07

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: G05B21/02 ,  G03F7/20

CPC classification number: G05B21/02 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633 ,  H01L21/67288

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.