公开(公告)号：US10649447B2

公开(公告)日：2020-05-12

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: H01L21/66 ,  G06F19/00 ,  G05B21/02 ,  H01L21/67 ,  G03F7/20

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

公开(公告)号：US10303835B2

公开(公告)日：2019-05-28

申请号：US14710201

申请日：2015-05-12

Applicant: KLA-TENCOR CORPORATION

Inventor： Eran Amit ,  Raviv Yohanan ,  Tal Itzkovich ,  Nuriel Amir ,  Roie Volkovich ,  Dongsub Choi

IPC: B32B3/10 ,  G06F17/50 ,  G01N21/93 ,  G01N21/956 ,  H01L21/3105 ,  H01L21/311 ,  G03F7/00

Abstract: Target designs methods and targets are provided, in which at least some of the differentiation between target elements and their background is carried out by segmenting either of them. Directed self-assembly (DSA) processes are used to generate fine segmentation, and various characteristics of the polymer lines and their guiding lines are used to differentiate target elements from their background. Target designs and design principles are disclosed in relation to the DSA process, as well as optimization of the DSA process to yield high metrology measurement accuracy in face of production inaccuracies. Furthermore, designs and methods are provided for enhancing and using ordered regions of a DSA-produced polymer surface as target elements and as hard masks for production processes. The targets and methods may be configured to enable metrology measurements using polarized light to distinguish target elements or DSA features.

公开(公告)号：US20170255188A1

公开(公告)日：2017-09-07

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: G05B21/02 ,  G03F7/20

CPC classification number: G05B21/02 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633 ,  H01L21/67288

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.