公开(公告)号：US11562289B2

公开(公告)日：2023-01-24

申请号：US16287523

申请日：2019-02-27

Applicant: KLA-Tencor Corporation

Inventor： Song Wu ,  Yin Xu ,  Andrei V. Shchegrov ,  Lie-Quan Lee ,  Pablo Rovira ,  Jonathan Madsen

IPC: G06N20/00 ,  G01Q30/04 ,  H01J37/26 ,  G01N21/95 ,  G01N23/201 ,  G03F7/20

Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.

公开(公告)号：US08860937B1

公开(公告)日：2014-10-14

申请号：US13743304

申请日：2013-01-16

Applicant: KLA-Tencor Corporation

Inventor： Thaddeus Gerard Dziura ,  Xuefeng Liu ,  David Y. Wang ,  Jonathan Madsen ,  Alexander Kuznetsov ,  Johannes D. de Veer ,  Shankar Krishnan ,  Derrick Shaughnessy ,  Andrei Shchegrov

IPC: G01N21/00 ,  G01N21/47

CPC classification number: G01N21/47 ,  G01B2210/56 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various metrology systems and methods for high aspect ratio and large lateral dimension structures are provided. One method includes directing light to one or more structures formed on a wafer. The light includes ultraviolet light, visible light, and infrared light. The one or more structures include at least one high aspect ratio structure or at least one large lateral dimension structure. The method also includes generating output responsive to light from the one or more structures due to the light directed to the one or more structures. In addition, the method includes determining one or more characteristics of the one or more structures using the output.

Abstract translation: 提供了用于高纵横比和大横向尺寸结构的各种计量系统和方法。 一种方法包括将光引导到在晶片上形成的一个或多个结构。 该光包括紫外光，可见光和红外光。 一个或多个结构包括至少一个高纵横比结构或至少一个大的横向尺寸结构。 该方法还包括响应于来自一个或多个结构的光而产生输出，这是由于指向一个或多个结构的光。 另外，该方法包括使用该输出确定一个或多个结构的一个或多个特性。

公开(公告)号：US20200184372A1

公开(公告)日：2020-06-11

申请号：US16287523

申请日：2019-02-27

Applicant: KLA-Tencor Corporation

Inventor： Song Wu ,  Yin Xu ,  Andrei V. Shchegrov ,  Lie-Quan Lee ,  Pablo Rovira ,  Jonathan Madsen

IPC: G06N20/00 ,  G01Q30/04 ,  H01J37/26 ,  G01N23/201 ,  G01N21/95

Abstract: A metrology system is disclosed. In one embodiment, the metrology system includes a controller communicatively coupled to a reference metrology tool and an optical metrology tool, the controller including one or more processors configured to: generate a geometric model for determining a profile of a test HAR structure from metrology data from a reference metrology tool; generate a material model for determining one or more material parameters of a test HAR structure from metrology data from the optical metrology tool; form a composite model from the geometric model and the material model; measure at least one additional test HAR structure with the optical metrology tool; and determine a profile of the at least one additional test HAR structure based on the composite model and metrology data from the optical metrology tool associated with the at least one HAR test structure.