知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.064 seconds)

    Reducing directional stress in an orthotropic encapsulation member of an electronic package
    11.
    发明授权
    Reducing directional stress in an orthotropic encapsulation member of an electronic package 有权
    减少电子封装的正交各向异性包封件中的方向应力

    公开(公告)号：US09583408B1

    公开(公告)日：2017-02-28

    申请号：US14832156

    申请日：2015-08-21

    Applicant: International Business Machines Corporation

    Inventor： Marcus E. Interrante ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC: H01L23/48 ,  H01L23/52 ,  H01L23/34 ,  H01L23/16 ,  H01L23/373 ,  H01L23/498 ,  H01L21/50 ,  H01L21/48

    CPC classification number: H01L23/16 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/562

    Abstract: Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

    Abstract translation: 用于减小电子封装的正交各向异性包封构件中的方向应力的方法和装置可包括将加强框架附接到载体上，加强框架包括中心开口以接纳半导体芯片和多个相对的侧壁，电连接半导体芯片 与所述载体同心地布置在所述中心开口内，并且使所述定向散热器与所述半导体芯片热接触，所述定向散热器从所述半导体芯片传递热量，其中所述定向散热器被成形为沿着所述相对双向器方向减小方向应力 。

    CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
    13.
    发明申请
    CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER 审中-公开

    公开(公告)号：US20180061732A1

    公开(公告)日：2018-03-01

    申请号：US15803345

    申请日：2017-11-03

    Applicant: International Business Machines Corporation

    Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC: H01L23/367 ,  H01L23/16 ,  H05K3/34 ,  H01L23/00

    Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Patent Agency Ranking