公开(公告)号：US10566215B2

公开(公告)日：2020-02-18

申请号：US15803365

申请日：2017-11-03

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/52 ,  H01L23/427 ,  H05K3/30 ,  H01L23/367 ,  H01L23/04 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498 ,  H01L23/16 ,  H01L23/40 ,  H01L23/00 ,  H05K3/34

Abstract: A method includes electrically connecting an IC chip module to a motherboard and thermally contacting a heat sink to the IC chip module. The IC chip module includes a carrier comprising a top surface and a bottom surface configured to be electrically connected to the motherboard. The IC chip module includes a stiffening frame attached to the carrier top surface. The stiffening frame includes a base portion that has a central opening and a plurality of opposing sidewalls. The IC chip module further includes a semiconductor chip electrically connected to the carrier top surface and concentrically arranged within the central opening. The IC chip module further includes a first directional heat spreader thermally contacting the semiconductor chip. The first directional heat spreader includes a directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.

公开(公告)号：US10090173B2

公开(公告)日：2018-10-02

申请号：US14732119

申请日：2015-06-05

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/52 ,  H01L23/367 ,  H01L23/04 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498 ,  H05K3/30 ,  H01L23/16 ,  H01L23/00 ,  H05K3/34

Abstract: A method of fabricating a chip module is presented. The chip module includes a stiffening frame, a directional heat spreader, a carrier, and a semiconductor chip. The stiffening frame is attached to the carrier. The stiffening frame includes a base portion with a central opening to accept a semiconductor chip and a first pair of opposing sidewalls. The semiconductor chip is electronically coupled to the carrier concentrically arranged within the central opening. A first directional heat spreader is thermally coupled to the semiconductor chip. The first directional heat spreader includes directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls.

公开(公告)号：US20180277396A1

公开(公告)日：2018-09-27

申请号：US15996030

申请日：2018-06-01

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/52 ,  H01L23/16 ,  H01L23/367 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498 ,  H05K3/30 ,  H01L23/04 ,  H01L23/00 ,  H05K3/34

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

公开(公告)号：US10892170B2

公开(公告)日：2021-01-12

申请号：US15996030

申请日：2018-06-01

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L21/52 ,  H05K3/30 ,  H01L23/367 ,  H01L23/04 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498 ,  H01L23/16 ,  H01L23/40 ,  H01L23/427 ,  H01L23/00 ,  H05K3/34

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader. The second directional heat spreader transfers heat from the first directional heat spreader towards the second pair of opposing sidewalls.

公开(公告)号：US10424494B2

公开(公告)日：2019-09-24

申请号：US15803345

申请日：2017-11-03

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H01L23/16 ,  H05K3/34 ,  H01L23/00 ,  H01L21/52 ,  H01L23/04 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498 ,  H05K3/30

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

公开(公告)号：US20150373879A1

公开(公告)日：2015-12-24

申请号：US14837742

申请日：2015-08-27

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H05K7/20

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371919A1

公开(公告)日：2015-12-24

申请号：US14838524

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371918A1

公开(公告)日：2015-12-24

申请号：US14837871

申请日：2015-08-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371917A1

公开(公告)日：2015-12-24

申请号：US14837491

申请日：2015-08-27

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract translation: 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽

公开(公告)号：US20180061733A1

公开(公告)日：2018-03-01

申请号：US15803365

申请日：2017-11-03

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H01L23/16 ,  H05K3/34 ,  H01L23/00

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.