公开(公告)号：US20140284040A1

公开(公告)日：2014-09-25

申请号：US13848960

申请日：2013-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/373

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract translation: 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽

公开(公告)号：US20150373880A1

公开(公告)日：2015-12-24

申请号：US14838418

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H05K7/20

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US09437515B2

公开(公告)日：2016-09-06

申请号：US14838524

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H01L23/34 ,  H01L23/373 ,  H01L23/36 ,  H05K7/20 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract translation: 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽

公开(公告)号：US20150371922A1

公开(公告)日：2015-12-24

申请号：US14838461

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/373

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US11825592B2

公开(公告)日：2023-11-21

申请号：US17062926

申请日：2020-10-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kamal K. Sikka ,  Chenzhou Lian ,  Kathryn C. Rivera ,  Paul F. Bodenweber ,  Jon A. Casey

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20127 ,  Y10T29/49002

Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

公开(公告)号：US10834808B2

公开(公告)日：2020-11-10

申请号：US14867413

申请日：2015-09-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. Bodenweber ,  Jon A. Casey ,  Chenzhou Lian ,  Kathryn C. Rivera ,  Kamal K. Sikka

IPC: H05K1/02 ,  H05K7/20

Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

公开(公告)号：US20150373879A1

公开(公告)日：2015-12-24

申请号：US14837742

申请日：2015-08-27

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H05K7/20

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371919A1

公开(公告)日：2015-12-24

申请号：US14838524

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371918A1

公开(公告)日：2015-12-24

申请号：US14837871

申请日：2015-08-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US20150371917A1

公开(公告)日：2015-12-24

申请号：US14837491

申请日：2015-08-27

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract translation: 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽