A method of fabricating a chip module is presented. The chip module includes a stiffening frame, a directional heat spreader, a carrier, and a semiconductor chip. The stiffening frame is attached to the carrier. The stiffening frame includes a base portion with a central opening to accept a semiconductor chip and a first pair of opposing sidewalls. The semiconductor chip is electronically coupled to the carrier concentrically arranged within the central opening. A first directional heat spreader is thermally coupled to the semiconductor chip. The first directional heat spreader includes directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls.