知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

13 records (took 0.038 seconds)

    Reducing directional stress in an orthotropic encapsulation member of an electronic package
    4.
    发明授权
    Reducing directional stress in an orthotropic encapsulation member of an electronic package 有权
    减少电子封装的正交各向异性包封件中的方向应力

    公开(公告)号：US09583408B1

    公开(公告)日：2017-02-28

    申请号：US14832156

    申请日：2015-08-21

    Applicant: International Business Machines Corporation

    Inventor： Marcus E. Interrante ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC: H01L23/48 ,  H01L23/52 ,  H01L23/34 ,  H01L23/16 ,  H01L23/373 ,  H01L23/498 ,  H01L21/50 ,  H01L21/48

    CPC classification number: H01L23/16 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/562

    Abstract: Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

    Abstract translation: 用于减小电子封装的正交各向异性包封构件中的方向应力的方法和装置可包括将加强框架附接到载体上，加强框架包括中心开口以接纳半导体芯片和多个相对的侧壁，电连接半导体芯片 与所述载体同心地布置在所述中心开口内，并且使所述定向散热器与所述半导体芯片热接触，所述定向散热器从所述半导体芯片传递热量，其中所述定向散热器被成形为沿着所述相对双向器方向减小方向应力 。

    Multi integrated circuit chip carrier package
    6.
    发明授权
    Multi integrated circuit chip carrier package 有权

    公开(公告)号：US10978314B2

    公开(公告)日：2021-04-13

    申请号：US16592480

    申请日：2019-10-03

    Applicant: International Business Machines Corporation

    Inventor： Marcus E. Interrante ,  Kathryn R. Lange ,  Kamal K. Sikka ,  Tuhin Sinha ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC: H01L21/52 ,  H01L23/36 ,  H01L23/32

    Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.

    Multi integrated circuit chip carrier package
    7.
    发明授权
    Multi integrated circuit chip carrier package 有权

    公开(公告)号：US10541156B1

    公开(公告)日：2020-01-21

    申请号：US16176167

    申请日：2018-10-31

    Applicant: International Business Machines Corporation

    Inventor： Marcus E. Interrante ,  Kathryn R. Lange ,  Kamal K. Sikka ,  Tuhin Sinha ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC: H01L21/52 ,  H01L23/32 ,  H01L23/36

    Abstract: A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.

Patent Agency Ranking